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14 results about "Smart Cut" patented technology

Smart cut is a technological process that enables the transfer of very fine layers of crystalline silicon material onto a mechanical support. It was invented by Michel Bruel of CEA-Leti, and is protected by US patent 5374564. The application of this technological procedure is mainly in the production of silicon-on-insulator (SOI) wafer substrates.

A self-rotating metal intelligent cutting system

The application discloses a self-rotating metal intelligent cutting system, which comprises a support, the lower end surface of which is placed on the ground through a base, the upper end surface of the support is fixed with an outer ring sleeve, the outer ring sleeve is rotationally connected with a rotating ring, and the rotating ring is provided with a positioning plate; an adjusting assembly is installed on the positioning plate, and a laser cutter is installed on the adjusting assembly and is arranged towards the center of the outer ring sleeve; a lens changing mechanism is integrated in the laser cutter, and the lens changing mechanism is used for switching two different specifications of focusing lenses to transmit and focus laser beams.
Owner:盐城斯凯奇自动化设备有限公司

A smart cutting device for automotive parts production

This invention discloses an intelligent cutting device for automotive parts production, relating to the field of plasma cutting technology. It includes a worktable with a gantry frame at its upper end, a robotic arm at the top of the gantry frame, a cooling assembly at the end of the robotic arm, a cutting head connected to the robotic arm within the cooling assembly, a dust removal assembly at the lower end of the cooling assembly, a rotating assembly between the cooling and dust removal assemblies, and angle adjustment components at the lower ends of both the cooling and dust removal assemblies. The dust removal assembly has a sleeve at its lower end. This invention uses the cooling assembly to cool the cutting area and cutting head, the dust removal assembly to remove waste gas generated during cutting, the rotating assembly to allow the water and air pipes to rotate synchronously, expanding the cooling and dust removal coverage, and the height adjustment assembly to control the distance between the working parts and the cutting surface, adapting to cutting operations of different curvatures and improving the device's versatility and operational flexibility.
Owner:四川进源机械有限公司

Engineered substrate techniques for gallium nitride devices

Various engineered substrate techniques for gallium nitride devices are described that address limitations of conventional substrate approaches. For example, various techniques are described for implementing silicon carbide-on-poly-aluminum nitride (poly-AlN) and sapphire-on-poly-AlN engineered substrates using smart cut processes, hydrogen implantation and exfoliation, and advanced field management approaches to improve device performance while maintaining cost-effectiveness. The engineered substrates described provide the lattice matching and thermal benefits of silicon carbide or sapphire surfaces, for example, while utilizing the CTE matching and cost advantages of poly-AlN handle wafers. In addition, techniques are described for manufacturing high-voltage GaN devices with improved reliability, reduced dislocation density, enhanced thermal performance, and effective backside field management that may be difficult to achieve with conventional substrate approaches, while maintaining compatibility with established device fabrication processes and enabling monolithic integration of multiple device types on the same platform.
Owner:ANALOG DEVICES INC

Intelligent slitting equipment for alloy thin strip

The utility model relates to intelligent alloy ribbon slitting equipment which comprises a rack, and a conveying mechanism and a cutting mechanism are arranged on the rack. The conveying mechanism comprises a conveying belt, the conveying belt is arranged at the top of the rack, and the conveying belt intermittently moves to convey the alloy thin strip needing to be cut to the cutting mechanism; the cutting mechanism comprises an upper laser head and a lower laser head, the upper laser head is used for emitting laser beams from the top, the lower laser head is used for emitting laser beams from the bottom, and therefore intelligent cutting of the alloy thin strip is completed. The conveying mechanism and the cutting mechanism are matched, so that intermittent conveying and cutting of the alloy thin strip are completed, the alloy thin strip is conveyed into the cutting mechanism at the beginning, after cutting is completed, the upper laser head and the lower laser head are away from each other, the laser heads are protected, and the conveying mechanism conveys the alloy thin strip into the cutting mechanism while the upper laser head and the lower laser head are away from each other. Therefore, circulating and reciprocating conveying and cutting are formed.
Owner:JIANGSU CHANGFENG ELECTRIC POWER TECH CO LTD

