11 results about "Microwave chips" patented technology

The application discloses a microwave chip testing tool, relates to the technical field of microwave chip testing, and aims to solve the technical problem of insufficient function of clamping equipment in the microwave chip testing tool, and comprises a testing machine table; a conveying assembly is arranged on the testing machine table; a basic transfer assembly is arranged on the testing machine table and is located opposite an output end of the conveying assembly; a plurality of auxiliary tables for energizing operation of microwave chips are arranged below the basic transfer assembly; and a clamping assembly for stable and limited positioning of the microwave chip testing operation is arranged on the side of the auxiliary table. Based on the adjustment and setting of the clamping assembly, the clamping assembly has two different clamping modes, i.e., a flexible clamping state and an elastic retaining state, the two different clamping modes are used to simulate the different thermal expansion coefficients of gallium arsenide and gallium nitride microwave chips in the energizing test, and the functionality of the operation is effectively improved.

The invention discloses automatic feeding and discharging equipment for microwave chip production, relates to the technical field of feeding and discharging, and aims to solve the technical problems that tiny dust particles are easily generated when parts in a mechanical arm move, and the dust particles easily cause short circuit, open circuit or reduction of insulation performance of chips. A wafer grabbing assembly is arranged at the executing end of the mechanical arm body and composed of a vacuum suction cup assembly, an outer-layer air curtain dust blocking assembly, an inner-layer cyclone dust cleaning assembly, a dust suction assembly and a functional column, the top of the vacuum suction cup assembly is connected with the executing end of the mechanical arm body through the functional column, and the outer-layer air curtain dust blocking assembly is arranged above the vacuum suction cup assembly. The inner-layer cyclone dust cleaning assembly is arranged at the bottom of the vacuum suction cup assembly, and the dust suction assembly is arranged above the outer-layer air curtain dust blocking assembly. The vacuum chuck assembly has the advantages that the double-layer protection effect is achieved through double-layer airflow, and the cleanliness of the environment below the vacuum chuck assembly is greatly improved.

The invention discloses a microwave chip wafer conveying carrier fastening device, relates to the technical field of chip wafer conveying, and aims to solve the technical problem that the microwave chip wafer conveying carrier fastening device is single in function, the microwave chip wafer conveying carrier fastening device comprises a crown block body and a wafer box body, and the wafer box body comprises a shell, a placing mechanism, a friction mechanism and a rotating mechanism. According to the microwave chip wafer placing device, the placing mechanism is arranged, so that a plurality of placing bottom plates located on the same plane form a microwave chip wafer placing cavity, and the size of the microwave chip wafer placing cavity is changed by rotating a rotating disc to change the gap positions of a plurality of sliding columns so as to place microwave chip wafers of different sizes; the vertical shaft is rotated to enable the pressing plates to descend to press and limit the microwave chip wafer, the microwave chip wafer is prevented from being collided and damaged in the transferring process, functionality is high, and the technical problem that a microwave chip wafer conveying carrier fastening device is single in function is solved.

The invention relates to the technical field of chip testing, and particularly discloses an efficient heat dissipation microwave chip testing clamp which comprises a bearing frame and a protective cover rotationally connected to the bearing frame, a testing groove is formed in the protective cover, and a bearing table used for placing a chip is vertically and slidably connected to the interior of the bearing frame. The interior of the bearing frame is slidably connected with a clamping piece used for clamping a chip. A power mechanism used for driving the bearing table to vertically slide is further arranged in the bearing frame, the power mechanism is in transmission connection with the clamping piece, and the protective cover is connected with the power mechanism through a synchronous piece. A driving source does not need to be independently arranged to drive the clamping piece to move, passive implementation is achieved in the stroke of upward movement of the bearing table, energy and energy consumption can be saved, meanwhile, use of a control system can be reduced, and the effect of controlling the cost can be achieved to a great extent; and meanwhile, later-stage overhaul and maintenance of the clamp can be facilitated, and the effect is excellent.

The invention belongs to the field of terahertz test systems, and provides a fully-integrated spread spectrum module for spreading a vector network analyzer to a W wave band, which is used for spreading the test frequency of a four-port vector network analyzer capable of outputting 12.5-18.4 GHz to the W wave band (75-110 GHz) and solving the problems of large volume, heavy weight, difficulty in carrying, high production cost and the like of the existing spread spectrum module. According to the invention, a W-band bi-directional coupler, a W-band orthogonal mode coupler, a W-band waveguide power divider, a plurality of microwave chip probes, a plurality of 50 ohm transmission lines, a microwave frequency doubling chip, a microwave frequency mixing chip, a W-band power amplification chip, a chip capacitor, a power supply shifting bead, a wave absorbing material, a DC-DC power supply board and other key parts are fully integrated. The size of the spread spectrum module is greatly reduced, the weight is reduced, and the comprehensive production cost is reduced.

