1474 results about "Failure analysis" patented technology

A new and improved method for the probing of integrated circuits (ICs) and is particularly suitable for probing various elements of an IC for failure analysis or other electrical testing and/or measurement of the IC. The method includes providing a probe access trench in the IMD (intermetal dielectric) or other substrate adjacent to the circuit element to be tested and then providing direct electrical contact between the test probe and the sidewall of the element through the trench, during the testing process. Such direct electrical contact between the test probe and the sidewall of the element prevents excessively high contact resistance which may otherwise occur in the use of a probing pad between the test probe and the element.

The invention relates to a system and a method for realizing automatic network failure analysis based on SDN technology. The system comprises one SDN controller and multiple SDN switches. The SDN controller realizes real-time detection and cycle detection of each link in network topology, and monitors states of the SDN switches in real time and maintains the global network topology. The SDN controller comprises an OpenFlow module, an OpenFlow extension module, an event module, a topology module and a detection module. The detection module comprises a real-time detection module and a cycle detection module. With the system and the method, the whole network can be monitored, and network failure analysis is realized.

A prognostic processor for predicting machine failure in avionics electronics comprises prognostic capabilities in a single integrated circuit, with a processor, volatile and non-volatile memory, clock, on-chip and off-chip sensors and transducers, A/D converters, a common I/O interface adapted to be employed in a network of similar prognostic processors, and predictive Failure Analysis (FA) model software, which may be distributed throughout the network. The FA software employs a log file history, with the log file history storing data collected by the prognostic processor, real-time execution of a predictive model, with the ability to update the FA model with data from field failures. The prognostic processor network supports hierarchical processing to work with multiple prognostic processors. The prognostic processor system is applicable to FA monitoring of a wide range of avionics electronic equipment, in particular, Line Replacement Units (LRUs).

Fault trees are automatically converted to Bayesian networks for assisting in system reliability, failure analysis and diagnostics by using information from the fault tree structure to create the Bayesian network structure, creating parameters of the Bayesian network using information from the fault tree, obtaining information about observation nodes for the Bayesian network from a list of observations that augments information contained in the fault tree, and inserting the observation nodes into the Bayesian network. The fault tree is pre-processed into an intermediate format prior to conversion that may include adding reliability values from a separate text document when the fault tree is in such format that requires it.

An integrated FIB/PEM apparatus and method for performing failure analysis on integrated circuits. In-situ failure analysis is enabled by integrating Photon Emission Microscopy into a Focused Ion Beam system, thereby improving throughput and efficiency of Failure Analysis. An iterative method is described for identifying and localizing fault sites on the circuit.

The present invention provides an improved method of handling product recall activities through traceability. One embodiment of the present invention involves gathering data in a multi-layered database architecture containing supply, process, test, and customer layers. The data is supplied to a traceability module which contains a search engine to link and access the data. The search engine enables a search by part number, lot number, serial number, time stamp, and date/time frame. A traceability analysis is generated from the search, allowing failure analysis of the data. This analysis is performed through an event list over the entire supply, manufacturing, and customer data, facilitating backward and forward traceability of parts and components of the parts. This failure analysis further facilitates automatic response such as automatic warning and automatic recall to manufacturers and customers.

The present invention relates to a method for realizing real-time remote malfunction analysis of vehicle through GPS positioning and mobile communication. When a failure code is generated or a certain data flow exceeds the preset threshold value, warning information is generated and is transmitted to the vehicle-mounted terminal with GPS positioning and mobile communication functions through serial-port communication. The vehicle-mounted terminal can transmit the warning information transmitted by the present failure analysis module and present vehicle position to a background processing center through mobile communication network. The background processing center transmits the failure information and position information through a proxy server and displays the interface of vehicle client. The invention breaks through the wired mode of traditional hand-holding vehicle failure diagnostic device, real-time monitors the vehicle condition with the mobile communication network, and transmits the failure information to the background processing center and vehicle client.

