Preparation process of high-density imbricated module

A preparation process, high-density technology, applied in sustainable manufacturing/processing, electrical components, semiconductor devices, etc., can solve the problems of low effective output power, long production line, and many production steps of photovoltaic components, so as to improve optical gain. , Low internal loss, and the effect of improving component power

Inactive Publication Date: 2019-05-07
JETION SOLAR HLDG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The existing manufacturing method of shingled modules needs to pre-weld the battery sheets into a solar cell layer, and then lay the solar cell layer with tempered glass and solar cell encapsulation adhesive film. There are many manufacturing steps, resulting in a long production line. The production efficiency is low, and the effective output power of the photovoltaic group is low

Method used

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  • Preparation process of high-density imbricated module

Examples

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Comparison scheme
Effect test

Embodiment 1

[0046] A preparation process for high-density shingled components, the preparation process comprising the following steps:

[0047] (1) Prepare a number of busbar-free cells, and use a laser scribing machine to cut the busbar-free cells to obtain a number of busbar-free cell slices;

[0048] (2) The two busbar-free cell slices obtained in step (1) are overlapped and serially connected from the beginning to the end to obtain a battery string. The front and back sides of the busbar-free cell slices include overlapping areas. The area is coated with conductive glue, and the battery slices without busbar are connected in series through conductive glue to obtain battery strings, and two battery strings are obtained according to the above method;

[0049] (3) Connect the two strings of battery strings obtained in step (2) into a long string of batteries through copper wire ribbons, and weld one end of the copper wire ribbon to the front side of the last battery slice without busbar ...

Embodiment 2

[0056] A preparation process for high-density shingled components, the preparation process comprising the following steps:

[0057] (1) Prepare a number of busbar-free cells, and use a laser scribing machine to cut the busbar-free cells to obtain a number of busbar-free cell slices;

[0058] (2) The six busbar-free battery slices obtained in step (1) are overlapped and connected in series from the beginning to the end to obtain a battery string. The front and back sides of the busbar-free battery slices include overlapping areas. The area is coated with conductive glue, and the battery slices without busbar are connected in series through conductive glue to obtain a battery string, and 6 battery strings are obtained according to the above method;

[0059] (3) Solder the 6 battery strings obtained in step (2) into a long string of batteries through tinned copper wire ribbons, and connect one end of the tinned copper wire ribbon to the last non-busbar cell of a string of battery...

Embodiment 3

[0066] A preparation process for high-density shingled components, the preparation process comprising the following steps:

[0067] (1) Prepare a number of busbar-free cells, and use a laser scribing machine to cut the busbar-free cells to obtain a number of busbar-free cell slices;

[0068] (2) The 10 busbar-free battery slices obtained in step (1) are overlapped and serially connected from the beginning to the end to obtain a battery string. The front and back sides of the busbar-free battery slices include overlapping areas. The area is coated with conductive glue, and the battery slices without busbar are connected in series through conductive glue to obtain battery strings, and 10 battery strings are obtained according to the above method;

[0069] (3) The 10 battery strings obtained in step (2) are serially welded into a long string of batteries through tin-lead copper wire ribbons, and one end of the tin-lead copper wire ribbon is connected to the last piece of battery ...

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Abstract

The invention discloses a preparation process of a high-density imbricated module. The preparation process comprises the following steps of: preparation of a slice without a main grid cell; preparation of a battery string; preparation of a long string of cells; preparation of an imbricated module; primary EL test; laminated packaging; framing and assembling of the junction box; and secondary LE test. The obtained high-density imbricated module improves the utilization rate of the defective pieces and improves the module power through a mode of reducing the battery area and reducing the currentmismatching loss, the battery pieces are sliced to be connected in series by employing conductive paste to remove the distance between the battery pieces so as to greatly save the assembling space, the innovative electrical design without the main grid is employed to reduce the internal loss of the module, effectively improve the output power of the single module and improve the module conversionefficiency, and therefore, the preparation process of the high-density imbricated module has an considerable competitiveness and is expected to occupy the mainstream position in the market.

Description

technical field [0001] The invention relates to the technical field of photovoltaic modules, in particular to a preparation process of high-density shingled modules. Background technique [0002] With the depletion of conventional fossil energy and the deterioration of the ecological environment, the energy crisis has become the main contradiction in the current international social and economic development. In order to solve this major crisis, all countries in the world are working hard to explore new energy sources. Constantly pouring into the earth's permanent energy - solar energy. With the development of solar energy in recent years, the competition has become increasingly fierce. High efficiency and low cost have become the basis for the survival of solar energy companies. The efficiency of modules of foreign advanced companies has exceeded 22.0%, and domestic leading companies are also investing heavily in research and development to catch up. [0003] With the rapid...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L31/18H01L31/048H01L31/05
CPCY02E10/50Y02P70/50
Inventor 孙烨金富强杨冬生刘燕胡燕
Owner JETION SOLAR HLDG
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