230results about "Radiofrequency circuit testing" patented technology

The invention discloses a radio frequency on-chip test system and a radio frequency on-chip test method. The radio frequency on-chip test system comprises a probe temperature adjusting module, an instantaneous pulse acquisition module, a dynamic compensation module, a thermal isolation module, radio frequency measurement equipment and a bearing platform. Wherein the probe temperature adjusting module is used for independently adjusting the temperature of a probe to a target value; the instantaneous pulse acquisition module is used for transmitting a radio frequency pulse signal and acquiring a radio frequency parameter when the probe is in contact with the normal temperature calibration sheet; the dynamic compensation module dynamically corrects the radio frequency parameters based on the real-time temperature of the probe; the thermal isolation module is used for reducing heat exchange between the probe and the external environment; the radio frequency measuring equipment is used for collecting and analyzing the radio frequency parameters; the bearing platform is used for bearing the normal temperature calibration sheet or the device to be tested. Through the synergistic effect of multiple modules, the problem of test errors caused by temperature fluctuation is effectively solved, and the precision and stability of radio frequency on-chip test are remarkably improved.

A measurement system includes a signal analysis circuit, a signal generator circuit, a control circuit, and a DUT connector. The DUT connector is connectable to a device under test for receiving a measurement signal outputted by the DUT. The signal analysis circuit is connected to the DUT connector for receiving the measurement signal. The signal generator circuit is configured to generate a radio frequency (RF) test signal that is transmitted to the DUT. The signal analysis circuit is configured to digitize the measurement signal, thereby obtaining a digitized measurement signal. The control circuit is configured to control the signal generator circuit to generate the RF test signal based on the digitized measurement signal, based on known error parameters of an error model of the measurement system, and based on a desired reflection coefficient at a reference plane associated with the DUT.

The invention provides a microwave superheterodyne frequency sweep measurement system based on Rydberg atoms, and belongs to the technical field of microwave frequency measurement. The laser module excites detection light of 780 nm and coupling light of 480 nm, and the two beams of light are reversely input into the atomic gas chamber through the dichroscope; signal microwaves are generated by a radio frequency signal source and are radiated to the position of the atomic gas chamber through the horn antenna; local oscillation microwaves are generated by the microwave module and are also radiated to the position of the atomic gas chamber through the horn antenna; the atomic gas chamber serves as a mixer to form a difference frequency signal; the spectrum analyzer is used for monitoring low-frequency difference frequency signals generated in the frequency mixing process in real time and recording signal intensity in real time. According to the invention, high-precision and wide-band microwave frequency measurement is realized, continuous and smooth frequency sweeping response can be provided in a frequency range, and absolute frequency detection of microwave signals is realized under the condition that a complex frequency comb technology is not introduced. The hardware architecture is simplified, the automation degree is improved, and integration, popularization and application are facilitated.

A system comprises a signal generator circuit configured to generate a modulated radio frequency (RF) signal based on a predefined waveform. An output signal path is connected to the signal generator circuit and is connectable to a device under test. A first signal path is connected to the signal generator circuit so as to receive a reference signal corresponding to the modulated RF signal. A second signal path is connectable to the device under test so as to receive a measurement signal from the device under test. A analysis signal path is connected to the first and second signal paths for merging the reference signal and the measurement signal into an analysis signal. A signal analysis circuit is configured to separate the reference signal from the measurement signal for analyzing the analysis signal based on the predefined waveform.

Aspects of this disclosure relate to a power amplifier system with symbol-based envelope tracking and fault protection. The system can include a power amplifier and a voltage modulator. The voltage modulator can include switches configured to provide the bias voltage and to provide electric circuit breaker protection. The voltage modulator can include a fault detection circuit that can cause a switch of the switches to provide electric circuit breaker protection in response to detecting a circuit fault. Related methods and voltage modulators are disclosed.

The invention discloses a method for eliminating interference of isolator chip radiation on a radio frequency system, which can measure the frequency of a low-frequency RC oscillator in a chip wafer test stage or a packaged finished product test stage, flexibly burn a corresponding frequency control signal of a storage unit according to the requirement of a client product communication system, and improve the reliability of the radio frequency system. Therefore, the local frequency and the harmonic frequency of the isolator chip are adjusted, so that the isolator chip can avoid the communication frequency band of a client. According to the method, a low-temperature-drift RC oscillation circuit is combined with a frequency-locked loop technology, and it is guaranteed that the frequency deviation of a local oscillation signal is controlled within 3% in different process deviations and a full-temperature range. Besides, the frequency of the high-frequency oscillator is accurately adjusted until the frequency is close to the target frequency, and the configuration parameters are stored in the nonvolatile storage module, so that the isolator chip does not interfere with other communication systems in the actual working process, and the stability and the reliability of the whole communication system are improved.

