32 results about "Microwave chips" patented technology

The invention discloses a welding device and method for a microwave chip packaging device, relates to the technical field of microwave chip welding, and aims to solve the technical problem that the quality of a welding point is affected as the temperature of the bottom of a circuit board is inconsistent with that of the top of the circuit board due to the fact that the circuit board is easily affected by the temperature of a conveying track. The reflow soldering furnace body comprises a conveying mechanism, the conveying mechanism comprises a conveying belt, a fixed side plate is arranged on the side of the conveying belt, multiple sets of device bearing frames are arranged on the conveying belt, a forward guide plate and a reverse guide plate are arranged on the side wall of the fixed side plate, and each set of device bearing frame is composed of a front frame and a rear frame. The front frame comprises a first lifting positioning frame and a plurality of clamping assemblies. The device has the advantages that it can be guaranteed that the position of the circuit board in the reflow soldering furnace is stable, the circuit board body is lifted and kept above the conveying belt, it is guaranteed that all angles of the circuit board body are evenly heated, and the soldering quality is improved.

The invention belongs to the technical field of chip module testing, and particularly relates to a microwave chip module testing clamp device. A base; the base is arranged at one end fixedly connected to the top of the base; the two sets of limiting mechanisms are arranged on the top of the base and used for fixing the microwave chip module, and the base is electrically connected with the microwave chip module; the heat dissipation mechanism is arranged in the base; by arranging the heat dissipation mechanism, in the power-on test process, the temperature sensor detects that the temperature of the bottom of the chip module is higher than a certain threshold value, a temperature signal is transmitted to the system through the temperature sensor, the system controls a circulating water pump and a fan to be started, and cooling liquid in a cooling box is circularly conveyed into a cooling pipe through the circulating water pump; and then cold air is blown to the microwave chip module through the exhaust holes by the fan for cooling and heat dissipation of the microwave chip module, so that the function of rapid cooling and heat dissipation of the microwave chip module is realized.

The application discloses a microwave chip testing tool, relates to the technical field of microwave chip testing, and aims to solve the technical problem of insufficient function of clamping equipment in the microwave chip testing tool, and comprises a testing machine table; a conveying assembly is arranged on the testing machine table; a basic transfer assembly is arranged on the testing machine table and is located opposite an output end of the conveying assembly; a plurality of auxiliary tables for energizing operation of microwave chips are arranged below the basic transfer assembly; and a clamping assembly for stable and limited positioning of the microwave chip testing operation is arranged on the side of the auxiliary table. Based on the adjustment and setting of the clamping assembly, the clamping assembly has two different clamping modes, i.e., a flexible clamping state and an elastic retaining state, the two different clamping modes are used to simulate the different thermal expansion coefficients of gallium arsenide and gallium nitride microwave chips in the energizing test, and the functionality of the operation is effectively improved.

The invention discloses automatic feeding and discharging equipment for microwave chip production, relates to the technical field of feeding and discharging, and aims to solve the technical problems that tiny dust particles are easily generated when parts in a mechanical arm move, and the dust particles easily cause short circuit, open circuit or reduction of insulation performance of chips. A wafer grabbing assembly is arranged at the executing end of the mechanical arm body and composed of a vacuum suction cup assembly, an outer-layer air curtain dust blocking assembly, an inner-layer cyclone dust cleaning assembly, a dust suction assembly and a functional column, the top of the vacuum suction cup assembly is connected with the executing end of the mechanical arm body through the functional column, and the outer-layer air curtain dust blocking assembly is arranged above the vacuum suction cup assembly. The inner-layer cyclone dust cleaning assembly is arranged at the bottom of the vacuum suction cup assembly, and the dust suction assembly is arranged above the outer-layer air curtain dust blocking assembly. The vacuum chuck assembly has the advantages that the double-layer protection effect is achieved through double-layer airflow, and the cleanliness of the environment below the vacuum chuck assembly is greatly improved.

