19 results about "Smart Cut" patented technology

The application discloses a self-rotating metal intelligent cutting system, which comprises a support, the lower end surface of which is placed on the ground through a base, the upper end surface of the support is fixed with an outer ring sleeve, the outer ring sleeve is rotationally connected with a rotating ring, and the rotating ring is provided with a positioning plate; an adjusting assembly is installed on the positioning plate, and a laser cutter is installed on the adjusting assembly and is arranged towards the center of the outer ring sleeve; a lens changing mechanism is integrated in the laser cutter, and the lens changing mechanism is used for switching two different specifications of focusing lenses to transmit and focus laser beams.

The invention discloses a cutting scheme optimization method and system for a strip-shaped temperature-adjusting material and electronic equipment, and relates to the technical field of intelligent cutting of temperature-adjusting materials. The method comprises the steps that the capacity of a recycling machine and size information of a to-be-cut strip-shaped temperature adjusting material are obtained; based on the capacity of the recovery machine and the size information of the to-be-cut strip-shaped temperature adjusting material, a fitness function is constructed; based on the fitness function, determining an optimal cutting scheme of the to-be-cut strip-shaped temperature adjusting material by utilizing a genetic algorithm; and the to-be-cut strip-shaped temperature adjusting material is cut based on the optimal cutting scheme. According to the method, the optimal cutting scheme of the strip-shaped temperature-adjusting material is determined through the genetic algorithm, the efficiency and precision of determining the cutting scheme of the strip-shaped temperature-adjusting material can be improved, and meanwhile, the automation level of strip-shaped temperature-adjusting material cutting is improved.

This invention discloses an intelligent cutting device for automotive parts production, relating to the field of plasma cutting technology. It includes a worktable with a gantry frame at its upper end, a robotic arm at the top of the gantry frame, a cooling assembly at the end of the robotic arm, a cutting head connected to the robotic arm within the cooling assembly, a dust removal assembly at the lower end of the cooling assembly, a rotating assembly between the cooling and dust removal assemblies, and angle adjustment components at the lower ends of both the cooling and dust removal assemblies. The dust removal assembly has a sleeve at its lower end. This invention uses the cooling assembly to cool the cutting area and cutting head, the dust removal assembly to remove waste gas generated during cutting, the rotating assembly to allow the water and air pipes to rotate synchronously, expanding the cooling and dust removal coverage, and the height adjustment assembly to control the distance between the working parts and the cutting surface, adapting to cutting operations of different curvatures and improving the device's versatility and operational flexibility.

Various engineered substrate techniques for gallium nitride devices are described that address limitations of conventional substrate approaches. For example, various techniques are described for implementing silicon carbide-on-poly-aluminum nitride (poly-AlN) and sapphire-on-poly-AlN engineered substrates using smart cut processes, hydrogen implantation and exfoliation, and advanced field management approaches to improve device performance while maintaining cost-effectiveness. The engineered substrates described provide the lattice matching and thermal benefits of silicon carbide or sapphire surfaces, for example, while utilizing the CTE matching and cost advantages of poly-AlN handle wafers. In addition, techniques are described for manufacturing high-voltage GaN devices with improved reliability, reduced dislocation density, enhanced thermal performance, and effective backside field management that may be difficult to achieve with conventional substrate approaches, while maintaining compatibility with established device fabrication processes and enabling monolithic integration of multiple device types on the same platform.

The utility model relates to intelligent alloy ribbon slitting equipment which comprises a rack, and a conveying mechanism and a cutting mechanism are arranged on the rack. The conveying mechanism comprises a conveying belt, the conveying belt is arranged at the top of the rack, and the conveying belt intermittently moves to convey the alloy thin strip needing to be cut to the cutting mechanism; the cutting mechanism comprises an upper laser head and a lower laser head, the upper laser head is used for emitting laser beams from the top, the lower laser head is used for emitting laser beams from the bottom, and therefore intelligent cutting of the alloy thin strip is completed. The conveying mechanism and the cutting mechanism are matched, so that intermittent conveying and cutting of the alloy thin strip are completed, the alloy thin strip is conveyed into the cutting mechanism at the beginning, after cutting is completed, the upper laser head and the lower laser head are away from each other, the laser heads are protected, and the conveying mechanism conveys the alloy thin strip into the cutting mechanism while the upper laser head and the lower laser head are away from each other. Therefore, circulating and reciprocating conveying and cutting are formed.

