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126 results about "Silicon matrix" patented technology

Method of multiple pulse laser annealing to activate ultra-shallow junctions

A method for forming a highly activated ultra shallow ion implanted semiconductive elements for use in sub-tenth micron MOSFET technology is described. A key feature of the method is the ability to activate the implanted impurity to a highly active state without permitting the dopant to diffuse further to deepen the junction. A selected single crystalline silicon active region is first amorphized by implanting a heavy ion such as silicon or germanium. A semiconductive impurity for example boron is then implanted and activated by pulsed laser annealing whereby the pulse fluence, frequency, and duration are chosen to maintain the amorphized region just below it's melting temperature. It is found that just below the melting temperature there is sufficient local ion mobility to secure the dopant into active positions within the silicon matrix to achieve a high degree of activation with essentially no change in concentration profile. The selection of the proper laser annealing parameters is optimized by observation of the reduction of sheet resistance and concentration profile as measured on a test site. Application of the method is applied to forming a MOS FET and a CMOS device. The additional processing steps required by the invention are applied simultaneously to both n-channel and p-channel devices of the CMOS device pair.
Owner:CHARTERED SEMICONDUCTOR MANUFACTURING

Embedded silicon substrate fan-out type packaging structure and manufacturing method thereof

The invention discloses an embedded silicon substrate fan-out type packaging structure and a manufacturing method thereof. A silicon matrix is adopted to replace molding material to act as a fan-out matrix, and fine wiring can be manufactured by fully utilizing the advantages of the silicon matrix. Holes, grooves and other structures can be accurately etched by utilizing a mature silicon etching technology. Chips are embedded in the grooves on the silicon matrix, the gaps between the chips and the side walls of the grooves are filled by polymer glue and partial welded balls are welded at the surface of the silicon matrix in a fan-out way so that packaging reliability can be enhanced, the technology is simple and cost is low. The silicon matrix has great heat radiation and lower warping so that enhancement of packaging heat radiation is facilitated, adverse warping can be overcome and smaller wiring line width can be acquired, and thus the structure is suitable for high-density packaging. `Wafer plastic packaging and the de-bonding technology can be eliminated as for the aspect of technology so that technology difficulty can be reduced, and thus cost can be substantially reduced and yield rate can be enhanced.
Owner:HUATIAN TECH KUNSHAN ELECTRONICS

Poly-pyrrole minisize super capacitor based on MEMS technique and method for manufacturing the same

The invention discloses a polypyrrole minitype super capacitor in the range of the capacitor manufacturing technology based on MEMS technology and the preparation method thereof. The polypyrrole minitype super capacitor adopts the structure that a metal comb two-dimensional plane structure as a current collector is prepared on the surface of the silicon matrix by utilizing the micro-machining technology; a comb-shaped polypyrrole active electrode is prepared on the surface of the current collector by adopting the method of polypyrrole substance being prepared by the electric precipitation method; a layer of gel solid electrolyte is covered on the surface of the comb-shaped polypyrrole electrode and between a positive electrode and a negative electrode; and a layer of polyimide material is covered on the surface of the structure to accomplish the encapsulation of the minitype super capacitor. The MEMS-based manufacturing technology has the characteristic that the process is simple, and is suitable for mass manufacture. The minitype super capacitor has the advantages of small volume, high energy storage and stable performance, and is widely applicable to micro-robot electronic intelligence systems, chemical sensors, battlefield friend-or-foe identification devices, distributed type battlefield sensors and other fields.
Owner:TSINGHUA UNIV

Process for producing silicon-based carbon composite material for lithium ion battery cathode

Disclosed is a process for producing a silicon-based composite material for a lithium ion battery cathode. The process comprises that silicon powder serves as a main material, graphite powder or flocculent carbon black serves as an auxiliary material, the main material and the auxiliary material are mixed and placed in a ball-grinding steel tank, argon serves as a shielding gas, the ball-grinding steel tank inflated with the shielding gas is placed in a planetary ball mill, and powder with granularity of less than 20 mum, which is the silicon-based composite material for the lithium ion battery cathode, is obtained after the mixture is subjected to ball milling at 500 revolutions/minute for 80 hours. The process has the advantages that the silicon material having the good lithium-storing capacity is mixed with the carbon material having the good electrical conductivity, atomic-grade mixing of the silicon material and the carbon material is achieved in a mechanical alloying mode, the electrical conductively of the silicon matrix is fully improved, and the inert carbon material can reduce volume expansion caused by the processes of lithium intercalation and lithium deintercalation of the silicon material in the processes of charging and discharging of the inert carbon material, so that the cycle performance of the silicon material is improved, the electrical conductivity and the cycle performance of the carbon-doped material are better than those of the pure silicon material.
Owner:TIANJIN UNIVERSITY OF TECHNOLOGY

