Microwave chip screening device and screening method therefor
Patent Information
- Authority / Receiving Office
- CN · China
- Current Assignee / Owner
- WUXI HUACE ELECTRONICS SYST
- Publication Date
- 2017-04-26
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Abstract
Description
technical field
[0001] The invention relates to the field of microwave chip testing, in particular to a microwave chip screening device and a screening method thereof. Background technique
[0002] At present, the existing microwave chip testing methods are probe testing or loading into a temporary package carrier for testing. However, with the development of the industry, there are more and more performance indicators of a single microwave chip. If only probes are used to test all indicators, the cost of microwave chips will undoubtedly be increased. Also, the probe method cannot perform low temperature and power resistant screening. In addition, most of the existing temporary packaging carrier methods are to apply elastic pressure to the point contact of the chip pad. Small, not conducive to high-power microwave chip-to-ground contact heat dissipation. If the method of vacuum absorbing chips is adopted, an external vacuum pipeline is required, which increases the equipm...