187 results about "Silicon etching" patented technology

The invention discloses a semiconductor structure manufacturing method and a semiconductor structure, and the manufacturing method comprises the steps: carrying out the periodic cycle etching of a preset number of times on a substrate through employing an etching technology, forming a first intermediate structure on the substrate, and carrying out the first processing of the first intermediate structure, including employing a first gas and a second gas, removing a part of thickness of the passivation layer deposited on the side wall of the first intermediate structure, and reacting with the substrate material which exists on the side wall and is exposed on the surface of the convex part to generate a reaction product layer; and removing the reaction product layer by using a third gas and a fourth gas so as to remove at least part of the lug boss, and repeatedly executing the etching process and the first processing process until a high aspect ratio etching structure is formed on the substrate. According to the method, the etching process and the side wall processing technology are organically combined, the etching rate and the side wall quality are balanced through alternate circulation, and deep silicon etching with the higher aspect ratio and the smaller nanoscale size can be achieved.

The invention discloses a preparation method of a semiconductor structure and the semiconductor structure, and the preparation method comprises the steps: carrying out the etching of a substrate through employing an etching technology, so as to form a high-aspect-ratio etching structure on the substrate; after a periodic cycle step of a preset number of times of etching process is completed every time, a treatment process different from the etching process is used, and partial thickness of a passivation layer deposited on the side wall of an intermediate structure formed before the high aspect ratio etching structure is formed is removed. And removing at least part of the protruding part which exists on the side wall and is exposed from the surface of the residual passivation layer. According to the method, the etching process and the side wall processing technology are organically combined, the etching rate and the side wall quality are balanced through alternate circulation, and deep silicon etching with the higher aspect ratio and the smaller nanoscale size can be achieved.

The invention discloses an MEMS thermal flow sensor based on a glass film structure and a preparation method of the MEMS thermal flow sensor. The sensor comprises a glass inner silicon substrate, a back cavity, a silicon through column, a heating resistor, a temperature measurement resistor, an environment temperature measurement resistor, a chromium adhesion layer, a PAD port and a silicon nitride protection layer. Wherein the heating resistor is located in the center, and the temperature measuring resistors are symmetrically distributed on two sides of the heating resistor; the back cavity is located on the back of the glass inner silicon substrate, and the heating resistor, the temperature measuring resistor and the environment temperature measuring resistor lead a PAD port to the back of the glass inner silicon substrate through a silicon through column. A thermal temperature difference principle is adopted, and upstream and downstream temperature measuring resistors form a Wheatstone bridge. When the flow velocity is not zero, the Wheatstone bridge outputs, and the larger the flow velocity is, the larger the output is. Based on the glass and silicon composite substrate, the suspension film structure is formed through the silicon etching process, transmission of heat to the substrate is greatly reduced, and the heat utilization rate is increased.

The invention discloses a preparation and coupling optimization method of a strip-shaped SOI waveguide adopting end face coupling, and belongs to the field of micro-nano fine structure processing and optical precision measurement. According to the method, through two-step photoetching and two-step etching, on one hand, the substrate section highly coincident with the waveguide end face can be etched on the waveguide end face, and on the other hand, it can be guaranteed that the etching broadening of the Si substrate etching channel cannot cause the hollow-out of the lower portion of the waveguide above SiO2. By using the direct-current magnetron sputtering Cr mask, the waveguide material can be prevented from being etched and damaged in the deep silicon etching process. Through the ion beam etching process, the end face of the waveguide and the etched side wall of the substrate are completely overlapped, so that part of light spots are prevented from being scattered by the Si substrate in the optical fiber coupling process, and the coupling efficiency of the waveguide is further improved. By combining the FDTD simulation result, the low-internal stress SiO2-Si3N4 antireflection film with the proper thickness is deposited on the waveguide end face through ICP-PECVD, light spots are prevented from being reflected on the waveguide end face, and the light spot coupling efficiency reaches the maximum.

The invention relates to a 3 [mu] m SOI process integration method for an on-chip beam forming and wavelength division multiplexing system. The method comprises the steps of silicon waveguide etching, PN ion implantation, germanium-silicon epitaxy, germanium-silicon waveguide etching, metal layer growth and the like. In order to solve the problem that the silicon PN doping annealing temperature is higher than the germanium-silicon PN doping annealing temperature, the germanium-silicon epitaxial etching postposition technological process is developed, and the non-selective epitaxy and reverse etching modes are used, so that the problem that a wafer is uneven after silicon etching doping is solved. The method has extremely high application value in large-scale silicon photon integration application, and can be used for manufacturing complex active photon chips integrated with modulators, detectors and the like.