Back-contact solar cell and preparation method thereof

The invention relates to a back-contact solar cell. The cell comprises a P-type crystal silicon matrix, the back surface orderly comprises a tunneling oxide layer, back n+doped polycrystalline siliconregion and a laser slotting region in alternative arrangement, a passivation film, and a metal electrode from inside to outside; the metal electrode comprises a silver electrode in ohmic contact withback surface n+doped polycrystalline silicon region and an aluminum electrode in ohmic contact with back surface laser slotting region; the front surface is a p+doped region and a front surface passivation anti-reflection film from inside to outside in order. The solar cell disclosed by the invention has the advantages that the transmitter region on the back surface of the P-type crystalline silicon matrix adopts the n+doped polycrystalline silicon passivation layer, the back surface forms a p+region by adopting an aluminum paste and is passivated by using the aluminum oxide film, thereby realizing the passivation contact and field passivation effect of the back surface, the composite rate of the cell back surface is reduced, and the open-circuit voltage and the short-circuit current areimproved; the back p+region is formed by using the aluminum paste, in comparison with the traditional process, the one-step diffusion doping step is reduced, the process flow is simplified, and the cell cost is saved.
Owner:TAIZHOU ZHONGLAI PHOTOELECTRIC TECH CO LTD

Manufacturing method for crystalline silicon solar MWT (metallization wrap-through) cell and manufactured cell

The invention discloses a manufacturing method for a crystalline silicon solar MWT (metallization wrap-through) cell. The manufacturing method for the crystalline silicon solar MWT cell comprises the following steps of: producing a conductive through hole; performing wet-method texturization; performing grid line area phosphorous paste printing on a light-receiving surface; diffusing phosphorous; etching the edge of a silicon matrix, and performing PSG (phosphosilicate glass) removal treatment; coating an antireflection film, and printing an emitting electrode contact electrode, a back electrode contact electrode and a base electrode contact electrode; printing the electrode grid line of the light-receiving surface; sintering to form ohmic contact; and electrically insulating the base electrode contact electrode from the emitting electrode contact electrode, so as to finish production for the solar cell. According to the manufacturing method disclosed by the invention, a selective emitting electrode structure is realized on the MWT solar cell; and optical loss is effectively reduced, minority carrier recombination is reduced, various electrode-related resistance losses are reduced, and the short-circuit current ISC, the open-circuit voltage UOC and the filling factor of the cell are remarkable increased by combining with a back passivation technology and a secondary printing technology. The preparation process is easy to operate, capable of being completely compatible with the solar cell production line which is widely applied at present, and suitable for large-scale production.
Owner:EGING PHOTOVOLTAIC TECHNOLOGY CO LTD

Vinyl POSS (polyhedral oligomeric silsesquioxane) modified organic silicon resin, and preparation method and application thereof

The invention belongs to the technical field of modified organic silicon resin preparation, and discloses a vinyl POSS (polyhedral oligomeric silsesquioxane) modified organic silicon resin with excellent optical and thermodynamic properties, and a preparation method and application thereof in the fields of LED (light-emitting diode) packaging materials, coating materials, optical lens materials and the like. The resin comprises the following components in parts by weight: 100 parts of POSS graft modified polysiloxane polymer, 20-80 parts of vinyl silicon oil and 0.0002-0.005 part of catalyst. The cage-type vinyl POSS used as a crosslinking agent and hydrogen-containing silicon oil are subjected to silicon-hydrogen addition to be successfully grafted into the organic silicon matrix so as to obtain the POSS graft modified polysiloxane polymer, and the POSS graft modified polysiloxane polymer is mixed and cured to obtain the curing product. The method overcomes the defect of material strength decrease caused by aggregation in the conventional POSS physical blending process. The vinyl POSS modified organic silicon resin can be used for preparing the transparent packaging adhesive with excellent optical and thermodynamic properties; and the light transmittance is up to 95% above, and the refractivity is up to 1.442.
Owner:国科广化(南雄)新材料研究院有限公司 +1

Inorganic glass powder and preparation method for same, as well as conductive paste and preparation method for same

