The invention discloses a PCB glue removing method in the mode of vertically depositing copper wires, and the method is applicable to a PCB manufacturing technology. The method includes the steps of board feeding, expanding, first water washing, first glue refuse removing, second water washing, first neutralizing, third water washing, second expanding, fourth water washing, second glue refuse removing and fifth water washing. According to the method, only a second expanding position and a second glue removing position are added, so that second expanding and second glue refuse removing of high-TG boards can be conducted in a second expanding cylinder and a second glue removing cylinder separately and respectively, the situation that in the prior art, the expanding cylinders are left unused after first glue refuse removing is conducted, and glue removing can be conducted on the next batches of the high-TG boards only after second expanding and second glue refuse removing are conducted can be avoided, glue removing can be conducted on the high-TG boards continuously, due to the fact that the equipment costs of the second expanding cylinder and the second glue removing cylinder are lower, on the basis of the lower equipment cost, the high-TG board glue removing yield is greatly increased, and production efficiency is greatly improved.