The invention relates to a method for preparing a substrate comprising a thin layer (3) of piezoelectric material transferred onto a support (5), the method being based on Smart Cut technology comprising an implantation step (S2) of a donor substrate (1) and an assembly step (S4). According to the invention, the preparation method includes, prior to the implantation step (S2), a plasma treatment step (Sp) comprising exposing the donor substrate (1) to a plasma of a neutral gas. Figure 2

The invention discloses an intelligent cutting device for rail transit metal pipe handrail machining, and relates to the technical field of pipe fitting laser cutting, the intelligent cutting device comprises a workbench, and further comprises a laser cutting mechanism installed at the top of the workbench; by installing the cutting precision control mechanism, the bending position of the pipe fitting is straightened. In the process of changing the bent pipe into a straight pipe, the distance between the two ends of the pipe is synchronously controlled, the pipe is prevented from being reset, and it is ensured that the pipe is kept in a linear state. The linear state of the pipe fitting can guarantee the precision during laser cutting, and the problems of cutting position deviation and inconsistent trepanning shapes caused by bending are avoided. In addition, the two ends of the pipe fitting are limited, and the situation that the pipe fitting falls and deforms due to the gravity of the pipe fitting and bends and deforms during pushing can be avoided. And meanwhile, when the pipe fitting is completely changed into a linear state, the pipe fitting is heated and repaired, and the pipe fitting is prevented from being bent and reset again after being cut.

This application relates to the field of sterilization bag cutting technology, specifically disclosing an intelligent cutting device with visual positioning, including a cutting machine, a paper-plastic composite roll, and a cutting mechanism. A visual sensor is installed on the inner wall of the cutting machine, and the paper-plastic composite roll is rotatably connected to the inner cavity of the cutting machine. A correction component is installed on the outer surface of the cutting machine. This invention, through the correction component, can automatically correct deviations caused by the paper-plastic composite roll's deviation or offset during the cutting process, significantly improving cutting accuracy and product consistency. Furthermore, it can issue an alarm in a timely manner when a large deviation occurs, facilitating timely maintenance by staff and preventing equipment damage. The chip removal component can clean up debris in real time during the cutting process, effectively preventing the accumulation of dust, burrs, and fine particles generated during the cutting of the paper-plastic composite roll. Real-time debris removal prevents it from entering the equipment, reducing component wear and minimizing downtime and maintenance costs.

The invention provides a thin film lithium niobate electro-optical modulator with a segmented electrode structure, which belongs to the field of photoelectric integrated devices and is composed of a lithium niobate substrate, a silicon dioxide buffer layer, a thin film waveguide layer and a segmented electrode layer from bottom to top. Impedance matching is optimized, loss is reduced, and high-speed data transmission under low energy consumption is achieved. Through the segmented electrode design, the bandwidth and efficiency of the modulator are improved, stray capacitance and resistance are reduced, and electric field distribution is optimized. The device has remarkable advantages in the fields of high-speed optical communication, photoelectric integrated circuits and the like, and has huge application potential in the emerging fields of quantum communication and the like. The preparation process relates to a plurality of processes, such as SMART CUT, buffer proton exchange, photoetching and the like, so that the performance and the stability of the device are ensured.

A vibration sensor based on piezoelectric thin films, or smart cuts of piezoelectric materials, integrated into a functional, metallic housing that transmits vibration deformations applied to the housing correctly into the sensor in a frequency range that is typically—but not limited to—1 Hz to 20 kHz. The sensor comprises a low-stiffness layer, for instance a PCB layer, providing a controllable contact force between sensor structure machine parts, and transforming the relative movements into a mechanical stress acting onto the piezoelectric layer.

The invention relates to a method for preparing a substrate comprising a thin layer (3) of piezoelectric material transferred to a carrier (5), the method being based on Smart Cut technology and comprising a step (S2) of implanting a donor substrate (1) and a joining step (S4). According to the invention, the preparation method comprises, before the implantation step (S2), a plasma treatment step (Sp) that comprises exposing the donor substrate (1) to a neutral gas plasma.

The present invention discloses an intelligent cutting device and a cutting method for titanium alloy structural parts, including: analyzing the temperature gradient change rate based on the temperature distribution data and determining the key areas prone to oxidation reaction in combination with geometric features to obtain the target monitoring area data; obtaining the reflection spectrum information of the cutting area and the comparison spectrum information of the adjacent uncut area according to the target monitoring area data to obtain the spectral feature data; performing spatio-temporal collaborative analysis on the spectral feature data, extracting the spectral feature change value and combining it with the diffusion rate of the oxidation reaction to obtain the oxidation state prediction data; adjusting the cutting power in regions according to the oxidation state prediction data and dynamically compensating the flow field parameters of the shielding gas to perform the cutting of the titanium alloy structural parts. The technical solution of the present invention realizes the dynamic prediction and precise control of the oxidation reaction through spectral monitoring and spatio-temporal collaborative analysis, solves the problem of unstable laser energy coupling caused by surface oxidation reaction, and ensures the cutting quality.

