Composite material comprising silicon matrix and method of producing the same

a technology of composite materials and silicon matrices, which is applied in the direction of liquid/solution decomposition chemical coating, instruments, record information storage, etc., can solve the problems of increasing production costs, requiring complex production steps, and limited reduction of equipment costs

Inactive Publication Date: 2012-12-20
JAPAN SCI & TECH CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0031]With use of a composite material comprising a silicon matrix according to the present invention, a method of producing a composite material comprising a silicon matrix according to the present invention, or an apparatus for producing the same, non-penetrating pores formed in a silicon surface layer are filled up with a metal or an alloy of the metal with less voids being left.

Problems solved by technology

However, in this technique, there arise problems such as limited decrease in cost in the entire equipment due to necessity of an alternating current power supply and the like.
However, this technique adopting the substrate in a special structure definitely requires the complex production steps and increase in production cost therefor.

Method used

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  • Composite material comprising silicon matrix and method of producing the same
  • Composite material comprising silicon matrix and method of producing the same
  • Composite material comprising silicon matrix and method of producing the same

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first embodiment

[0048]Described in the present embodiment are a composite material comprising a silicon matrix and a method of producing the same. FIG. 1 is a diagram illustrating a dispersion / allocation device 10 for dispersing and allocating first metal particles on a surface of a silicon substrate according to the present embodiment. FIG. 2 is a diagram illustrating a non-penetrating pore forming device 20 for forming non-penetrating pores in the surface of the silicon substrate. FIG. 3 is a diagram illustrating a filling device 30 for filling a second metal in the non-penetrating pores. The present embodiment adopts silver (Ag) as the first metal and cobalt (Co) as a second metal.

[0049]As shown in FIG. 1, in the present embodiment, a silicon substrate 100 is initially immersed for 30 seconds in an aqueous solution (hereinafter, also referred to as a first solution) 14 that is contained in a reservoir 12 and is preliminarily conditioned to 5° C. This aqueous solution 14 includes silver nitrate (...

second embodiment

[0055]Described in the present embodiment are another composite material comprising a silicon matrix and a method of producing the same. The method of producing the composite material comprising a silicon matrix according to the present embodiment is same as that of the first embodiment except for some conditions. Therefore, the description redundant with that of the first embodiment may not be repeatedly provided.

[0056]In the present embodiment, first metal particles of gold (Au) were dispersed and allocated on the surface of a silicon substrate with use of a dispersion / allocation device 10 configured as shown in FIG. 1. More specifically, the present embodiment adopts as a first solution an aqueous solution that is preliminarily conditioned to 5° C. and includes tetrachloroauric acid (HAuCl4) of a molarity equal to 1 mmol / L (millimole / liter) and hydrofluoric acid (HF) of a molarity equal to 150 mmol / L. Observed as a result was that gold (Au) fine particles 202 of diameters from 4 ...

third embodiment

[0060]Described in the present embodiment are a different composite material comprising a silicon matrix and a method of producing the same. Since the method of producing the composite material comprising a silicon matrix according to the present embodiment is same as that of the first embodiment except for some conditions. Therefore, the description redundant with that of the first embodiment may not be repeatedly provided.

[0061]In the present embodiment, first metal particles of silver (Ag) were dispersed and allocated on the surface of a silicon substrate with use of a dispersion / allocation device 10 configured as shown in FIG. 1. More specifically, the present embodiment adopts as a first solution an aqueous solution that is preliminarily conditioned to 5° C. and includes silver nitrate (AgNO3) of a molarity equal to 1 mmol / L (millimole / liter) and hydrofluoric acid (HF) of a molarity equal to 150 mmol / L.

[0062]Subsequently, the silicon substrate supporting the silver (Ag) fine pa...

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Abstract

Proposed are a composite material, wherein non-penetrating pores that are formed in a silicon surface layer are filled up with a metal or the like without leaving any voids by using the plating technique, and a method of producing the composite material. A composite material, which has been packed at a high accuracy, or in other words, in which little voids are left, can be obtained by filling up non-penetrating pores that are formed from a silicon surface (100) substantially with a second metal or an alloy of the second metal (106) with the use of the autocatalytic electroless plating technique wherein a first metal located at the bottom of the non-penetrating pores as described above serves as the starting point.

Description

CROSS REFERENCE TO RELATED APPLICATIONS[0001]The present application is a divisional of U.S. patent application Ser. No. 12 / 920,638, filed Dec. 9, 2010, which application is a national stage of International PCT Patent Application No. PCT / JP2009 / 053867, filed Mar. 2, 2009, which application claims priority to Japanese Patent Application No. 2008-054506, filed Mar. 5, 2008, which applications are each incorporated herein by reference in their entireties for all purposes.TECHNICAL FIELD[0002]The present invention relates to a composite material comprising a silicon matrix and a method of producing the same.BACKGROUND ART[0003]There have been conventionally studied surface treatment methods such as metal coating, nonmetal coating, and chemical conversion coating. So far, various functional composite materials have been created using a matrix of a metal provided on a surface thereof with a film of another metal.[0004]Plating is one of typical examples of the several surface treatment me...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): C23C18/54
CPCB82Y30/00C23C18/1619C23C18/1879G11B5/65G11B5/858Y10T428/24273Y10T428/24999Y10T428/249954Y10T428/12014Y10T428/12028C23C18/54
Inventor YAE, SHINJIHIRANO, TATSUYAMATSUDA, HITOSHI
Owner JAPAN SCI & TECH CORP
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