Substrate carrier platform and exposure machine

Abstract

The invention discloses a substrate carrier platform and an exposure machine. The substrate carrier platform comprises a body and at least one first electrostatic eliminator, wherein the body comprises a first surface and a second surface which are arranged opposite to each other; the first surface is used for carrying a substrate and is provided with at least one ion channel; each first electrostatic eliminator corresponds to at least one ion channel; the first electrostatic eliminators are respectively connected with the corresponding ion channels so as to provide electrostatic elimination ions for the ion channels. By means of the action of the ion channels and the first electrostatic eliminators corresponding to the ion channels, the static electricity generated by the surface, in contact with the substrate carrier platform, of the substrate can be eliminated, so that the electrostatic absorption force between the substrate and the substrate carrier platform can be eliminated, andthe substrate and the substrate carrier platform can be easily peeled off. Therefore, in a process of peeling off the substrate from the substrate carrier platform, the substrate can be effectively protected, the risk of breaking is effectively avoided when the substrate is peeled off, the production yield of the substrate is increased, and the manufacturing cost is reduced.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a substrate carrier and an exposure machine including the substrate carrier. Background technique [0002] In recent years, with the rapid development of semiconductor display technology, the photolithography process in semiconductor manufacturing has become more and more important. The exposure machine in lithography manufacturing has become an indispensable equipment for semiconductor manufacturing. However, the substrate stage of the existing exposure machine is often at the moment when the substrate and the substrate stage are peeled off, because there is adsorption static electricity between the substrate and the substrate stage, resulting in an adsorption force between the substrate and the substrate stage, so Substrate fragments are often caused, resulting in lost production. [0003] In order to eliminate the static electricity generated when the substrate is peeled of...

AI Technical Summary

Problems solved by technology

At this time, there is adsorption static electricity between the substrate 200 and the substrate stage 100, which has a relatively large adsorption force. At this time, the X-Ray static eliminator 160 is located above the substrate 200, and it has a very good effect on the static elimination below the substrate 200. Weak, thus often leading to stress chipping of the substrate 200, resulting in loss of production

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