The invention discloses a heat dissipation enhanced semiconductor packaging method, which comprises the following steps of: performing deep silicon etching to form a vertical through hole; insulation and metallization are carried out; thinning the wafer; performing hybrid bonding and stacking of multiple layers of chips; a heat dissipation design is adopted to form a vertical heat dissipation path; a three-dimensional thermal through hole network: adding pure copper thermal through holes in a non-functional area; performing microfluid cooling integration; molding and packaging; and thermal performance verification: verifying that the junction temperature can be controlled within 85 DEG C through infrared thermal imaging and finite element simulation. The TSV with the depth-to-width ratio of 10: 1 can be realized by adopting the Bosch process; a three-dimensional integrated TSV array supporting HBM and other high-speed memories is embedded into diamond or graphene heat dissipation columns, a low-heat-resistance vertical heat dissipation path is formed by combining a three-dimensional pure copper heat through hole network, and local hot spots are effectively dispersed; the high-thermal-conductivity epoxy molding compound and the embedded copper block enhance the overall mechanical strength and thermal diffusivity, so that the product can dissipate heat efficiently, and the overall area is not easy to influence.

The invention discloses a high aspect ratio deep silicon etching structure and a patterning method thereof. The patterning method comprises the following steps: providing a substrate made of silicon; forming a plurality of photoresist patterns on the surface of the substrate, wherein an opening is formed between every two adjacent photoresist patterns; bombarding the interface of the substrate at the inner bottom corner of the opening by using plasma of a first gas at a first ultralow temperature to form a first protective film; depositing a polymer layer on the substrate, the photoresist pattern and the first protective film for protection by using plasma of second gas at a second ultralow temperature; etching the polymer layer and the substrate by using plasma of a third gas at a third ultralow temperature; repeating the steps of depositing the polymer layer and etching until a high aspect ratio deep silicon etching structure is formed on the substrate; and removing the photoresist pattern. According to the invention, the uniform protection of the side wall under the conditions of smaller size and higher aspect ratio can be realized, and the etching rate can be improved.

The invention discloses a semiconductor deep silicon etching method and application thereof. The semiconductor deep silicon etching method comprises the following steps: providing a structure to be etched, wherein the structure comprises a silicon structure and a silicon oxide layer; patterning etching is carried out; growing silicon oxide as a filling layer which comprises a side surface part and a bottom surface part, filling the first inner wall to form a second inner wall, and enabling the second inner wall and the bottom surface to be closer to 90 degrees; performing secondary etching to expose the silicon structure again; and forming a deep silicon etching structure by adopting a deep silicon etching process. According to the method, the opening width and the opening side wall morphology of the hard mask are adjusted by utilizing a transverse growth method, on one hand, the width of the mask opening can be accurately adjusted by controlling the transverse growth condition, and high-precision photoetching equipment is not needed; and on the other hand, the deep silicon etching quality can be remarkably improved by adjusting the shape of the side wall of the opening, and various abnormities of the deep silicon etching groove can be avoided without complex procedures and expensive equipment.

Provided is an etching solution composition capable of preventing reduction in the etching rate of a silicon nitride film, achieving high etching selectivity with respect to silicon nitride, and suppressing deposition of silica on the surface of silicon oxide.　This etching solution composition is based on an inorganic acid and is for selectively etching silicon nitride from a semiconductor containing the silicon nitride and silicon oxide, and comprises: (a) a fluorine compound that increases the etching rate of silicon nitride; and (b) a volatilization inhibitor that inhibits volatilization of the fluorine compound.

The invention discloses application of germanium-silicon etching liquid. The etching liquid is applied to selective etching of silicon in a GAA MOSFET structure. The etching liquid comprises the following components in percentage by mass: 1-10% of organic alkali, 0.001-0.1% of a nonionic surfactant, 5-30% of an organic solvent and water, and the sum of the mass fractions of the components is 100%. The etching liquid provided by the invention can selectively etch silicon, has a high etching rate for silicon, has a low etching rate for silicon-germanium alloy, silicon oxide and silicon nitride, and has a high selection ratio for silicon / silicon-germanium alloy.