Method for preparing a substrate comprising a thin layer of piezoelectric material transferred onto a support

ActiveFR3164874B1Smart CutThin layer
The invention relates to a method for preparing a substrate comprising a thin layer (3) of piezoelectric material transferred onto a support (5), the method being based on Smart Cut technology comprising an implantation step (S2) of a donor substrate (1) and an assembly step (S4). According to the invention, the preparation method includes, prior to the implantation step (S2), a plasma treatment step (Sp) comprising exposing the donor substrate (1) to a plasma of a neutral gas. Figure 2
Owner:SOITEC SA

Intelligent cutting device for rail transit metal pipe handrail machining

The invention discloses an intelligent cutting device for rail transit metal pipe handrail machining, and relates to the technical field of pipe fitting laser cutting, the intelligent cutting device comprises a workbench, and further comprises a laser cutting mechanism installed at the top of the workbench; by installing the cutting precision control mechanism, the bending position of the pipe fitting is straightened. In the process of changing the bent pipe into a straight pipe, the distance between the two ends of the pipe is synchronously controlled, the pipe is prevented from being reset, and it is ensured that the pipe is kept in a linear state. The linear state of the pipe fitting can guarantee the precision during laser cutting, and the problems of cutting position deviation and inconsistent trepanning shapes caused by bending are avoided. In addition, the two ends of the pipe fitting are limited, and the situation that the pipe fitting falls and deforms due to the gravity of the pipe fitting and bends and deforms during pushing can be avoided. And meanwhile, when the pipe fitting is completely changed into a linear state, the pipe fitting is heated and repaired, and the pipe fitting is prevented from being bent and reset again after being cut.
Owner:NANTONG HUIPENG NEW MATERIAL TECH CO LTD

A smart cutting device with visual positioning

This application relates to the field of sterilization bag cutting technology, specifically disclosing an intelligent cutting device with visual positioning, including a cutting machine, a paper-plastic composite roll, and a cutting mechanism. A visual sensor is installed on the inner wall of the cutting machine, and the paper-plastic composite roll is rotatably connected to the inner cavity of the cutting machine. A correction component is installed on the outer surface of the cutting machine. This invention, through the correction component, can automatically correct deviations caused by the paper-plastic composite roll's deviation or offset during the cutting process, significantly improving cutting accuracy and product consistency. Furthermore, it can issue an alarm in a timely manner when a large deviation occurs, facilitating timely maintenance by staff and preventing equipment damage. The chip removal component can clean up debris in real time during the cutting process, effectively preventing the accumulation of dust, burrs, and fine particles generated during the cutting of the paper-plastic composite roll. Real-time debris removal prevents it from entering the equipment, reducing component wear and minimizing downtime and maintenance costs.
Owner:ANQING YIPAK PACKAGING MATERIAL CO LTD

Thin film lithium niobate electro-optical modulator with sectional type electrode structure

The invention provides a thin film lithium niobate electro-optical modulator with a segmented electrode structure, which belongs to the field of photoelectric integrated devices and is composed of a lithium niobate substrate, a silicon dioxide buffer layer, a thin film waveguide layer and a segmented electrode layer from bottom to top. Impedance matching is optimized, loss is reduced, and high-speed data transmission under low energy consumption is achieved. Through the segmented electrode design, the bandwidth and efficiency of the modulator are improved, stray capacitance and resistance are reduced, and electric field distribution is optimized. The device has remarkable advantages in the fields of high-speed optical communication, photoelectric integrated circuits and the like, and has huge application potential in the emerging fields of quantum communication and the like. The preparation process relates to a plurality of processes, such as SMART CUT, buffer proton exchange, photoetching and the like, so that the performance and the stability of the device are ensured.
Owner:罗雪婷

