The invention relates to the technical field of sensing
product testing, in particular to a super-
large array packaging
conductivity testing device which comprises a
wafer testing table, an open circuit testing plate and a
short circuit testing plate, an objective table is installed at the top of the
wafer testing table, and a swing arm positioning seat is installed at the top of the
wafer testing table and on the back face of the objective table. The outer wall of the swing arm positioning seat is provided with a
test probe, the top of the wafer
test bench and the back surface of the swing arm positioning seat are provided with a main
control unit, and the outer wall of the main
control unit is connected with the swing arm positioning seat through a
test line. According to the super-
large array packaging
conductivity testing device, the open circuit testing plate and the
short circuit testing plate in the device are used for testing the to-be-tested product, and the problems that an existing testing device and an existing testing method cannot directly point-contact the two ends for measurement, the accuracy of a testing result is poor, the efficiency is low, and the product is prone to being damaged are solved.