7 results about "Smart Cut" patented technology

This invention discloses an intelligent cutting device for automotive parts production, relating to the field of plasma cutting technology. It includes a worktable with a gantry frame at its upper end, a robotic arm at the top of the gantry frame, a cooling assembly at the end of the robotic arm, a cutting head connected to the robotic arm within the cooling assembly, a dust removal assembly at the lower end of the cooling assembly, a rotating assembly between the cooling and dust removal assemblies, and angle adjustment components at the lower ends of both the cooling and dust removal assemblies. The dust removal assembly has a sleeve at its lower end. This invention uses the cooling assembly to cool the cutting area and cutting head, the dust removal assembly to remove waste gas generated during cutting, the rotating assembly to allow the water and air pipes to rotate synchronously, expanding the cooling and dust removal coverage, and the height adjustment assembly to control the distance between the working parts and the cutting surface, adapting to cutting operations of different curvatures and improving the device's versatility and operational flexibility.

Various engineered substrate techniques for gallium nitride devices are described that address limitations of conventional substrate approaches. For example, various techniques are described for implementing silicon carbide-on-poly-aluminum nitride (poly-AlN) and sapphire-on-poly-AlN engineered substrates using smart cut processes, hydrogen implantation and exfoliation, and advanced field management approaches to improve device performance while maintaining cost-effectiveness. The engineered substrates described provide the lattice matching and thermal benefits of silicon carbide or sapphire surfaces, for example, while utilizing the CTE matching and cost advantages of poly-AlN handle wafers. In addition, techniques are described for manufacturing high-voltage GaN devices with improved reliability, reduced dislocation density, enhanced thermal performance, and effective backside field management that may be difficult to achieve with conventional substrate approaches, while maintaining compatibility with established device fabrication processes and enabling monolithic integration of multiple device types on the same platform.

The invention relates to a method for preparing a substrate comprising a thin layer (3) of piezoelectric material transferred onto a support (5), the method being based on Smart Cut technology comprising an implantation step (S2) of a donor substrate (1) and an assembly step (S4). According to the invention, the preparation method includes, prior to the implantation step (S2), a plasma treatment step (Sp) comprising exposing the donor substrate (1) to a plasma of a neutral gas. Figure 2

This application relates to the field of sterilization bag cutting technology, specifically disclosing an intelligent cutting device with visual positioning, including a cutting machine, a paper-plastic composite roll, and a cutting mechanism. A visual sensor is installed on the inner wall of the cutting machine, and the paper-plastic composite roll is rotatably connected to the inner cavity of the cutting machine. A correction component is installed on the outer surface of the cutting machine. This invention, through the correction component, can automatically correct deviations caused by the paper-plastic composite roll's deviation or offset during the cutting process, significantly improving cutting accuracy and product consistency. Furthermore, it can issue an alarm in a timely manner when a large deviation occurs, facilitating timely maintenance by staff and preventing equipment damage. The chip removal component can clean up debris in real time during the cutting process, effectively preventing the accumulation of dust, burrs, and fine particles generated during the cutting of the paper-plastic composite roll. Real-time debris removal prevents it from entering the equipment, reducing component wear and minimizing downtime and maintenance costs.

A vibration sensor based on piezoelectric thin films, or smart cuts of piezoelectric materials, integrated into a functional, metallic housing that transmits vibration deformations applied to the housing correctly into the sensor in a frequency range that is typically—but not limited to—1 Hz to 20 kHz. The sensor comprises a low-stiffness layer, for instance a PCB layer, providing a controllable contact force between sensor structure machine parts, and transforming the relative movements into a mechanical stress acting onto the piezoelectric layer.

This invention discloses an intelligent cutting device for aluminum profiles, relating to the field of circular saw blade cutting table technology. It includes a cutting bed with two sets of grooving adjustment units symmetrically arranged above it. A cutting unit is movably arranged between the two sets of grooving adjustment units, enabling linear movement between them. Each grooving adjustment unit includes: an inner rectangular frame with an extension plate inside, one end of which is fixed and rotatably connected to the edge of the inner rectangular frame, and the other end being free and mounted within the inner rectangular frame via an adjustment assembly; an outer mounting plate parallel to and fixedly connected to the inner rectangular frame, with a moving unit on the outer mounting plate; and a pressure assembly positioned above the two sets of grooving adjustment units, located above the cutting unit. This invention allows adjustment of the inclination of the grooving bottom of the circular saw blade via the grooving adjustment units, ensuring that the cutting surface of the circular saw blade and the aluminum material is horizontal, thus reducing wear on the circular saw blade.