LTCC-based miniaturized tile type T/R assembly

A tile-type, component technology, applied in waveguide-type devices, electrical components, waveguides, etc., can solve the problems of large space occupied by fixed structures, poor process stability, unfavorable practical applications, etc., to achieve mature and reliable welding process, small size, Guarantee the effect of stability and cost control

Active Publication Date: 2014-09-03
NO 20 RES INST OF CHINA ELECTRONICS TECH GRP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Connectors mainly include connectors and buttons, etc. The process stability of this kind of solderless connection is poor, and the fixed structure takes up a lot of space and the cost is too high, which is not conducive to practical application

Method used

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  • LTCC-based miniaturized tile type T/R assembly
  • LTCC-based miniaturized tile type T/R assembly

Examples

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Embodiment Construction

[0024] Now in conjunction with embodiment, accompanying drawing, the present invention will be further described:

[0025] The design scheme adopted in the embodiment of the present invention is: the tile-type T / R assembly includes three LTCC dielectric substrates, and each LTCC dielectric substrate is sintered from LTCC green ceramic tapes printed with microwave transmission lines and chip control circuits in multiple layers . Slots are drilled on each LTCC substrate to place microwave chips. The surface of the substrate adopts microstrip lines, and the inner layer of the substrate adopts striplines. This combination of microstrip lines and striplines ensures the maximum utilization of space.

[0026] The 3×3 metal pillar array in the LTCC substrate forms a 50ohm quasi-coaxial structure, which has good radio frequency transmission performance, and the conversion insertion loss between the strip line and the quasi-coaxial is small, which can meet the actual engineering applic...

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PUM

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Abstract

The invention relates to an LTCC-based miniaturized tile type T / R assembly. By means of a conventional medium material, through reasonable layout of a microwave chip, a microwave transmission line and a control signal line, the miniaturized tile type T / R assembly which has a dimension of 9 mm * 9 mm * 4.3 mm, has high integration and facilitates conformation. The LTCC-based miniaturized tile type T / R assembly solves the problems of large dimension and difficulty in actual application and the like of a conventional T / R assembly, enables the T / R assembly to have higher integration, enables a current phased array to have the advantages of miniaturization, conformal to environment and the like, and satisfies the demands of special platforms such as a vehicular-mounted platform and the like.

Description

technical field [0001] The invention belongs to the technical field of radio frequency microwave circuits, and relates to a LTCC-based micro-tile T / R component, which can realize a micro-tile T / R assembly with a size of 9mm×9mm×4.3mm, high integration, and conformability. R component. Background technique [0002] At present, active phased array radar has become the main direction of radar development. The key to realizing active phased array radar lies in its active array, and the active array contains a large number of T / R components. The tile-type T / R module is a three-dimensional multi-chip module. The three-dimensional multi-chip module is to mount MMIC (monolithic microwave integrated circuit) chips and chip components on a multi-layer ceramic substrate to form a two-dimensional multi-chip microwave module. , and then vertically interconnect multiple two-dimensional multi-chip modules to form a three-dimensional multi-chip microwave circuit module. [0003] Due to th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01P3/08
Inventor 王耀召杨伯朝万涛王冰王拓李宝洋
Owner NO 20 RES INST OF CHINA ELECTRONICS TECH GRP
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