A diagnosability system for automatically collecting, storing, communicating, and analyzing diagnostic data for one or more monitored systems. The diagnosability system comprises several components configured for the collection, storage, communication, and analysis of diagnostic data for a condition detected in monitored system. The diagnosability system enables targeted dumping of diagnostic data so that only diagnostic data that is relevant for diagnosing the condition detected in the monitored system is collected and stored. This in turn enables first failure analysis thereby reducing the time needed to resolve the condition detected in the monitored system.

A multiwavelength imaging and spectroscopic photoemission microscope system (100) which simultaneously provides images in a broad range of the electromagnetic spectrum, such as between 200 nm-1000 nm (optical or visible light) and 1000 nm-500 nm (infrared light). The multiwavelength imaging and spectroscopic photoemission microscope system comprises a microscope (102), a spectrometer (106), a beam splitter (108), a first spectrum focal plane array (110) including an appropriate photodiode (114A), a second spectrum focal plane array (120) including an appropriate photodiode (114B), and a cryogenic vessel (160) to maintain relevant portions of the system at a very low temperature. The invention may be used in failure analysis of integrated circuits and in semiconductor and low temperature physics.

The invention relates to a device and method for vibration measurement and failure analysis of a rolling bearing. The device comprises a detected bearing mounting device, a speed sensor, a signal conditioning circuit, a data collection device and a computer, wherein a detected bearing is mounted on a mandrel of the detected bearing mounting device; a vibration rod of the speed sensor is arranged on a middle plane of an outer cylindrical surface of an outer ring of the detected bearing with prescribed pressure, the measurement direction is along the radial direction of the bearing and vertical to the axis of the bearing, and the signal conditioning circuit and the data collection device are connected to the computer; the speed sensor measures radial vibration speed signals of the outer ring of the bearing, the picked bearing radial vibration speed signals are converted into corresponding electric signals which are processed by the signal conditioning circuit and then transferred to the data collection device which carries out A/D conversion of the conditioned signals to convert the conditioned signals into digital signals capable of being processed by the computer, and finally the computer carries out analysis and processing of the digital signal. The device and the method are applicable to production test and user acceptance of finished bearings by laboratories and bearing manufacture factories.

A method and system are provided that minimize wafer or package level test time without adversely impacting yields in downstream manufacturing processes or degrading outgoing quality levels. The method provides optimization by determining, a priority, the most effective set of tests for a given lot or wafer. The invention implements a method using a processor-based system involving the integration of multiple sources of data that include: historical and realtime, product specific and lot specific, from wafer fabrication data (i.e., process measurements, defect inspections, and parametric testing), product qualification test results, physical failure analysis results and manufacturing functional test results. These various forms of data are used to determine an optimal set of tests to run using a test application sequence, on a given product to optimize test time with minimum risk to yield or product quality.

Failure analysis method and apparatus using failure rate data in coordination with the power on hours to more efficiently resolve computer system failures without occupying system memory or processor bandwidth. In response to a system failure, a baseboard management controller (BMC) notes the time of failure and the elapsed operating time of system components. In response to a failure of the computer system, the BMC accesses industry standard failure rate data correlating the elapsed operating time with the probability of failure for each component. By cross-referencing the time of failure with the failure rate data, the BMC automatically determines the probability of failure of each component at the time of failure of the computer system. The BMC generates a component replacement list identifying the component that currently has the highest probability of failure.

The invention relates to an acquisition failure analyzing and processing method of an electricity utilization information acquisition operating and maintaining system. The acquisition failure analyzing and processing method comprises region failure discovery and analysis and equipment failure discovery and analysis, wherein the region failure discovery and analysis comprises the following steps: 1, counting terminal online rate per hour, if a statistical value is lower than a normal period terminal online rate threshold, forming failure grouping; 2, analyzing region failures according to a number of terminals, a number of affected uses and valid user number information by counting the terminal online rate and a communication operator influence degree; 3, determining a failure order of severity according to a failure scale and a failure range, showing a failure region distribution condition on a GIS (Geographic Information System) graph. The equipment failure discovery and analysis comprises the following step of discovering and analyzing a terminal failure and an electricity meter failure. The acquisition failure analyzing and processing method of the electricity utilization information acquisition operating and maintaining system comprises the following steps: synchronizing a newest file of a marketing system to an electricity utilization information acquisition system by a main station, and sending a processing instruction out. The acquisition failure analyzing and processing method of the electricity utilization information acquisition operating and maintaining system can be used for monitoring the failure and intelligently analyzing and processing the failure.