The invention discloses a microwave chip wafer conveying carrier fastening device, relates to the technical field of chip wafer conveying, and aims to solve the technical problem that the microwave chip wafer conveying carrier fastening device is single in function, the microwave chip wafer conveying carrier fastening device comprises a crown block body and a wafer box body, and the wafer box body comprises a shell, a placing mechanism, a friction mechanism and a rotating mechanism. According to the microwave chip wafer placing device, the placing mechanism is arranged, so that a plurality of placing bottom plates located on the same plane form a microwave chip wafer placing cavity, and the size of the microwave chip wafer placing cavity is changed by rotating a rotating disc to change the gap positions of a plurality of sliding columns so as to place microwave chip wafers of different sizes; the vertical shaft is rotated to enable the pressing plates to descend to press and limit the microwave chip wafer, the microwave chip wafer is prevented from being collided and damaged in the transferring process, functionality is high, and the technical problem that a microwave chip wafer conveying carrier fastening device is single in function is solved.

The present invention relates to a radar module configured for factory monitoring and comprising a microwave chip including a radar signal source and a coupler connected to the radar signal source and coupling the radar signal generated by the radar signal source into a waveguide or an antenna.

The invention relates to a microwave module comprising a microwave chip comprising a substrate, an active layer on a first face of the chip, an electrical ground layer on a second face opposite the first face, the active layer comprising microstrip guide transmission lines; a housing encapsulating the microwave chip, said housing comprising a redistribution layer covering the active layer of the microwave chip and comprising electrical connection traces for a connection between the active layer and an electrical interface of the microwave module; the active layer comprising at least one transistor, one or more of the electrical traces of the redistribution layer, referred to as ground traces, connecting a source electrode of the transistor to one or more of the electrical interfaces, referred to as ground interfaces, the one or more ground interfaces being configured to be connected to a ground of a circuit board.

A radar module configured for factory monitoring includes a microwave chip having a radar signal source, a coupling element, and a resonant chamber, wherein the coupling element protrudes into the resonant chamber.

The invention relates to the technical field of chip testing, and particularly discloses an efficient heat dissipation microwave chip testing clamp which comprises a bearing frame and a protective cover rotationally connected to the bearing frame, a testing groove is formed in the protective cover, and a bearing table used for placing a chip is vertically and slidably connected to the interior of the bearing frame. The interior of the bearing frame is slidably connected with a clamping piece used for clamping a chip. A power mechanism used for driving the bearing table to vertically slide is further arranged in the bearing frame, the power mechanism is in transmission connection with the clamping piece, and the protective cover is connected with the power mechanism through a synchronous piece. A driving source does not need to be independently arranged to drive the clamping piece to move, passive implementation is achieved in the stroke of upward movement of the bearing table, energy and energy consumption can be saved, meanwhile, use of a control system can be reduced, and the effect of controlling the cost can be achieved to a great extent; and meanwhile, later-stage overhaul and maintenance of the clamp can be facilitated, and the effect is excellent.

The present invention discloses a three-dimensional stacked shielding structure and a method for preparing the same. The shielding structure includes a first chip and a second chip, each having two rows of oppositely arranged radio frequency ground pads and signal transmission pads disposed peripherally thereon. The signal transmission pads of the first chip are bonded with signal transmission double-layer gold-based stud bumps. The two rows of oppositely arranged radio frequency ground pads on the first chip are sequentially interconnected by shielding gold wires. The shielding gold wires are bonded with single-layer stud bumps at their bonding points with the radio frequency ground pads. The single-layer stud bumps and the bonding points combine to form grounded double-layer gold-based stud bumps. The second chip is flip-chip mounted on a combination of the first chip, the signal transmission double-layer gold-based stud bumps, and the grounded double-layer gold-based stud bumps to form a three-dimensional stacked structure. The present invention can solve the problem of electromagnetic interference between upper and lower layers caused by insufficient air cavity height in a three-dimensional stacked structure of microwave chips.

The invention belongs to the field of terahertz test systems, and provides a fully-integrated spread spectrum module for spreading a vector network analyzer to a W wave band, which is used for spreading the test frequency of a four-port vector network analyzer capable of outputting 12.5-18.4 GHz to the W wave band (75-110 GHz) and solving the problems of large volume, heavy weight, difficulty in carrying, high production cost and the like of the existing spread spectrum module. According to the invention, a W-band bi-directional coupler, a W-band orthogonal mode coupler, a W-band waveguide power divider, a plurality of microwave chip probes, a plurality of 50 ohm transmission lines, a microwave frequency doubling chip, a microwave frequency mixing chip, a W-band power amplification chip, a chip capacitor, a power supply shifting bead, a wave absorbing material, a DC-DC power supply board and other key parts are fully integrated. The size of the spread spectrum module is greatly reduced, the weight is reduced, and the comprehensive production cost is reduced.

