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A technology for laminating plates and substrates, which is applied in the manufacture of electrical components, electric solid-state devices, semiconductor/solid-state devices, etc., can solve the problems of uneven force on fragments and glass substrates, and achieve the effect of avoiding the risk of fragmentation.
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[0023] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0024] figure 1 Shown is a schematic diagram of the evaporation process of the OLED provided by an embodiment of the present invention. Such as figure 1 As shown, the substrate 20 includes a film surface 21 and a non-film surface 22. The film surface 21 refers to the surface used to prepare the film layer structure. The evaporation process includes: turning the substrate 20 upside down so that the film surface 21 faces downward, and placing the ...
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