Vinyl POSS (polyhedral oligomeric silsesquioxane) modified organic silicon resin, and preparation method and application thereof

A vinyl silicone oil and vinyl technology, which is applied in coatings, electrical components, circuits, etc., can solve the problems that the performance cannot meet the use requirements well, achieve excellent thermodynamics, overcome the decline in material strength, and have a simple preparation method Effect

Inactive Publication Date: 2014-11-19
国科广化(南雄)新材料研究院有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Chinese patent application CN103113592A has reported a kind of preparation method of polyfunctional group POSS modified silicone rubber, and this method is to introduce the POSS containing single/double/three/four active functional gr...

Method used

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  • Vinyl POSS (polyhedral oligomeric silsesquioxane) modified organic silicon resin, and preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] Embodiment 1: Preparation of vinyl POSS modified silicone resin encapsulation glue

[0032] (1) In a three-necked reaction flask equipped with a reflux condenser, a mechanical stirrer, and a constant pressure dropping funnel, add 0.5 parts by weight of octavinyl POSS (Aladdin reagent), 100 parts by weight of hydrogen-containing silicone oil (hydrogen content 0.5 %) (Guangzhou Xinhou CY202), 100 parts by weight of toluene, stir evenly, under the protection of nitrogen, add 0.0002 parts by weight of Karl's catalyst (1,3-divinyl-1,1,3,3-tetramethyl disiloxane platinum (0)), then heated to reflux for 1h, and rotary steamed to obtain POSS grafted modified polysiloxane polymer.

[0033] (2) Preparation of encapsulant: Mix 100 parts by weight of POSS grafted modified polysiloxane polymer and 20 parts by weight of vinyl silicone oil (Dongguan Hongyi HY205J), and add 0.0002 parts by weight of Karl's catalyst (1, 3-divinyl-1,1,3,3-tetramethyldisiloxane (platinum (0)), stir evenl...

Embodiment 2

[0034] Embodiment 2: Preparation of vinyl POSS modified silicone resin encapsulation glue

[0035] (1) In a three-necked reaction flask equipped with a reflux condenser, a mechanical stirrer, and a constant pressure dropping funnel, add 5 parts by weight of vinyl POSS, 100 parts by weight of hydrogen-containing silicone oil (0.5% hydrogen content), 300 parts by weight of Toluene, stirred evenly, under the protection of nitrogen, 0.0008 parts by weight of Karl Fischer catalyst was added, then heated to reflux for 5 hours, and then rotary steamed to obtain POSS grafted modified polysiloxane polymer.

[0036] (2) Preparation of encapsulant: Mix 100 parts by weight of POSS grafted modified polysiloxane polymer and 40 parts by weight of vinyl silicone oil evenly, add 0.0008 parts by weight of Karl Fischer catalyst, stir well and pour into preheated In the mold, remove the air bubbles and place it for 18 hours, then solidify according to the curing process of 80°C for 1.5h and 150°C...

Embodiment 3

[0037] Embodiment 3: Preparation of vinyl POSS modified silicone resin encapsulation glue

[0038] (1) In a three-necked reaction flask equipped with a reflux condenser, a mechanical stirrer, and a constant pressure dropping funnel, add 10 parts by weight of vinyl POSS, 100 parts by weight of hydrogen-containing silicone oil (0.5% hydrogen content), 500 parts by weight of Toluene, stirred evenly, under the protection of nitrogen, 0.0005 parts by weight of Karl Fischer catalyst was added, then heated to reflux for 10 hours, and rotary steamed to obtain POSS grafted modified polysiloxane polymer.

[0039] (2) Preparation of encapsulant: Mix 100 parts by weight of POSS grafted modified polysiloxane polymer and 80 parts by weight of vinyl silicone oil evenly, add 0.005 parts by weight of Karl Fischer catalyst, stir well and pour into preheated In the mold, remove air bubbles, place it for 24 hours, and then perform curing according to the curing process of 80°C for 2h and 150°C fo...

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Abstract

The invention belongs to the technical field of modified organic silicon resin preparation, and discloses a vinyl POSS (polyhedral oligomeric silsesquioxane) modified organic silicon resin with excellent optical and thermodynamic properties, and a preparation method and application thereof in the fields of LED (light-emitting diode) packaging materials, coating materials, optical lens materials and the like. The resin comprises the following components in parts by weight: 100 parts of POSS graft modified polysiloxane polymer, 20-80 parts of vinyl silicon oil and 0.0002-0.005 part of catalyst. The cage-type vinyl POSS used as a crosslinking agent and hydrogen-containing silicon oil are subjected to silicon-hydrogen addition to be successfully grafted into the organic silicon matrix so as to obtain the POSS graft modified polysiloxane polymer, and the POSS graft modified polysiloxane polymer is mixed and cured to obtain the curing product. The method overcomes the defect of material strength decrease caused by aggregation in the conventional POSS physical blending process. The vinyl POSS modified organic silicon resin can be used for preparing the transparent packaging adhesive with excellent optical and thermodynamic properties; and the light transmittance is up to 95% above, and the refractivity is up to 1.442.

Description

technical field [0001] The invention belongs to the technical field of preparation of modified silicone resins, in particular to a vinyl POSS modified silicone resin with excellent optical and thermodynamic properties and a preparation method thereof and its application in the fields of LED packaging materials, coating materials, optical lens materials, etc. Applications. Background technique [0002] Due to the advantages of high efficiency, energy saving, environmental protection, long life, easy maintenance, small size and high reliability, LED has become the most promising green lighting source in the 21st century. With the advancement of LED technology, LED packaging materials have become an important factor restricting its performance. Traditional epoxy resin packaging materials can no longer meet the requirements of high-power LED packaging due to their shortcomings such as easy yellowing at high temperatures and poor UV resistance. Silicone resins have excellent the...

Claims

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Application Information

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IPC IPC(8): C08L51/08C08L83/07C08F283/12C08F130/08H01L33/56C09D151/08C09D183/07
Inventor 吕满庚张燕张云飞梁利岩
Owner 国科广化(南雄)新材料研究院有限公司
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