The invention relates to the technical field of microwave circuit resonance suppression, in particular to a microwave circuit, a packaging method, a resonance suppression chip preparation method, equipment and a medium, and the microwave circuit resistant to cavity resonance comprises a microwave chip, a resonance suppression chip and a plurality of first bonding devices; the first surface of the microwave chip and the second surface of the resonance suppression chip are respectively provided with a plurality of first bonding pads, and when the microwave chip and the resonance suppression chip are packaged, the first surface of the microwave chip is a surface close to a packaging cover plate; the resonance suppression chip is arranged on one side of the first surface of the microwave chip, and the first bonding pad of the microwave chip is bonded with the first bonding pad of the resonance suppression chip through the first bonding device, so that a resonance suppression material is prevented from being pasted, and the resonance suppression efficiency is improved on the premise that the original electrical performance of the microwave chip is ensured. The cavity interference resistance and environmental applicability are improved, and the device has the advantages of being high in integration level, small in size and simple in process and has wide application prospects.

The invention belongs to the technical field of data communication, and particularly relates to a multichannel dielectric signal heterogeneous integration module integrating a TEC and a silicon photoswitch, which comprises a ceramic substrate, a silicon substrate and a packaging substrate, and a packaging shell is arranged on the packaging substrate; a radio frequency microwave chip is arranged on the ceramic substrate, an analog / digital conversion chip, a power supply management chip, a signal control chip, a laser chip and a silicon optical chip are arranged on the silicon substrate, and semiconductor chilling plates are arranged on opposite surfaces of the ceramic substrate and the silicon substrate; an optical fiber connected with the silicon optical chip to achieve digital optical signal output / input penetrates through the packaging shell, and a solder ball array electrically connected with the outside to achieve input of a power signal and a control signal and output / input of a radio frequency signal is arranged on the packaging substrate. According to the invention, the size is obviously reduced, interconnection loss is reduced, and reliability is improved.

This invention discloses a comprehensive microwave chip wafer-level performance testing device and method, belonging to the field of microwave chip testing technology. The device includes a signal source, receiver, coupler, circulator, switch, matching unit, chuck, etc., forming a specialized comprehensive microwave chip wafer-level performance testing system. The testing method includes comprehensive measurements of scattering parameters and derived coefficients, distortion parameters, power parameters, spectral parameters, pulse parameters, noise parameters, and nonlinear parameters. This invention effectively improves testing accuracy and speed, thus solving the challenge of high-precision and high-efficiency testing of microwave chips. A single testing device can fully evaluate testing capabilities, significantly reducing construction costs.

This invention discloses a microwave chip packaging device welding equipment and method, relating to the field of microwave chip welding technology. It aims to solve the technical problem that circuit boards are easily affected by the temperature of the conveyor track itself, leading to inconsistent temperatures between the bottom and top of the circuit board, thus affecting the quality of the solder joints. The equipment includes a reflow oven body, which comprises a conveyor mechanism. The conveyor mechanism includes a conveyor belt, with fixed side plates arranged on the sides of the conveyor belt. Multiple sets of device support frames are arranged on the conveyor belt. Forward and reverse guide plates are arranged on the sidewalls of the fixed side plates. Each set of device support frames consists of a front frame and a rear frame. The front frame includes a lifting and positioning frame and multiple clamping components. This invention has the advantages of ensuring a relatively stable position of the circuit board inside the reflow oven, raising the circuit board body and keeping it above the conveyor belt, ensuring uniform heating from all angles, and improving welding quality.

The invention relates to a photoelectric integrated component, in particular to an ultra-wideband radio frequency digital photoelectric integrated component and a signal transmission system. The ultra-wideband radio frequency digital optoelectronic integrated assembly comprises a radio frequency board, a digital board and a packaging substrate which are arranged in a stacked mode, the radio frequency board and the digital board are covered with a packaging shell, the packaging shell is arranged on the packaging substrate, and chips on the radio frequency board and the digital board are in signal connection with each other and are in signal connection with the packaging substrate; the radio frequency board is provided with a superheterodyne secondary frequency conversion radio frequency transceiving link built by a microwave chip; the digital board is provided with a digital / analog conversion chip, a digital chip and an optical chip; an optical fiber penetrates through the optical fiber outlet of the packaging shell and is coupled with the optical chip. The signal transmission system comprises the ultra-wideband radio frequency digital photoelectric integrated assembly, a TR assembly and an array antenna. While the ultra-wideband performance is maintained, the size is remarkably reduced, the interconnection loss is reduced, the reliability is improved, and a feasible technical path is provided for a multifunctional and miniaturized communication system in the future.

The invention discloses a Ku-band four-channel dual-polarization TR assembly based on the SIP technology, which is applied to the technical field of active phased array radars, and is characterized in that the SIP technology is applied to a multi-channel TR front-end module, and the design of a power division network and a crossed strip line network is applied to an integrated microwave thin film multilayer circuit substrate, so that the multi-channel TR front-end module can be realized; various integrated microwave chips such as an amplitude-phase multifunctional wave control chip S1, a power amplifier switch chip S2, an amplitude-limiting low-noise amplifier chip S3 and the like are matched on the surface to form a radio frequency transceiving link, so that the aims of minimizing the link and maximizing the function are fulfilled; 8 shielding areas are divided, signal leakage between channels can be effectively prevented, and it is guaranteed that all levels work in a stable environment; the TR assembly is provided with four receiving and transmitting channels and four receiving channels at the same time, meets the requirements of miniaturization, light weight, integration, multiple functions, multiple channels and dual polarization, achieves the electrical indexes of the TR assembly, and also has the functions of reliability and maintainability.