Substrate Stages and Exposure Machines

Abstract

The invention discloses a substrate carrier and an exposure machine. The substrate carrier includes: a body, including a first surface and a second surface oppositely arranged, the first surface is used to carry the substrate, and the first surface is provided with at least one ion channel; at least one first static eliminator, each first The static eliminator corresponds to at least one ion channel, and the first static eliminator is connected to the corresponding ion channel to provide static elimination ions into the ion channel. Through the function of the set ion channel and the first static eliminator corresponding to the ion channel, the static electricity generated on the surface in contact with the substrate and the substrate carrier can be eliminated, thereby eliminating the electrostatic adsorption force between the substrate and the substrate carrier , so that the substrate and the substrate carrier can be easily peeled off. Therefore, in the process of peeling the substrate from the substrate carrier, the substrate can be effectively protected, the risk of debris during the peeling of the substrate can be effectively avoided, the production yield of the substrate can be improved, and the production cost can be reduced.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a substrate carrier and an exposure machine including the substrate carrier. Background technique [0002] In recent years, with the rapid development of semiconductor display technology, the photolithography process in semiconductor manufacturing has become more and more important. The exposure machine in lithography manufacturing has become an indispensable equipment for semiconductor manufacturing. However, the substrate stage of the existing exposure machine is often at the moment when the substrate and the substrate stage are peeled off, because there is adsorption static electricity between the substrate and the substrate stage, resulting in an adsorption force between the substrate and the substrate stage, so Substrate fragments are often created, resulting in lost production. [0003] In order to eliminate the static electricity generated when the substrate is peeled o...

AI Technical Summary

Problems solved by technology

At this time, there is adsorption static electricity between the substrate 200 and the substrate stage 100, which has a relatively large adsorption force. At this time, the X-Ray static eliminator 160 is located above the substrate 200, and it has a very good effect on the static elimination below the substrate 200. Weak, thus often leading to stress chipping of the substrate 200, resulting in loss of production

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