2results about How to "Reduce internal losses" patented technology

The invention discloses an integrated optical chip, a preparation method and an optical gyroscope, the integrated optical chip comprises a first device layer and a second device layer, the first device layer is provided with a phase modulator, the phase modulator comprises a fourth waveguide used for connecting an interference ring, and the second device layer is provided with a detection unit. The detection unit comprises a first coupler and a detector, the first coupler comprises a first waveguide, a second waveguide and a third waveguide, the first waveguide is used for connecting a light source, the first waveguide is connected with the third waveguide, the second waveguide is connected with the third waveguide, and the third waveguide is connected with the phase modulator; the detector is connected with the second waveguide; wherein the second device layer comprises a first sub-device layer and a second sub-device layer, the coupling loss of the first sub-device layer is larger than that of the second sub-device layer, at least part of the detector is located on the first sub-device layer, and the first coupler is located on the second sub-device layer.

This invention discloses a patterned substrate and its fabrication method, as well as an epitaxial wafer for a light-emitting diode (LED), relating to the field of semiconductor optoelectronic devices. The patterned substrate includes a substrate body, a metal reflective layer, and multiple pyramidal protrusions. The substrate body has a first surface and a second surface disposed opposite to each other; the metal reflective layer covers the first surface; the multiple pyramidal protrusions are uniformly distributed on the metal reflective layer; each pyramidal protrusion includes a first AlN layer and a SiO2 layer sequentially stacked on the metal reflective layer. Implementing this invention can improve the luminous efficiency of the LED.