The invention discloses a multifunctional protection device and a manufacturing process thereof, belonging to the technical field of protection devices. A silicon dioxide layer is grown on a P-type single-crystal silicon wafer, a boron ion implantation window is photoetched on the front side of the P-type single-crystal silicon wafer, a light boron layer is doped on the front side of the P-type single-crystal silicon wafer by ion implantation, and the light boron layer is redistributed by high-temperature diffusion, a light phosphorus implantation window is photoetched on the front and back sides of the P-type single-crystal silicon wafer, a phosphorus layer is ion implanted on the front and back sides of the P-type single-crystal silicon wafer, and the phosphorus layer is redistributed by high-temperature diffusion, a concentrated boron diffusion zone window is photoetched on the front side of the P-type single-crystal silicon wafer, concentrated boron diffusion is performed on the front side, concentrated phosphorus layer diffusion windows are photoetched on the front and back sides of the P-type single-crystal silicon wafer, concentrated phosphorus layer diffusion is performed on both sides, a groove etching window is photoetched on the front side of the P-type single-crystal silicon wafer, silicon etching is performed to form an inner groove mesa structure, and metallization treatment is performed on the front and back sides of the P-type single-crystal silicon wafer to construct a metal layer.

The present application discloses a method for fabricating a semiconductor structure and a semiconductor structure. The method comprises: etching a substrate using an etching process to form a high-aspect-ratio etched structure on the substrate; after each predetermined number of periodic cycles of the etching process are completed, using a treatment process different from the etching process to remove a portion of the thickness of a passivation layer deposited on the sidewalls of an intermediate structure formed before the high-aspect-ratio etched structure is formed, and removing at least a portion of a protrusion on the sidewall that is exposed from the remaining passivation layer surface. The present application organically combines the etching process with sidewall treatment technology, alternating cycles to balance the etching rate and sidewall quality, and can achieve deep silicon etching with higher aspect ratios and smaller nanometer-scale dimensions.

The invention discloses a superconducting quantum chip, a substrate and a processing method thereof, and belongs to the technical field of deep silicon etching. The substrate processing method comprises the following steps: providing a substrate with a first photoresist layer on the surface; a first groove for exposing a part of the substrate is formed in the first photoresist layer; forming a protective layer on the inner wall of the first groove; the protective layer surrounds to form a second groove; and etching the substrate through the second groove in the thickness direction of the substrate. Through the mode, the first photoresist layer is not influenced when the substrate is etched, and the form of the first groove formed by the first photoresist layer is protected, so that the problems of expansion, breakage and the like of the first groove are avoided, and the condition that the etching of the substrate cannot meet the expected parameter requirement is avoided.

The application provides a deep silicon etching method and a semiconductor process equipment, and relates to the technical field of semiconductors. The deep silicon etching method comprises a first cycle step and a second cycle step. The first cycle step and the second cycle step both comprise an etching step for etching a silicon substrate to form a groove, a removal step for removing by-products, and a deposition step for forming a protective layer on the sidewall of the groove. The protective gas used in the deposition step of the second cycle step comprises an oxygen-containing gas, and the lower electrode power of the deposition step of the second cycle step is greater than that of the deposition step of the first cycle step. The deep silicon etching method can balance the etching rate of different regions of the isolation groove, optimize the depth micro-loading effect, and improve the depth consistency of the isolation groove. Meanwhile, the deposition step does not consume the mask layer, thereby reducing the consumption of the mask layer, ensuring the effective height of the mask layer, improving the morphology precision of the formed isolation groove and AA, and improving the electrical properties and yield of the product.

The present invention provides a double silicon-gold bonded MEMS deformable mirror and its fabrication method. The MEMS deformable mirror comprises a silicon wafer substrate, a silicon nitride insulating layer, a lower polysilicon electrode, a first phosphosilicate glass sacrificial layer, an upper interdigitated electrode, a first bonding electrode layer, an SOI wafer structure, a second bonding electrode layer, and a gold-based reflective mirror surface. The fabrication method sequentially involves silicon wafer substrate pretreatment, silicon nitride insulating layer deposition, lower polysilicon electrode formation, first phosphosilicate glass sacrificial layer deposition and thinning, upper interdigitated electrode and related structure etching, first bonding electrode layer formation, SOI wafer pretreatment and solution channel formation, second phosphosilicate glass sacrificial layer filling, second bonding electrode layer formation, gold-to-gold hot-compression bonding, deep silicon etching, structural release and annealing, and gold-based reflective mirror surface fabrication and packaging. This invention can simplify the process flow, improve the correction performance of optical systems, and has broad market application prospects.