The invention relates to the technical field of microwave circuit resonance suppression, in particular to a microwave circuit, a packaging method, a resonance suppression chip preparation method, equipment and a medium, and the microwave circuit resistant to cavity resonance comprises a microwave chip, a resonance suppression chip and a plurality of first bonding devices; the first surface of the microwave chip and the second surface of the resonance suppression chip are respectively provided with a plurality of first bonding pads, and when the microwave chip and the resonance suppression chip are packaged, the first surface of the microwave chip is a surface close to a packaging cover plate; the resonance suppression chip is arranged on one side of the first surface of the microwave chip, and the first bonding pad of the microwave chip is bonded with the first bonding pad of the resonance suppression chip through the first bonding device, so that a resonance suppression material is prevented from being pasted, and the resonance suppression efficiency is improved on the premise that the original electrical performance of the microwave chip is ensured. The cavity interference resistance and environmental applicability are improved, and the device has the advantages of being high in integration level, small in size and simple in process and has wide application prospects.

The utility model relates to a multi-port microwave test tool, which comprises a support seat, a continuous feeding turntable supported on the support seat through a first lifting column, and a tester module suspended above the continuous feeding turntable supported on the support seat through a second lifting mechanism, the second lifting mechanism can be used for adjusting the working height of the tester module; detection clamping assemblies capable of adjustably positioning and clamping a plurality of microwave chips are annularly embedded in the top surface of the continuous feeding turntable at intervals. And a plurality of single testers of the tester module are arranged on a working surface limited by the second lifting mechanism in a manner that the single testers and the detection chips which are annularly positioned at intervals by the detection clamping assembly are arranged at the same interval. According to the utility model, various parameter tests can be continuously carried out on the microwave chip, so that the comprehensive detection effect is improved, and meanwhile, the labor cost and time cost for manually switching test instruments are reduced through cyclic continuous conveying.

The application provides an ultra-thin airborne active phased array weather radar antenna architecture for X-band airborne weather detection, which comprises a metal integral bearing frame for bearing the whole antenna, a microwave multilayer printed circuit board fixed on one side of the metal integral bearing frame, a plurality of microwave chips fixed on the microwave multilayer printed circuit board and a metal shielding cover plate arranged on the other side of the metal integral bearing frame, wherein the metal integral bearing frame is provided with a plurality of chamfered rectangular frames, each chamfered rectangular frame corresponds to one microwave chip, and the positions of the microwave chips on the microwave multilayer printed circuit board are periodically arranged. The antenna architecture integrates the bearing structure, the feed network and the radio frequency receiving and transmitting channel of the phased array system, realizes the reduction of the overall thickness and weight, and makes the thickness reduced by more than 1 / 3; and a multifunctional heat dissipation shielding cover plate is used to conduct the heat of the radio frequency chips to the upper part of the chips, so that the natural convection heat dissipation is realized.

The invention belongs to the technical field of data communication, and particularly relates to a multichannel dielectric signal heterogeneous integration module integrating a TEC and a silicon photoswitch, which comprises a ceramic substrate, a silicon substrate and a packaging substrate, and a packaging shell is arranged on the packaging substrate; a radio frequency microwave chip is arranged on the ceramic substrate, an analog / digital conversion chip, a power supply management chip, a signal control chip, a laser chip and a silicon optical chip are arranged on the silicon substrate, and semiconductor chilling plates are arranged on opposite surfaces of the ceramic substrate and the silicon substrate; an optical fiber connected with the silicon optical chip to achieve digital optical signal output / input penetrates through the packaging shell, and a solder ball array electrically connected with the outside to achieve input of a power signal and a control signal and output / input of a radio frequency signal is arranged on the packaging substrate. According to the invention, the size is obviously reduced, interconnection loss is reduced, and reliability is improved.