Systems and methods for removing material from a packaged electronic device of the type encapsulated with a protective material that forms an outer surface of the device. An exemplary system includes a stage for placing the device in a first position for receiving laser radiation to remove the material by ablation, and for placing the device in a second position for viewing one or more features along the outer surface of the device. An optical system is configured to provide an exterior image, including one or more features along an exposed surface of the device, while the device remains in the second position. A viewing system displays a captured image of the device, including one or more features interior to the protective surface, overlayed with the exterior image for simultaneous viewing of both images so that a position of a first feature present in the captured image can be viewed in relation to a position of a second feature in the exterior image. The combination of the first feature position and the second feature position can be used to define a region of the device for material removal with a laser. In an associated method a captured image of the device is provided, the image including one or more features interior to the protective surface. One or more features along the outer surface of the device are viewed with an optical system while the device remains on a stage, the optical system providing an exterior image. The captured image is combined with the exterior image for simultaneous viewing so that the position of a first feature present in the captured image can be viewed in relation to the position of a second feature in the exterior image. A region is defined for decapsulation based on the position of the first feature relative to the position of the second feature.

A business tuning system collects streams of informational reports from remote renewable energy systems. A database holds the information and associates it with a particular renewable energy business operation. A pre-processor semi-structures the information into failure analyses, sales histories, performance results, regional trends, seasonal trends, and demographics. A data mining processor provides for knowledge discovery and prediction from semi-structured information related to said particular renewable energy business operation.

The invention provides a method for analyzing chip failure, which is used for detecting defect characteristics of a chip grid and comprises the following steps: removing most of a substrate and an active region of a chip to be subjected to failure analysis through mechanical grinding; removing the remained substrate and active region of the chip through wet etching; removing most of a gate oxide layer of the chip through dry etching, wherein the remained gate oxide layer is used for protecting a first polysilicon layer of the grid; and detecting whether the defect characteristics exist on thefirst polysilicon layer or not. By utilizing the method provided by the invention, the chip can be accurately stripped to the bottom of the first polysilicon layer of the grid, the accurate size parameters of the bottom of the first polysilicon layer can be measured, the working efficiency can be greatly improved, and the time can be saved.

The invention relates to a method and a device for generating a virtual installation model (2) as an image of a real installation (1). As a database therefor, digital picture data (4) representing pictures of a real installation (1) on the one hand and installation components (13) of a component library (6) on the other hand are used. The data of the installation components as well as the digital picture data (4) of the real installation (1) is evaluated by means of an image analysis (5). Based on this analysis, the identified installation components (13) are assigned to the virtually generated installation model (2). The virtual image of the real installation thus created serves to document the actual structure of the installation/facility, to simplify failure analysis, e.g., in areas that are difficult to access, and/or to operate and monitor the installation/facility. In addition to geometric data, functional data, etc. of the installation components are also stored.

An MCP has an MCP substrate, first and second semiconductor chips mounted on the MCP substrate, MCP leads connected to perimeter of the MCP substrate. MCP terminal wires disposed on the MCP substrate connect the MCP leads to the first semiconductor chip. Interface signal wires disposed on the MCP substrate connect the first and second semiconductor chips to each other. The MCP further has first and second extra bonding pads. The first extra bonding pad electrically connects to the interface signal wires. The second extra bonding pad electrically connects to the MCP leads. The second extra bonding pad is arranged near the first extra bonding pad. The first and second extra bonding pads are designed to be electrically isolated from each other in a normal usage condition. However, the first and second extra bonding pads are electrically connected to each other when failure analysis is required. Outputs from the port circuit and the MCP port circuit are inhibited by a control circuit mounted on the first semiconductor chip, so that a signal can be exchanged between the second semiconductor chip and an external circuit without using the first semiconductor chip. In this manner, the first and second extra bonding pads are electrically connected to each other, so that the second semiconductor chip can be analyzed, electrically independently of the first semiconductor chip.