The invention discloses a non-polishing low-loss coupling optical fiber array adaptive to a deep silicon etching photon chip, a deep silicon etching photon chip coupling assembly and a method, and belongs to the technical field of silicon photon integration. The device comprises an optical fiber array main body, a V-shaped groove substrate and a special-shaped cover plate, the special-shaped cover plate is attached to the upper surface of the V-shaped groove substrate, an avoiding groove is formed in the position, corresponding to a deep silicon etching area of the end face of the chip, of the special-shaped cover plate, and the depth of the avoiding groove is not smaller than the total height of a residual step on the end face of the chip and a deep groove protruding structure so as to eliminate mechanical interference. The tail end of the optical fiber is positioned in the V-shaped groove, and the light-emitting end face is parallel and tightly butted with the end face of the chip. The customized avoiding groove is integrated in the cover plate, direct, lossless and low-loss coupling of the optical fiber array and the deep silicon etching silicon optical chip with the composite three-dimensional morphology end face can be achieved without extending the optical fiber, removing a bottom cover or polishing the end face of the chip, the integrity of the end face of the chip is effectively protected, and the coupling precision and the device yield are improved.

The present invention discloses a method for optimizing the sidewalls of a Bosch etching process, comprising the following steps: S1, pretreatment: providing a wafer subjected to a Bosch etching process; pre-treating the wafer subjected to the Bosch etching process using a first cleaning solution; S2, etching: placing the wafer subjected to the pre-treatment in step S1 in a silicon etching solution for room-temperature etching; S3, mask removal: cleaning the wafer subjected to the etching in step S2 using a second cleaning solution at room temperature to remove the SiO2 mask on the wafer surface. The optimization method of the present invention smoothes the sidewall ripples produced by the Bosch etching process, thereby improving device performance and lifespan.

The present invention relates to the field of circulator technology, in particular to the field of IPC H04B, and more specifically to a method for manufacturing a ceramic composite silicon-based circulator and its application. The present invention obtains a ceramic composite silicon-based circulator by cutting through eight steps: deep silicon etching through holes, making ferrite discs, preparing composite substrates, making dielectric bridges, photolithography patterns, vacuum coating, photoresist stripping, and scribing and slicing. The present invention adopts a silicon wafer commonly used in semiconductor technology, embeds a ferrite ceramic disc in the middle of each silicon wafer through hole, connects them into a completed circuit substrate substrate through a specific adhesive material, and then manufactures a microstrip circulator through a semiconductor thin film process. Dielectric bridge metallization technology is used at the connection between the two materials to ensure the continuity and reliability of the circuit connection. The circulator has a wide operating frequency band, high power resistance, good consistency, easy integration, and low cost. It is very suitable for use in isolators, duplexers, reflection amplifiers and other fields.

The invention provides compositions useful in the etching of polysilicon in the presence of silicon oxide and silicon nitride. The compositions comprise choline hydroxide, an oxidizing agent such as periodic acid, and optionally a surfactant, and are useful in the etching of polysilicon in general, and in particular in both the operation of polysilicon trim as well as polysilicon exhume. The utilization of an added oxidizing agent was found to reduce selectivity of silicon etching based on the silicon crystal orientation, which was found to reduce roughness and the presence of residual silicon residues, such as silicon (111) residues after the etching step.

The application discloses a piezoelectric MEMS device preparation process and a device structure, and relates to the technical field of piezoelectric MEMS device preparation. The preparation process comprises the following steps: forming a groove near an edge region on a front surface of a substrate, depositing a sacrifice layer on the front surface of the substrate and patterning the sacrifice layer, so that the sacrifice layer is separated into a center region and an edge support region, forming a piezoelectric-buffer stack on the sacrifice layer and patterning the piezoelectric-buffer stack, and opening a release hole, the release hole being communicated with the center region of the sacrifice layer, introducing etching medium into the release hole to remove the center region of the sacrifice layer, and then etching a back cavity on the back surface of the substrate. The application limits the size of a diaphragm region through the groove, etches the back cavity of the substrate after the sacrifice layer is released, and compared with a traditional method of defining the diaphragm by etching the back cavity, the application completely avoids the size error of the diaphragm caused by the angle deviation of deep silicon etching, accurately locks the profile of the diaphragm, and greatly improves the size consistency and performance stability of devices in the same batch.