The invention discloses a circularly polarized packaged antenna based on a silicon-based process. The circularly polarized packaged antenna comprises a first silicon-based dielectric layer, a second silicon-based dielectric layer, a third silicon-based dielectric layer, a fourth silicon-based dielectric layer and a fifth silicon-based dielectric layer which are stacked, the parasitic radiator is arranged on the surface of one side, deviating from the second silicon-based dielectric layer, of the first silicon-based layer; the main radiator is arranged between the first silicon-based dielectric layer and the second silicon-based dielectric layer; the antenna feed structure comprises a slot coupling floor layer, a probe and a metalized via hole, the microwave chip is arranged on the side, away from the fourth silicon-based dielectric layer, of the fifth silicon-based dielectric layer, and the microwave chip is connected to the probe through a metalized via hole in a gold wire bonding mode. According to the circularly polarized packaged antenna based on the silicon-based technology, compared with a common substrate, the dielectric substrate used in the millimeter wave frequency band has higher relative dielectric constant and physical limitation of packaging material selection.

This invention discloses a comprehensive microwave chip wafer-level performance testing device and method, belonging to the field of microwave chip testing technology. The device includes a signal source, receiver, coupler, circulator, switch, matching unit, chuck, etc., forming a specialized comprehensive microwave chip wafer-level performance testing system. The testing method includes comprehensive measurements of scattering parameters and derived coefficients, distortion parameters, power parameters, spectral parameters, pulse parameters, noise parameters, and nonlinear parameters. This invention effectively improves testing accuracy and speed, thus solving the challenge of high-precision and high-efficiency testing of microwave chips. A single testing device can fully evaluate testing capabilities, significantly reducing construction costs.

The invention discloses a microwave chip screening and testing device and method, relates to the technical field of chip screening, and aims to solve the technical problem that existing microwave chip screening accuracy is not high enough. A chip detection mechanism, a pitch changing mechanism, a dust particle raising and sucking mechanism and a vacuum suction cup are arranged on the Z-axis moving mechanism, and a plurality of double-state channel assemblies are made to synchronously form a wind-benefiting particle raising state or a concentrated back-sucking state through a switching assembly, a connecting rod assembly and a linkage assembly of the dust particle raising and sucking mechanism. Tiny dust stubborn on the surface of the chip can be thoroughly blown and scattered in a wind particle raising state, so that the dust is ensured to be separated from the surface of the chip; according to the chip cleaning device, the chip cleaning device can be used for cleaning the chip in a centralized back-suction state during air suction and rapidly collecting raised dust in a centralized manner, so that secondary pollution is avoided, the cleanliness of the chip is guaranteed, good basic conditions are provided for subsequent processing, packaging and other procedures of the chip, and the overall product quality is improved.

The present invention discloses a fixture for electroplating compound semiconductor microwave chips, which relates to the field of electroplating technology. A fixture for electroplating compound semiconductor microwave chips comprises a base plate, wherein lifting devices are provided on both sides of the top of the base plate, a connecting rod is fixedly connected to one side of the lifting device, a cross bar is fixedly connected to the bottom of the connecting rod, a fixture is provided in the middle of the cross bar, and the fixture comprises a limit frame, an action rod is movably connected to the inner wall of the two ends of the limit frame, one end of the action rod is fixedly connected to a clamp, and one end of the return spring is fixedly connected to one side of the clamp. The present invention enables the chip to be immersed in the electrolyte through the lifting device chip by setting the limiting part and the clamp. When adding additives or conductive materials such as copper in the hole during electroplating, the limit frame is limited by the limit rod to keep it highly stable and reduce errors.

The utility model provides a receiving and transmitting integrated microwave chip packaged with an isolator and a microwave detection module, wherein the microwave chip adopts a receiving and transmitting integrated design and uses the same antenna port as a transmitting port for outputting an excitation signal and a receiving port for accessing a feedback signal at the same time; based on the isolator packaged in the antenna, receiving and transmitting are integrated under high isolation, so that the antenna can be matched with an antenna adopting a receiving and transmitting integrated design. The layout of a feed line between the antenna and the microwave chip which adopt a transmit-receive integrated design is simplified, so that the cost advantage of the corresponding microwave detection module is guaranteed, and the miniaturization trend of a product is complied with; and the stability and the detection precision of the microwave detection module are ensured based on the receiving and transmitting integration of the microwave chip under relatively high isolation.

