Interconnection test fixture and interconnection test method for silicon-based component

Abstract

The invention discloses an interconnection test fixture and an interconnection test method for a silicon-based component, and belongs to the technical field of advanced electronic packaging, the interconnection test fixture for the silicon-based component comprises a vacuum adsorption hole, an X-axis limiting baffle block, a Y-axis limiting baffle block and a test area Z plane regulator, and realizes three-dimensional regulation of a tested piece. The problems of clamping and compatibility of different silicon-based assemblies are solved, the fragment risk is avoided, and the purposes that the test fixture is universal and convenient to use are achieved; according to the interconnection test method, direct current and alternating current characteristic tests are carried out by using an isolation technology, and test errors are reduced by reducing generated current branches, so that the accuracy of a measured value is ensured; according to the invention, the testing of the microsystem component level is realized, most of the fault components can be detected before the function performance test, the final function performance test first pass yield is improved, the subsequent potential quality hazard and resource waste are avoided, and the test coverage rate of the network is effectively improved.

Description

technical field [0001] The invention belongs to the technical field of advanced electronic packaging, and in particular relates to an interconnection test fixture and an interconnection test method of a silicon-based component, which can be used for assembly defect detection in the development process of the silicon-based component. Background technique [0002] In recent years, the development of advanced packaging technology has shown the following trends: ① development from single chip to multi-chip; ② transformation from two-dimensional or 2D to three-dimensional or 3D; ③ heterogeneous and heterogeneous integration. 2.5D packaging can achieve high-density interconnection between multiple chips and packaging substrates through silicon interposers, and 3D packaging can achieve chip-to-chip bonding processes through chip-to-chip / chip-to-wafer / wafer-to-wafer bonding processes. Three-dimensional stacking of chips. Flip Chip, FC, or silicon-based components encapsulated by si...

AI Technical Summary

Problems solved by technology

The former cannot check invisible welding defects, component failures, etc., and the test coverage is low; the latter needs to make test fixtures for different products, and the production and debugging cycle is long and the cost is high

Due to the characteristics of silicon-based components such as diversification, thinness, miniaturization, and high-density I / O contacts, there is currently no effective test fixture and test method for the interconnection test of silicon-based components.

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