The application provides a silicon-based three-dimensional capacitor and a manufacturing method thereof. The manufacturing method comprises the following steps: preparing a dielectric mask layer on the surface of a silicon substrate, etching a plurality of spaced-apart etching micropores on the dielectric mask layer until the silicon substrate is exposed, etching the plurality of spaced-apart etching micropores by using a deep silicon etching process to form a plurality of spaced-apart first deep holes, removing the remaining dielectric mask layer, preparing a first polysilicon layer on the silicon substrate with the plurality of spaced-apart first deep holes, etching the first polysilicon layer in the first deep holes by using a deep silicon etching process to form second deep holes in the first polysilicon layer in the first deep holes, and the bottom surface and the side surface of the second deep holes are provided with the first polysilicon layer, and growing an insulating dielectric layer, a second polysilicon layer and an electrode layer on the first polysilicon layer on the surface of the first silicon substrate and in all the spaced-apart second deep holes in sequence. The silicon-based three-dimensional capacitor prepared by the application can improve the density of the capacitor.

Disclosed are a method of forming a pattern structure including a silicon nitride. According to the embodiment of the present disclosure, the method of forming a pattern structure includes a step of providing, into a substrate processing apparatus, a substrate having one surface on which a pattern structure including a recess region in which an opening periphery portion and a bottom portion are made of a first silicon nitride is formed, a deposition step of depositing a second silicon nitride on the first silicon nitride, an etching step of etching the second silicon nitride, and a step of performing steps in one cycle n times until the first silicon nitride constituting the bottom portion is removed.

A method to create flexible mutli-conductor cables include fabricating wiring on silicon-on-insulator wafers with lithographic fabrication techniques followed by thinning some sections of the wafer with a silicon etch. Exemplary cables can have fine pitch and low thermal conductivity enabling high density superconducting interconnects between different temperature stages in cryogenic platforms or between superconducting circuits oriented perpendicular to each other. Also presented herein are methods for making and using exemplary cables.

This application provides a continuous titration method for the sulfuric acid and ammonium nitrate content of silicon etching solution. The continuous titration method includes the following steps: weigh m grams of silicon etching solution sample into a sample bottle, add phenolphthalein indicator, titrate with a first sodium hydroxide standard solution of concentration C1 until a pink color is achieved, and record the volume consumed V1. Calculate the sulfuric acid content. Add neutral formaldehyde solution to the same solution and let it stand for a first preset time to generate a free acid solution. Continue titrating the free acid solution with a second sodium hydroxide standard solution of concentration C2 until the solution turns pink. Gently heat the solution to a preset temperature and maintain this temperature for a second preset time. If the pink color persists, the titration endpoint is determined, and the volume consumed V2 is recorded. Calculate the ammonium nitrate content. This method achieves continuous titration of two components with a single sample, eliminates mutual interference between components, optimizes the endpoint determination method, and thus achieves a simple operation, high accuracy, low sample consumption, and high detection efficiency.

The invention provides a long-acting high-stability silicon nitride etching solution as well as a preparation method and application thereof. The long-acting high-stability silicon nitride etching solution comprises the following components in parts by weight: 1-5 parts of fluorophenylalkylamine; 80-90 parts of strong phosphoric acid; and 13 to 17 parts of ultrapure water. The fluorophenyl alkylamine is one or more of monofluoro substituted phenylamine, difluoro substituted phenylamine, monofluoro substituted benzylamine and difluoro substituted benzylamine. The invention also discloses a preparation method and application of the long-acting high-stability silicon nitride etching liquid. According to the long-acting high-stability silicon nitride etching solution, efficient etching of silicon nitride, dissolution control of byproducts, stability improvement of the etching solution and selective protection of silicon oxide are achieved at the same time, and the long-acting high-stability silicon nitride etching solution has very good application prospects and large-scale industrial popularization potential in the field of silicon nitride etching of 3D flash memory chips.