The invention discloses an inorganic glass powder and a preparation method for the same, wherein the component of the inorganic glass powder is MFX-Bi2O3-B2O3-SiO2-ZnO; when X is equal to 2, M is one or more of Be, Mg, Ca, Sr, Ba and Zn; when X is equal to 3, M is one or more of Al, Ga and In; and when X is equal to 4, M is one or more of Ti or Zr. The invention further provides a conductive paste and a preparation method for the same. The inorganic glass powder provided by the invention has good wettability for a metal powder and a silicon matrix; after the conductive paste containing a small amount of the inorganic glass powder is printed onto a monocrystalline silicon solar cell or a polycrystalline silicon solar cell via a silk screen and sintered to form a film, the binding layer of silicon and conductive metals is compact and uniform, the formed aluminium film is good in adhesion force with the silicon matrix, and the formed silver film is high in welding strength with a photovoltaic welding strip and good in appearance; and moreover, the paste is low in sintering peak temperature, low in energy consumption, and high in the obtained cell photoelectric conversion efficiency.
Owner:BYD CO LTD

High-efficiency extracting method of food-borne pathogen nucleic acid

The present invention provides a high-efficiency extracting method of food-borne pathogen nucleic acid. A PCR technology has been widely used for the detection of pathogenic microorganisms currently. A first step of the PCR detecting technology is the preparation of template nucleic acid, that is, the extraction of nucleic acid in a sample, which directly affects the result of PCR reaction. For a long time, the processes of extraction and purification of the nucleic acid in a sample consume time, and are fussy all the time, so detection speed is seriously slowed down. Thus, a plurality of scholars searches after the extracting method of various nucleic acids. The high-efficiency extracting method of food-borne pathogen nucleic acid comprises the following steps: bacterial culture solution is centrifuged; buffer solution A is added into centrifugal sediment to be vibrated, and muramidase is added; prolease K is added after incubation; buffer solution B is added to be incubated at the temperature of 65 DEG C for 10 minutes after being vibrated violently to be prepared into cracking solution; and high-quality nucleic acid is collected by an adsorption film of silicon matrix SiO2 material is used for extracting nucleic acid solution. The present invention is applied to the detection of the pathogenic microorganisms.
Owner:INSPECTION & QUARANTINE TECH CENT OF HEILONGJIANG ENTRY EXIT INSPECTION & QUARANTINE BUREAU OF P R C

N-type crystalline silicon solar cell structure and preparation method thereof

The invention discloses an N-type crystalline silicon solar cell structure and a preparation method thereof. The cell structure comprises a front electrode, a front anti-reflection film, a front passive film, a P-type emitting electrode, an N-type crystalline silicon matrix, a uniformly or partially doped N+ layer, a back passive film and a back electrode from top to bottom in sequence, wherein the front electrode comprises a partial hanging fine grid line, the partial hanging fine grid line is composed of a thin metal wire connected with a partial metal electrode through a conducting combined material, the partial metal electrode is arranged on the surface of the front anti-reflection film of the N-type cell in a regular pattern, and the partial metal electrode penetrates through the front anti-reflection film and the front passive film to be in good ohmic contact with the P-type emitting electrode. Currents collected on the front face of the cell are led out through a front main grid or an electrode lead. The back electrode is a full back metal electrode or a transparent electrode. According to the cell structure, the contact area of a metal and a silicon matrix is reduced, the composite loss is reduced, the light shading area of the grid line is obviously decreased, and then the conversion efficiency of the cell is improved.
Owner:LONGI SOLAR TECH (TAIZHOU) CO LTD

Back-contact heterojunction solar cell and preparation method thereof

The invention discloses a full-back type heterojunction solar cell. The full-back type heterojunction solar cell comprises a silicon matrix layer and is characterized in that a front N-type surface field and an antireflection layer are sequentially arranged on the front surface of the silicon matrix layer, an intrinsic amorphous silicon passivation layer is arranged on the back surface of the silicon matrix layer, P-type amorphous silicon layers and N-type amorphous silicon layers are arranged on the intrinsic amorphous silicon passivation layer in a spaced manner, transparent conductive film layers are separately arranged on the P-type amorphous silicon layers and the N-type amorphous silicon layers, electrodes are arranged on the transparent conductive film layers, each P-type amorphous silicon layer has the thickness of 5-20nm and the width of 100-1,000 microns, each N-type amorphous silicon layer has the thickness of 5-20nm and the width of 100-1,000 microns, the center point of adjacent P-type amorphous silicon layers is spaced from the center point of the corresponding N-type amorphous silicon layer by 150-3,000 microns, and insulation isolating layers are arranged between the P-type amorphous silicon layers and the N-type amorphous silicon layers. The invention also discloses a preparation method of the full-back type heterojunction solar cell. According to the back-contact heterojunction solar cell and the preparation method thereof, the generation of leakage current can be prevented, and the open-circuit voltage of the solar cell is boosted.
Owner:TRINASOLAR CO LTD
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