1results about How to "Avoid Fragmentation Risk" patented technology

This application relates to the field of integrated circuit manufacturing and discloses a wafer processing technology, including: obtaining a wafer after back cleaning; cleaning the back side of the wafer with an alkaline solution to neutralize the acidic substances remaining on the back side of the wafer after back cleaning; and performing photolithography on the wafer after cleaning with the alkaline solution. This application cleans the back side of the wafer with an alkaline solution before performing photolithography on the back side of the wafer after back cleaning. The alkaline solution can neutralize the acidic substances remaining on the back side after back cleaning. Because the acidic substances remaining after back cleaning are neutralized and removed, even if there are chemical residues at the edge of the back side after photolithography, white crystal defects will not be generated at the edge of the back side of the wafer, improving wafer quality and avoiding the risk of subsequent wafer breakage. Furthermore, this application also provides a wafer with the above advantages.