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436 results about "Heavy ion" patented technology

Method of multiple pulse laser annealing to activate ultra-shallow junctions

A method for forming a highly activated ultra shallow ion implanted semiconductive elements for use in sub-tenth micron MOSFET technology is described. A key feature of the method is the ability to activate the implanted impurity to a highly active state without permitting the dopant to diffuse further to deepen the junction. A selected single crystalline silicon active region is first amorphized by implanting a heavy ion such as silicon or germanium. A semiconductive impurity for example boron is then implanted and activated by pulsed laser annealing whereby the pulse fluence, frequency, and duration are chosen to maintain the amorphized region just below it's melting temperature. It is found that just below the melting temperature there is sufficient local ion mobility to secure the dopant into active positions within the silicon matrix to achieve a high degree of activation with essentially no change in concentration profile. The selection of the proper laser annealing parameters is optimized by observation of the reduction of sheet resistance and concentration profile as measured on a test site. Application of the method is applied to forming a MOS FET and a CMOS device. The additional processing steps required by the invention are applied simultaneously to both n-channel and p-channel devices of the CMOS device pair.
Owner:CHARTERED SEMICONDUCTOR MANUFACTURING

SRAM type FPGA single event upset effect simulation method

Disclosed is an SRAM type FPGA single event upset effect simulation method. The method includes the steps that firstly, design and process parameters of a device to be simulated are acquired; secondly, a three-dimensional geometrical shape of the device is constructed through a modeling tool, and doped areas, doping concentration, discretization strategies and the like of the device are set; thirdly, the design and process parameters of the device are calibrated according to an I-V characteristic curve of the device; fourthly, a meshed device structure is generated, and the mesh is refined on a channel, the light doped area and a PN junction border; fifthly, a device-level TCAD simulation method or a device-level TCAD and circuit-level Spice hybrid simulation method is selected according to the circuit scale and practical conditions of the device; sixthly, characteristics of incident heavy ions are acquired by using a radiating particle characteristic tool to conduct calculation; seventhly, physical model parameters, simulation time, boundary conditions and the like are set, and single event effect simulation of the device is carried out through a TCAD tool; eighthly, particles different in energy are selected to be simulated again according to simulation results; ninthly, the simulation results are acquired through a simulation data analysis tool.
Owner:CHINA ACADEMY OF SPACE TECHNOLOGY

Double-ion response type SERS (Surface Enhanced Raman Scattering) probe and preparation method thereof

InactiveCN103616367AEasy to separatePlay a role in purifying the environmentRaman scatteringNanotechnologyResponse typeSilicon dioxide
The invention discloses a double-ion response type SERS (Surface Enhanced Raman Scattering) probe and a preparation method thereof. The probe comprises two nano particles with independent core-shell structures, wherein a carrier nano particle comprises four layers of core-shell structures; the four layers of core-shell structures are as follows: the innermost layer is made of Fe3O4 magnetic nano balls, a layer of silicon dioxide is coated outside the innermost layer, the second-outer layer is a gold foil shell layer, and the outermost layer is an oligonucleotide coating layer; an object nano particle comprises two layers of core-shell structure; the two layers of core-shell structure are as follows: the inner core is made of Raman molecule marked gold nano-balls, and a shell is an oligonucleotide coating layer. Due to the adoption of a specific base sequence in the oligonucleotide coating layer, the identify and SERS trace detection on two metal ions, namely silver/mercury, in an environment solution can be performed at the same time; furthermore, under the action of an external magnetic field, the probe and the obtained silver/mercury ions can be rapidly separated from an initial environment solution system, and therefore, the function of purifying the environment is realized.
Owner:SOUTHEAST UNIV

Quantitative analysis method for heavy-ion single-particle multi-bit upset effect of device

