Method for laser polishing of glass and polishing processing method of glass hole and glass sheet

Abstract

The invention provides a method for laser polishing of glass and a polishing processing method of a glass hole and a glass sheet. The method comprises the following steps of: irradiating a cutting contour line arranged on a glass plate by adopting first laser, and then cutting off the glass along the cutting contour line; and irradiating along a polishing contour line which is 0.3-1.2mm close to the cutting contour line by adopting second laser, and evaporating the glass on the two sides of the polishing contour line to obtain a polished glass product, wherein the second laser is CO2 continuous laser. According to the method, the defects of micro-cracks of a section caused by a conventional cutting mode can be overcome; the polishing contour line is directly irradiated by the CO2 continuous laser, so that glass bodies on the two sides of the polishing contour line are evaporated and removed, a smooth glass side section is obtained, and the mechanical property of the glass is improved;and the method can be applied to edge treatment of glass drilling, inner contour and outer contour, the plane quality of the side surface is optimized, and the potential fragment risk of the subsequent process is solved.

Description

technical field [0001] The invention relates to a glass processing method, in particular to a laser polishing glass method and a polishing processing method for glass holes and glass flakes. Background technique [0002] Glass material is one of the commonly used materials for electronic display devices at present, and is mainly used to make display panels, rear cover covers, etc. Conventional glass cover processing is to use a large size of glass raw material to produce a glass cover through cutting, polishing, hot bending, chemical strengthening and other processes. Among them, the cutting process, the commonly used processing methods are CNC processing and laser cutting processing. CNC processing technology has been developed for a long time, the technology is very mature, and the equipment price is relatively low, which is suitable for mass production. However, CNC processing also has some disadvantages, such as cutting fluid contamination of the glass needs to be clea...

AI Technical Summary

Problems solved by technology

The conventional method of using pulsed laser to process through holes is to use the high energy of the pulsed laser spot to irradiate the glass to remove the material in the focus area, and to move the spot to make the irradiation area stack and accumulate to form a complete hole shape, because the side wall is composed of the spot stack. Therefore, there is an uneven microstructure. In addition, the pulse laser has a large peak power and high energy, which will cause microcracks inside the glass.

If the processed side is not polished, after the subsequent chemical strengthening, its surface defects may be affected by the internal stress of the glass, which may cause fragmentation, and there is also a risk of fragmentation in the subsequent ball drop performance test and long-term use.

[0005] Chinese patent application CN107520545A: A laser drilling method, which discloses the method of using UV laser to process holes on PCB boards, but does not explain the quality of the hole wall and the improvement method

The existing patent does not specify the processing quality of the hole wall, nor does it further deal with the cracks and depressions in the hole wall after processing

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