Flexible, piezoelectric, miniaturized vibration sensor for machine integration

A vibration sensor based on piezoelectric thin films, or smart cuts of piezoelectric materials, integrated into a functional, metallic housing that transmits vibration deformations applied to the housing correctly into the sensor in a frequency range that is typically—but not limited to—1 Hz to 20 kHz. The sensor comprises a low-stiffness layer, for instance a PCB layer, providing a controllable contact force between sensor structure machine parts, and transforming the relative movements into a mechanical stress acting onto the piezoelectric layer.
Owner:PIEMACS SARL

Method for preparing a substrate comprising a thin layer of piezoelectric material transferred to a carrier

PCT designated stageWO2026017336A1Semiconductor/solid-state device manufacturingSmart CutThin layer
The invention relates to a method for preparing a substrate comprising a thin layer (3) of piezoelectric material transferred to a carrier (5), the method being based on Smart Cut technology and comprising a step (S2) of implanting a donor substrate (1) and a joining step (S4). According to the invention, the preparation method comprises, before the implantation step (S2), a plasma treatment step (Sp) that comprises exposing the donor substrate (1) to a neutral gas plasma.
Owner:SOITEC SA

A smart cutting device for processing metal tube handrails in rail transit

This invention discloses an intelligent cutting device for processing metal tube handrails in rail transit, relating to the field of tube laser cutting technology. It includes a worktable and a laser cutting mechanism mounted on top of the worktable. The invention straightens the bent position of the tube by installing a cutting precision control mechanism. During the process of straightening the tube from a bent state, the distance between the two ends of the tube is simultaneously controlled to prevent the tube from reverting to its original position and ensure it remains straight. The straightness of the tube ensures the accuracy of laser cutting and avoids problems such as cutting position deviation and inconsistent opening shapes caused by bending. Furthermore, restricting the two ends of the tube prevents deformation due to its own weight and bending deformation during pushing. Simultaneously, when the tube is completely straight, it is heated and repaired to prevent it from bending back to its original position after cutting.
Owner:NANTONG HUIPENG NEW MATERIAL TECH CO LTD

Intelligent cutting device for energy-saving mute door and window machining

PendingCN121156364AMetal sawing devicesLaser scanningSmart Cut
The invention provides an intelligent cutting device for energy-saving mute door and window machining, and belongs to the technical field of profile cutting. Comprising a cutting platform, a cutting mechanism is installed on one side of the cutting platform, and a laser scanner is installed on one side of the cutting mechanism; and the auxiliary assembly is used for assisting in fixing and cutting the broken bridge aluminum profile, and the auxiliary assembly is connected with the cutting platform. By arranging the auxiliary assembly, a worker can conveniently take and place the broken bridge aluminum profile, the broken bridge aluminum profile can be fixed after being placed, and certain support is provided for the broken bridge aluminum profile according to the structural characteristics of the broken bridge aluminum profile.
Owner:HEILONGJIANG XINMUGEN ENERGY SAVING DOORS & WINDOWS CO LTD

A smart cutting device for aluminum profiles

This invention discloses an intelligent cutting device for aluminum profiles, relating to the field of circular saw blade cutting table technology. It includes a cutting bed with two sets of grooving adjustment units symmetrically arranged above it. A cutting unit is movably arranged between the two sets of grooving adjustment units, enabling linear movement between them. Each grooving adjustment unit includes: an inner rectangular frame with an extension plate inside, one end of which is fixed and rotatably connected to the edge of the inner rectangular frame, and the other end being free and mounted within the inner rectangular frame via an adjustment assembly; an outer mounting plate parallel to and fixedly connected to the inner rectangular frame, with a moving unit on the outer mounting plate; and a pressure assembly positioned above the two sets of grooving adjustment units, located above the cutting unit. This invention allows adjustment of the inclination of the grooving bottom of the circular saw blade via the grooving adjustment units, ensuring that the cutting surface of the circular saw blade and the aluminum material is horizontal, thus reducing wear on the circular saw blade.
Owner:JIANGSU WEIYE ALUMINUM MATERIAL