This invention discloses an intelligent cutting device for processing metal tube handrails in rail transit, relating to the field of tube laser cutting technology. It includes a worktable and a laser cutting mechanism mounted on top of the worktable. The invention straightens the bent position of the tube by installing a cutting precision control mechanism. During the process of straightening the tube from a bent state, the distance between the two ends of the tube is simultaneously controlled to prevent the tube from reverting to its original position and ensure it remains straight. The straightness of the tube ensures the accuracy of laser cutting and avoids problems such as cutting position deviation and inconsistent opening shapes caused by bending. Furthermore, restricting the two ends of the tube prevents deformation due to its own weight and bending deformation during pushing. Simultaneously, when the tube is completely straight, it is heated and repaired to prevent it from bending back to its original position after cutting.

A monolithic silicon Josephson junction can be fabricated from a silicon wafer using semiconductor technologies such as gas immersion laser doping and smart cut technology. Rather than using a superconducting metal for the junction electrodes, silicon that has been highly doped with boron can serve as the superconducting material for the electrodes of the Josephson junction. A region of the silicon wafer that has not been doped serves as the tunnel barrier. Fabrication of the Josephson junction does not require a metallization process since the electrodes and tunnel barrier are formed from highly doped silicon and non-doped silicon, respectively. The single-crystal structure of the resulting Josephson junction yields low two-level system (TLS) noise.

The invention provides an intelligent cutting device for energy-saving mute door and window machining, and belongs to the technical field of profile cutting. Comprising a cutting platform, a cutting mechanism is installed on one side of the cutting platform, and a laser scanner is installed on one side of the cutting mechanism; and the auxiliary assembly is used for assisting in fixing and cutting the broken bridge aluminum profile, and the auxiliary assembly is connected with the cutting platform. By arranging the auxiliary assembly, a worker can conveniently take and place the broken bridge aluminum profile, the broken bridge aluminum profile can be fixed after being placed, and certain support is provided for the broken bridge aluminum profile according to the structural characteristics of the broken bridge aluminum profile.

This invention discloses an intelligent cutting device for aluminum profiles, relating to the field of circular saw blade cutting table technology. It includes a cutting bed with two sets of grooving adjustment units symmetrically arranged above it. A cutting unit is movably arranged between the two sets of grooving adjustment units, enabling linear movement between them. Each grooving adjustment unit includes: an inner rectangular frame with an extension plate inside, one end of which is fixed and rotatably connected to the edge of the inner rectangular frame, and the other end being free and mounted within the inner rectangular frame via an adjustment assembly; an outer mounting plate parallel to and fixedly connected to the inner rectangular frame, with a moving unit on the outer mounting plate; and a pressure assembly positioned above the two sets of grooving adjustment units, located above the cutting unit. This invention allows adjustment of the inclination of the grooving bottom of the circular saw blade via the grooving adjustment units, ensuring that the cutting surface of the circular saw blade and the aluminum material is horizontal, thus reducing wear on the circular saw blade.

The invention discloses a diamond film GaN HEMT preparation method based on an intelligent cutting technology, and relates to the technical field of semiconductor devices.According to the method, a monocrystal diamond film is transferred through the intelligent cutting technology, and compared with traditional heteroepitaxial growth of polycrystalline diamond, the heat conductivity of the diamond film is increased, and the heat conductivity of the monocrystal diamond film is improved; therefore, the heat dissipation capability of the GaN HEMT is improved. By changing the injection energy and the injection dosage of hydrogen ion injection, the thickness of the monocrystal diamond film can be accurately regulated and controlled.

The invention relates to the technical field of semiconductor material processing, in particular to a silicon carbide substrate basal plane dislocation defect detection and regeneration system and method.The detection and regeneration method comprises the steps that a silicon carbide substrate is divided into an edge exposure area and a center mask protection area, and photoetching mask coating and gradient concentration corrosion are conducted; performing graded scanning on a silicon carbide substrate area by using a weight factor method; cutting parameters are calculated, and laser cutting is conducted; sequentially carrying out crushing separation, acid pickling purification and high-temperature calcination on the wastes to generate silicon carbide regenerated powder, and refeeding the silicon carbide regenerated powder into a semiconductor production line; the detection and regeneration system is applied to the method, the silicon carbide substrate is subjected to cooperative control of mask corrosion, dynamic detection, intelligent cutting and waste regeneration processes, the corrosion time and the detection time are shortened, the percent of pass is increased, and the material loss is reduced.