Manufacturing method of multilayer nanowire structure

A manufacturing method, nanowire technology, applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc.

Active Publication Date: 2013-09-11
SEMICON MFG INT (SHANGHAI) CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the crystal orientation of the multilayer nanowire structure formed by the above method is consistent with the crystal orientation of the semiconductor substrate, and cannot be freely selected according to actual needs.

Method used

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  • Manufacturing method of multilayer nanowire structure
  • Manufacturing method of multilayer nanowire structure
  • Manufacturing method of multilayer nanowire structure

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Embodiment Construction

[0026] In the following description, numerous specific details are given in order to provide a more thorough understanding of the present invention. It will be apparent, however, to one skilled in the art that the present invention may be practiced without one or more of these details. In other examples, some technical features known in the art are not described in order to avoid confusion with the present invention.

[0027] In order to thoroughly understand the present invention, detailed steps will be presented in the following description to illustrate the method for manufacturing the multilayer nanowire structure proposed by the present invention. Obviously, the practice of the invention is not limited to specific details familiar to those skilled in the semiconductor arts. Preferred embodiments of the present invention are described in detail below, however, the present invention may have other embodiments besides these detailed descriptions.

[0028] It should be unde...

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Abstract

The invention provides a manufacturing method of a multilayer nanowire structure. The manufacturing method comprises the following steps: a. providing a first silicon matrix and forming a first oxide layer on the first silicon matrix, b. providing a second silicon matrix, injecting hydrogen ions into the second silicon matrix, forming a position mark on the second silicon matrix, c. cutting the first silicon matrix intelligently and forming an insulator upper silicon structure on the first silicon matrix, d. forming a second oxide layer on the insulator upper silicon structure, e. repeating step b and step d, forming a multilayer insulator upper silicon structure on the first silicon matrix, f. defining the graph of the multilayer nanowire structure, g. etching the multilayer isolator upper silicon structure to form a multilayer nanowire structure on the first silicon matrix, and h. removing the second oxide layer under the nanowires in the multilayer nanowire structure. By means of the manufacturing method of the multilayer nanowire structure, the crystal orientations of the nanowires are different.

Description

technical field [0001] The invention relates to a semiconductor manufacturing process, in particular to a method for manufacturing a multilayer nanowire structure (Nanowire). Background technique [0002] According to Moore's law, the size of semiconductor devices is gradually reduced proportionally. In this case, in order to control the short channel effect more effectively, semiconductor devices with non-planar structures are widely used, such as fin field effect transistors (FinFET) and Nanowire Field Effect Transistor (Nanowire FET). [0003] Due to the on-state current I of the nanowire field effect transistor ON It is positively correlated with the number and length of the nanowires in the transistor, therefore, the performance of the field effect transistor with multilayer nanowire structure is more superior. The preparation of the multi-layer nanowire structure is usually to form a positioning mark or a mask on a semiconductor substrate with an interlayer dielectri...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/02H01L29/06
Inventor 王文博
Owner SEMICON MFG INT (SHANGHAI) CORP
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