The invention discloses a microwave chip packaging structure, and relates to the technical field of microwave chip packaging, the microwave chip packaging structure comprises a packaging box body and a microwave chip body, the front end of the packaging box body is provided with an upper sealing door, and a lower sealing door installed on the packaging box body is arranged below the upper sealing door; two air inlet assemblies are arranged at the upper end of the packaging box body, a placement plate is fixedly connected to the inner wall of the packaging box body, the microwave chip body is arranged at the upper end of the placement plate, a clamping assembly is arranged on the outer side of the microwave chip body, a second filter plate is arranged above the placement plate, and a first filter plate is arranged above the second filter plate. The clamping device has the advantages that the driving motor is started, the output end of the driving motor drives the two-way lead screw to start to rotate, and at the moment, the first support and the second support can slide oppositely on the guide rod conveniently through guiding cooperation of the guide rod until the two sides of a microwave chip body are firmly clamped, and clamping and fixing of the two sides of the chip are completed.

The invention discloses a microwave chip testing tool, relates to the technical field of microwave chip testing, and aims to solve the technical problem that the microwave chip testing tool has insufficient functions for a clamping instrument. A conveying assembly is arranged on the testing machine table; a basic transfer assembly is arranged on the testing machine table opposite to the output end of the conveying assembly; a plurality of auxiliary carrying tables used for conducting power-on operation on the microwave chips are arranged below the basic transfer assembly. And a clamping assembly for stably limiting the test operation of the microwave chip is arranged on the side of the auxiliary carrying table. Based on the adjustment setting of the clamping assembly, the clamping assembly has two different clamping modes to form a flexible clamping state and an elastic maintaining state, different thermal expansion coefficients of gallium arsenide and gallium nitride microwave chips in a power-on test are simulated through the two different clamping modes, and the operation functionality is effectively improved.

The invention relates to a microwave module comprising a microwave chip comprising a substrate, an active layer comprising passive and active components on a first face of the chip, an electrical ground layer on a second face opposite the first face, the active layer comprising microstrip guide transmission lines; a package encapsulating the microwave chip, said package comprising a redistribution layer (RDL) covering the active layer of the microwave chip and comprising electrical connection traces for a connection between the active layer and electrical interfaces of the microwave module;the active layer comprising at least one ground terminal connected to the ground layer of the microwave chip, said ground terminal being connected to at least one of the electrical interfaces, called "ground interface", via at least one of the electrical connection traces, called "ground trace", said ground interface being configured to be connected to an electrical ground of an electronic card, said ground interface and said ground trace being opposite the active layer.;

This invention discloses a microwave chip packaging device welding equipment and method, relating to the field of microwave chip welding technology. It aims to solve the technical problem that circuit boards are easily affected by the temperature of the conveyor track itself, leading to inconsistent temperatures between the bottom and top of the circuit board, thus affecting the quality of the solder joints. The equipment includes a reflow oven body, which comprises a conveyor mechanism. The conveyor mechanism includes a conveyor belt, with fixed side plates arranged on the sides of the conveyor belt. Multiple sets of device support frames are arranged on the conveyor belt. Forward and reverse guide plates are arranged on the sidewalls of the fixed side plates. Each set of device support frames consists of a front frame and a rear frame. The front frame includes a lifting and positioning frame and multiple clamping components. This invention has the advantages of ensuring a relatively stable position of the circuit board inside the reflow oven, raising the circuit board body and keeping it above the conveyor belt, ensuring uniform heating from all angles, and improving welding quality.

The invention relates to a photoelectric integrated component, in particular to an ultra-wideband radio frequency digital photoelectric integrated component and a signal transmission system. The ultra-wideband radio frequency digital optoelectronic integrated assembly comprises a radio frequency board, a digital board and a packaging substrate which are arranged in a stacked mode, the radio frequency board and the digital board are covered with a packaging shell, the packaging shell is arranged on the packaging substrate, and chips on the radio frequency board and the digital board are in signal connection with each other and are in signal connection with the packaging substrate; the radio frequency board is provided with a superheterodyne secondary frequency conversion radio frequency transceiving link built by a microwave chip; the digital board is provided with a digital / analog conversion chip, a digital chip and an optical chip; an optical fiber penetrates through the optical fiber outlet of the packaging shell and is coupled with the optical chip. The signal transmission system comprises the ultra-wideband radio frequency digital photoelectric integrated assembly, a TR assembly and an array antenna. While the ultra-wideband performance is maintained, the size is remarkably reduced, the interconnection loss is reduced, the reliability is improved, and a feasible technical path is provided for a multifunctional and miniaturized communication system in the future.