The invention discloses a preparation method of germanium-silicon etching liquid. The preparation method of the etching solution provided by the invention comprises the following step of mixing all the components in the etching solution to obtain the etching solution, the etching liquid comprises the following components in percentage by mass: 1-10% of organic alkali, 0.001-0.1% of a nonionic surfactant, 5-30% of an organic solvent and water, and the sum of the mass fractions of the components is 100%. The etching solution can selectively etch silicon, the etching rate of the silicon can be high, the etching rate of the silicon-germanium alloy, the silicon oxide and the silicon nitride is low, the selection ratio of the silicon / silicon-germanium alloy is high, and the technological requirement is met.

The invention discloses a manufacturing method of a U-shaped groove, which is characterized in that a photoresist reserved on a field oxide in an X-direction photoetching process of the U-shaped groove can protect a hard mask on the field oxide of a Y-direction opening of a non-U-shaped groove region, the loss of the hard mask on the field oxide of the Y-direction opening of the non-U-shaped groove region cannot be caused, and a U-shaped groove process window is enlarged; in the process of performing X-direction silicon etching to form a U-shaped groove, silicon at an X-direction opening at a non-overlapping position of an X-direction opening pattern and a Y-direction opening pattern is protected by a mask first silicon oxide layer and a mask second silicon nitride layer, when the mask at the position is removed, the mask second silicon nitride layer is removed firstly, then the first silicon oxide layer is removed, and the first silicon oxide layer is removed after the mask second silicon nitride layer is removed. The SIN hard mask on the field oxide is not damaged, and the morphology standard of the U-shaped groove can be ensured.

The invention discloses a silicon three-dimensional etching device and etching method, and relates to the technical field of silicon etching. The device comprises a pre-conveying assembly, a processing box, an etching assembly, an etching box fixed to the outer side wall of the processing box, a mounting positioning assembly, an operation box fixed to the lower end face of the processing box, a locking adsorption assembly, a linkage box fixed to the outer bottom of the etching box and communicated with the interior of the etching box, and a recycling separation assembly. Comprising a backflow cylinder located at the top position in a processing box, a centrifugal cylinder is arranged in the backflow cylinder, and a transfer storage assembly used for storing a plurality of silicon wafers up and down is arranged in the backflow cylinder. According to the invention, the centrifugal cylinder and the backflow cylinder are used in cooperation, so that the recycling of the etched mixed gas is realized, the electromagnet and the suction cylinder are used in cooperation, the rapid positioning of the silicon wafer is realized, the position stability of the silicon wafer is ensured, the gas is uniformly distributed and shunted by the honeycomb plate, the uniformity of plasma impact is realized, and the uniformity of the plasma impact is improved. And the etching quality is ensured not to be reduced.

The present invention provides an etching solution composition for silicon that yields an etching rate corresponding to the silicon dopant type, and a method for etching a surface having a first silicon region that is n-type and a second silicon region that differs from the first silicon region in terms of dopant type. [Solution] The etching solution composition provides an etching rate for silicon that corresponds to the silicon dopant type. The etching solution composition contains a base and an additive other than the base. The additive has 1 to 6 carbon atoms per molecule.

The invention discloses an MEMS (Micro Electro Mechanical System) thermal acceleration sensor for realizing wafer-level packaging by utilizing a silicon structure in glass and a preparation method. The sensor adopts a three-layer stacked structure, and comprises a silicon sealing cover in glass, an acceleration sensor body and a sealing laminated wafer. Wherein a silicon conductive through column which is electrically insulated from the glass medium is arranged in the glass-in-silicon sealing cover, so that electric signal transmission in the vertical direction is realized; the acceleration sensor body comprises a heating and temperature measuring module manufactured on a supporting layer; the sealing bonding wafer and the sealing cover jointly form a sealed cavity to package the working fluid. The preparation method comprises the following steps: preparing a silicon-in-glass sealing cover through two times of deep silicon etching, anodic bonding and a glass backflow process, manufacturing a sensor functional structure on a silicon substrate and forming a back cavity, and finally completing wafer-level integrated packaging through a surface mounting process. The wafer-level batch preparation and packaging complete solution of the thermal acceleration sensor is realized, and the problems of high packaging cost and low efficiency of a non-standard process are solved.