Multilayer interconnection packaging structure of silica-based embedded microwave multi chip module and manufacturing method

Abstract

The invention provides a multilayer interconnection packaging structure of an embedded microwave multi chip with a silicon chip as a substrate and a manufacturing method. The invention is characterized by utilizing the low-cost silicone chip as the chip embedded substrate and using wire bonding and ball mounting technology to prepare gold bumps, realizing short-distance interconnection between microwave chips, using a low-k liquid or colloidal polymer as a dielectric layer, realizing the multilayer interconnection structure of a metal / organic polymer by combining wafer level processing technics such as photoetching, electroplating, chemical mechanical polishing and the like and realizing system integration of active and passive devices. The whole packaging structure has higher packaging integration and lower high-frequency transmission loss. The structure can effectively integrate varied function device units, reduce the interconnection loss among the devices and improve the properties of the whole module while improving the density and integration of packaging and reducing the cost of packaging.

Description

technical field [0001] The invention relates to a microwave multi-chip module (Microwave Multi Chip Module, abbreviated as MMCM) silicon-based embedded packaging structure realized by multilayer interconnection technology, which belongs to the field of microwave device packaging. Background technique [0002] Multi-chip module (Multi Chip Module, abbreviated as MCM), refers to the integration of multiple bare or / and packaged integrated circuit chips and single or multiple passive components, such as resistors, capacitors, inductors, etc., into a multilayer A technology that forms a system or functional module on a high-density substrate. [0003] MCM adopts the method of directly mounting and connecting the bare chip to the substrate. The interconnection distance between the chips is short, which reduces the inductance and impedance of the interconnection line, thus reducing the transmission delay time of the signal while increasing the assembly density. , to increase the t...

AI Technical Summary

Problems solved by technology

Then, a ground shielding layer is prepared on the silicon substrate with an embedded cavity. This method effectively isolates the chip electromagnetically and solves the defect of large loss of microwave chips in the application of silicon substrates.

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