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Novel method for winding compensation in via through hole

A new type of wire winding technology, which is applied in the direction of electrical connection formation of printed components, electrical connection of printed components, printed circuit components, etc., can solve the problems of sacrificing layout and wiring space, limited space for parts and wiring, and occupying board space. Achieve the effect of optimizing board performance, reducing signal transmission delay, and improving space utilization

Active Publication Date: 2018-03-30
INSPUR SUZHOU INTELLIGENT TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] 1) A large amount of board space is occupied for winding compensation, which is not conducive to the layout and wiring of other parts and signals
[0006] 2) Sacrifice the layout and wiring space of other parts or signals, which will affect the overall performance of the board
[0007] Moreover, on a certain PCB board size, there are more and more functions to be realized, and the space for parts and wiring is becoming more and more limited. How to improve the space utilization of the board has become a key issue

Method used

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  • Novel method for winding compensation in via through hole
  • Novel method for winding compensation in via through hole
  • Novel method for winding compensation in via through hole

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] like figure 2 As shown, it is an ordinary via hole on the PCB, the inner ring is a drill hole, and the black circle means that the copper ring runs through the PCB board up and down, and has conductive properties.

[0031] like image 3 , 4 As shown, a new type of via hole compensation method, in the design of the PCB board, using the via hole through the upper and lower sides of the PCB board, the wire is routed up and down the hole wall for winding compensation, reducing the board surface The winding space, so as to achieve the purpose of improving the utilization rate of the board and optimizing the performance of the board.

Embodiment 2

[0033] On the basis of embodiment 1, the implementation steps of the method described in this embodiment include:

[0034] Select the signal via hole that needs winding compensation, and perform up and down winding in the through hole;

[0035] During the production of the PCB board factory, the copper wires wound up and down in the via holes are corroded and developed.

Embodiment 3

[0037] On the basis of embodiment 1 or 2, the implementation steps of the method described in this embodiment also include:

[0038] Fill the via hole with resin to protect the copper wire in the hole.

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Abstract

The invention discloses a novel method for winding compensation in a via through hole. In design of a printed circuit board (PCB) card, winding compensation is performed by vertical wiring on a hole wall of the via through hole vertically penetrating through a PCB. The via through hole vertically penetrating through the PCB is utilized, signal winding compensation is performed in the via through hole, signal transmission delay on the PCB is reduced, meanwhile, the space utilization of a PCB panel is improved, and the board card performance is optimized.

Description

technical field [0001] The invention relates to the technical field of server board design, in particular to a novel compensation method for winding wires in via through holes. Background technique [0002] With the rapid development of the server industry, the performance of server boards is increasing. In order to improve the reliability of server products, the industry has higher and higher requirements for signals in PCB boards. [0003] In order to reduce the transmission delay of the signal on the PCB board and improve the transmission quality of the signal, it usually takes up a lot of space on the board to perform winding compensation to achieve signal length matching (such as figure 1 ). [0004] However, the method of winding compensation will bring the following disadvantages: [0005] 1) A large amount of board space is occupied for winding compensation, which is not conducive to the layout and wiring of other parts and signals. [0006] 2) Sacrificing the la...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/11H05K3/40
CPCH05K1/11H05K3/4038H05K2201/09281
Inventor 王英娜
Owner INSPUR SUZHOU INTELLIGENT TECH CO LTD
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