ActiveCN105022859ARealize evaluation testMulti-Bit Toggle EliminationSpecial data processing applicationsComputer scienceHeavy ion
The present invention discloses a quantitative analysis method for a heavy-ion single-particle multi-bit upset effect of a device. The method comprises: selecting a type of heavy ions, setting an appropriate fluence rate according to a corresponding principle to perform radiation on a cover opening device, recording logic addresses and data of storage units, which perform single-particle upset, of the device by a test system, and stopping radiation when reaching an estimated single-particle upset number or the maximum ion fluence; establishing a mapping relationship from the logic addresses of the device to physical addresses, and according to a physical bit map, carrying out statistics on a number of single-particle upsets, a number of single-particle unit upset events and a number of multi-bit upset events; and by combining ion fluence, calculating parameters such as probabilities of the single-particle unit upset events and the multi-bit upset events, a multi-bit upset mean, a multi-bit upset cross section and the like. According to the quantitative analysis method for the heavy-ion single-particle multi-bit upset effect of the device, technical support and information can be provided for an anti-single-particle-upset reinforcement design of the device, and effectiveness of a reinforcement technology is verified and evaluated.
Owner:NORTHWEST INST OF NUCLEAR TECH

Gallium nitride Schottky diode and manufacturing method thereof

A manufacturing method of a GaN Schottky diode comprises the steps: providing a substrate; depositing a nucleating layer and / or a buffering layer on the substrate; depositing a heavy-doping n-type GaN layer on the nucleating layer and / or the buffering layer, and depositing a light-doping n-type GaN layer on the heavy-doping n-type GaN layer; arranging a plurality of p-type heavy-ion-doping GaN regions on the surface of the light-doping n-type GaN layer; depositing an insulation layer or a medium layer on the surface of the light-doping n-type GaN layer; defining a Schottky electrode region on the insulation layer, and trepanning the Schottky electrode region; depositing a Schottky electrode on the trepanned Schottky electrode region, wherein the Schottky electrode makes contact with the surface of the light-doping n-type GaN layer; defining an ohmic electrode region on the substrate, and trepanning the ohmic electrode region; depositing an ohmic electrode in the trepanned ohmic electrode region, wherein the ohmic electrode makes contact with the heavy-doping n-type GaN layer. The forward starting voltage of the Schottky diode is small, and a larger current can pass through in the forward direction; a leaked current in the backward direction is small, and larger voltage and power can be borne in the backward direction.
Owner:GPOWER SEMICON

Germanium-silicon heterojunction transistor single event effect test method based on heavy ion microbeam irradiation

The present invention provides a germanium-silicon heterojunction transistor single event effect test method based on heavy ion microbeam irradiation. The problems are mainly solved that a damaging mechanism cannot be directly represented and a sensitive region cannot be accurately located in the prior art. The implementation scheme of the method comprises the steps of: selecting a germanium-silicon heterojunction transistor sample to test electrical properties of the germanium-silicon heterojunction transistor sample; making and testing a PCB test board for irradiation, and performing de-encapsulation processing of a germanium-silicon heterojunction transistor device prior to test; assembling an irradiation platform; setting a test condition of a heavy ion microbeam irradiation test; performing beam ejecting position location of a heavy ion microbeam irradiation device; setting the type and the weight of incident heavy ions; developing the heavy ion microbeam irradiation test; and recoding and processing all the test data, and obtaining a single event effect sensitive region. The method provided by the invention can accurately locate the germanium-silicon heterojunction transistorsingle event effect sensitive region, can improve the experiment precision, can reduce the test cost and can be used for assessment of the astronavigation anti-radiation capacity for microelectronicdevices.
Owner:XIDIAN UNIV

Target design for high-power laser accelerated ions

Methods for designing a laser-accelerated ion beam are disclosed. The methods include modeling a system including a heavy ion layer, an electric field, and high energy light positive ions having a maximum light positive ion energy, correlating physical parameters of the heavy ion layer, the electric field, and the maximum light positive ion energy using the model, and varying the parameters of the heavy ion layer to optimize the energy distribution of the high energy light positive ions. One method includes analyzing the acceleration of light positive ions, for example protons, through interaction of a high-power laser pulse with a double-layer target using two-dimensional particle-in-cell (PIC) simulations and a one-dimensional analytical model. The maximum energy acquired by the accelerated light positive ions, e.g., protons, in this model depends on the physical characteristics of the heavy-ion layer—the electron-ion mass ratio and effective charge state of the ions. The hydrodynamic equations for both electron and heavy ion species solved and the test-particle approximation for the protons is applied. It was found that the heavy ion motion modifies the longitudinal electric field distribution, thus changing the acceleration conditions for the light positive ions.
Owner:FOX CHASE CANCER CENTER
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