The invention relates to the technical field of heat dissipation of
electronic equipment, and particularly discloses a large-
caliber light and thin
active array heat dissipation integrated framework. Comprising a heat dissipation bearing structure, a heat dissipation
assembly and a function module which are installed in the heat dissipation bearing structure, a plurality of groups of
radio frequency sub-arrays which are installed on the heat dissipation
assembly and are connected with the function module, and antenna arrays which are installed on the
radio frequency sub-arrays and are vertically interconnected. The heat dissipation
assembly comprises a heat dissipation liquid cooling plate assembly installed in the heat dissipation bearing structure, a heat exchange liquid cooling plate installed in the heat dissipation bearing structure and conducting heat exchange with an external
heat sink, and a liquid supply mechanism connected between the heat dissipation liquid cooling plate assembly and the heat exchange liquid cooling plate. According to the invention, the requirements of the
active array on
large aperture,
lightness, thinness and expandability are met. A plurality of groups of closed fluid loops are integrated in the array, heat is led out through contact between the internal heat exchange liquid cooling plate and the external
heat sink,
external liquid supply is not needed, and the array heat dissipation
integration problem in a windless / liquid-free environment can be solved.