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Monitoring method, attachment equipment and panel

A technology for laminating plates and substrates, which is applied in the manufacture of electrical components, electric solid-state devices, semiconductor/solid-state devices, etc., can solve the problems of uneven force on fragments and glass substrates, and achieve the effect of avoiding the risk of fragmentation.

Inactive Publication Date: 2018-08-28
YUNGU GUAN TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In view of this, the embodiments of the present invention are dedicated to providing a monitoring method, laminating equipment and panels to solve the problem of broken glass substrates caused by uneven force in the prior art

Method used

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  • Monitoring method, attachment equipment and panel
  • Monitoring method, attachment equipment and panel
  • Monitoring method, attachment equipment and panel

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Embodiment Construction

[0023] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0024] figure 1 Shown is a schematic diagram of the evaporation process of the OLED provided by an embodiment of the present invention. Such as figure 1 As shown, the substrate 20 includes a film surface 21 and a non-film surface 22. The film surface 21 refers to the surface used to prepare the film layer structure. The evaporation process includes: turning the substrate 20 upside down so that the film surface 21 faces downward, and placing the ...

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PUM

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Abstract

The invention provides a monitoring method, attachment equipment and a panel. By the monitoring method, the attachment equipment and the panel, a breakage risk caused by that stress applied onto a glass substrate is not within an error-allowable range during the fabrication process of an OLED display panel is reduced. The monitoring method comprises the steps of detecting pressure values of a plurality of points by a piezoelectric sensing thin film arranged between a lamination plate and a substrate; determining whether the stress applied to the substrate by the lamination plate is within theerror-allowable range or not according to the pressure values of the plurality of points; and controlling running of the lamination plate according to the situation whether the pressure is within theerror-allowable range or not so that the substrate is uniformly pressed on a mask.

Description

technical field [0001] The invention relates to the technical field of bonding between planes, in particular to a monitoring method, bonding equipment and a panel. Background technique [0002] In the preparation process of the Organic Light-Emitting Diode (OLED) display panel, the various functional film layers are mainly evaporated onto the glass substrate through the evaporation process, and the glass substrate needs to be pressed down before the evaporation process. It is attached to the underlying mask plate. Once the force on the glass substrate is not within the allowable range of error during the process, it is easy to cause breakage. Contents of the invention [0003] In view of this, the embodiments of the present invention are dedicated to providing a monitoring method, laminating equipment and panel, so as to solve the problem in the prior art that the glass substrate is broken due to uneven force. [0004] One aspect of the present invention provides a monito...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/66H01L51/56H01L27/32
CPCH01L22/00H01L22/10H01L22/30H10K59/00H10K71/00
Inventor 孟辉辉罗志忠李灏张久杰
Owner YUNGU GUAN TECH CO LTD
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