The present invention provides a microwave chip eutectic soldering platform and an eutectic soldering method, belonging to the technical field of chip packaging. The microwave chip eutectic soldering platform includes a housing, a heating platform, and a working platform; the top of the housing is open; the heating platform is arranged inside the housing and is used for electrically connecting with an external power supply; the working platform is arranged inside the housing, and the bottom surface thereof is attached to the top surface of the heating platform; a plurality of working areas are arranged on the top surface of the working platform, and the plurality of working areas are respectively used for placing metal carriers of different sizes; wherein, vacuum adsorption holes for communicating with a vacuum pump pipeline are respectively arranged in the plurality of working areas, the vacuum adsorption holes are used for adsorbing the metal carriers, and the aperture of the vacuum adsorption holes in each working area is proportional to the size of the placement surface of the metal carrier. The microwave chip eutectic soldering platform provided by the present invention is applicable to welding operations of different models of microwave chips. The present invention also provides an eutectic soldering method.

The application provides a microwave detection module for realizing transceiver separation by using a passive microstrip isolator, wherein the passive microstrip isolator can realize transceiver separation of an antenna designed by using a transceiver combination structure at a higher isolation degree, so as to match a microwave chip designed by using a transceiver separation structure, thereby ensuring cost advantages of the corresponding microwave detection module and a miniaturization trend of products based on matching between the antenna designed by using the transceiver combination structure and the microwave chip designed by using the transceiver separation structure, and ensuring stability and detection precision of the microwave detection module based on transceiver separation of the antenna at the higher isolation degree.

The utility model provides a microwave detection module using a Wilkinson power divider to realize receiving and transmitting separation, and the application of the Wilkinson power divider in the microwave detection module jumps from the traditional application of the Wilkinson power divider as a bidirectional power divider. Correspondingly, in the microwave detection module, in a passive device form, the antenna is arranged between an antenna adopting a transceiving integrated structure design and a microwave chip adopting a transceiving separation design, and transceiving separation of the antenna under relatively high isolation can be realized, so that the antenna is matched with the microwave chip; therefore, the cost advantage of the microwave detection module and the miniaturization trend of a product can be guaranteed based on the matching between the antenna adopting a receiving and transmitting integrated structure design and the microwave chip adopting a receiving and transmitting separated design; and the stability and the detection precision of the microwave detection module are ensured based on receiving and transmitting separation of the antenna under relatively high isolation.

The invention discloses an NV color center fiber magnetometer based on an integrated electronic chip, the NV color center fiber magnetometer comprises a circuit part and an optical path part, the circuit part comprises a microcontroller, a microwave chip, a digital radio frequency attenuator, a power amplifier, a constant current source and a multi-way switch power supply, the microcontroller is an STM32 microcontroller, the microcontroller controls the microwave chip to generate microwaves and adjust the output frequency, and the power amplifier is connected with the digital radio frequency attenuator. The power of the microwave is adjusted through the digital radio frequency attenuator, the microwave is amplified through the power amplifier, and the microcontroller controls the constant current source to control the laser output and adjust the laser intensity; the light path part comprises a laser, a dichroscope, an optical fiber coupler, a multimode optical fiber, a diamond sample, a microwave waveguide, a focusing lens and a photoelectric detector, and further comprises a bias magnetic field. The STM32 microcontroller controls the output of the microwave chip and the laser and performs data acquisition, so that the miniaturization of the circuit part of the optical fiber magnetometer is realized, and the production cost is greatly reduced.

The invention relates to a microwave module comprising a microwave chip comprising a substrate, an active layer on a first face of the chip, an electrical ground layer on a second face opposite the first face, the active layer comprising microstrip guide transmission lines; a package encapsulating the microwave chip, said package comprising a redistribution layer covering the active layer of the microwave chip and comprising electrical connection traces for a connection between the active layer and an electrical interface of the microwave module;said active layer comprising at least one transistor, one or more of the electrical traces of the redistribution layer, called ground traces, connecting a source electrode of the transistor to one or more of the electrical interfaces, called ground interfaces, said ground interface(s) being configured to be connected to a ground of an electronic card.;