Systems and methods for direct-to-RF (radio frequency) software-defined radio implementation of an active load-pull system are provided. A system may include a controller, a primary field-programmable gate array (FPGA) to control and collect waveform data from vector signal analyzers (VSAs), each comprising an analog-to-digital converter (ADC) connected to an ADC signal-conditioning circuit to directly capture RF measurements of an input signal at an RF fundamental frequency of test and harmonics, each ADC signal-conditioning circuit altering a signal amplitude and isolating a wanted RF frequency of measurement at either the RF fundamental frequency of test or a harmonic to be received by its ADC, first and second couplers generating each input signal by extracting forward and reverse traveling waves at RF from input and output ports of a device under test (DUT), the VSAs capturing the input signals directly at the RF fundamental frequency of test or a harmonic.

The invention discloses a 5G microwave amplifier performance test method based on automatic spectrum analysis, and relates to the technical field of data analysis, by introducing a disturbance excitation and recovery behavior comparison mechanism, the short-time dynamic response of an amplifier spectrum is actively induced, the point-by-point difference of a reference spectrum, a disturbed spectrum and a recovery spectrum is analyzed, and the performance of a 5G microwave amplifier is tested. A response-recovery ratio indicator is constructed to identify a local indentation region that is difficult to perceive in the steady-state spectrum. Compared with a traditional method depending on a frequency spectrum smoothing strategy, the method has the advantages that the problem of slight indentation in a high-frequency bandwidth is easy to cover, specific frequency point response is excited through frequency perturbation, power fluctuation or narrow-band interference, and the disturbance response and recovery capability difference of the amplifier become an evaluation basis; therefore, the recognition accuracy of nonlinear response and early failure characteristics is improved, and the stability pre-judgment capability of the 5G amplifier is enhanced.

A fault diagnosis method for the RF front-end circuit of a MIMO system includes using a Synchronous Enhancement Extracting Transform (SEET) to pre-process the acquired fault signal to extract fault feature, creating a fault identification model fused by a complex field based asymmetric convolutional neural network and a complex field based multi-head attention module to assign fault feature weights, extract key feature and identify fault status. The SEET can extract fault feature components, and calculate its real field feature and imaginary field feature to obtain a real field two-dimensional matrix i and an imaginary field two-dimensional matrix q, thus an enhanced time-frequency feature is obtained. The fault identification model is used for a transform from a complex field feature space to a high dimensional space and realizing the assignment of fault feature weights, key features extraction and fault status identification.

The invention discloses a frequency mixer test method, and relates to the technical field of microwave radio frequency test, and the method comprises the following steps: S1, building a test platform; s2, calibrating the test platform; s3, testing indexes; and according to the received reflection signal and standing wave signal, port isolation test, frequency conversion loss test, port standing wave test and output 1dB compression point test are carried out on the mixer to be tested, and a test curve of each index is drawn after the test is completed. According to the method, all key indexes of the mixer can be tested at different power frequency points through one-time calibration, meanwhile, standing wave testing of the LO port under high power can be achieved, the testing efficiency and accuracy are greatly improved, and the technical problems that in the prior art, multiple times of calibration are needed in the testing process, and the testing efficiency is low are solved.

Disclosed is a test device for testing an electric characteristic of an object to be tested. The test device includes a block comprising a probe hole, a probe supported in the probe hole and retractably configured to connect a first contact point and a second contact point, and a coaxial cable comprising an insulated sheath, a main core surrounded with the insulated sheath, and a probe contact portion exposed from the insulated sheath and extended from the main core so as to be in contact with the probe. An axis of the probe is spaced apart from an axis of the coaxial cable, and the probe contact portion is extended from the main core toward the axis of the probe.

Capture time-correlated signals for SI / PI analysis. [Solution] The signal and power analyzer includes a high-bandwidth input channel set as a real-equivalent-time (RET) input channel or a radio frequency (RF) channel, an input channel set as a low-bandwidth real-time (RT) input channel, one or more analog-to-digital converters (ADCs) having multiple pipes, a first set of pipes connected to the high-bandwidth input channel and generating high-bandwidth data, a second set of pipes connected to the low-bandwidth RT input channel and generating low-bandwidth RT data, a system clock circuit 54 connected to the high-bandwidth input channel and the low-bandwidth RT input channel, a memory 34 connected to the system clock circuit 54, the first set of pipes and the second set of pipes, and one or more processors that store the low-bandwidth RT data and high-bandwidth data in the memory 34 and reconcile the high-bandwidth data and low-bandwidth data.

The invention discloses a testing device for a multichannel millimeter wave radio frequency chip, and relates to the technical field of radio frequency chip testing. The device comprises a structural body, a multilayer circuit board fixed on the structural body, and a waveguide cover plate combined with the structural body to form a waveguide. A substrate integrated waveguide and a strip line are integrated in the multilayer circuit board, and vertical conversion between a waveguide signal and an onboard signal is realized through a waveguide-microstrip transition structure. Through the integrated and double-sided design of the structural body, the multilayer board and the radio frequency link, the substrate integrated waveguide is used for vertical transmission of radio frequency signals, and the strip line is used for transmitting power supply and control signals, so that the problems that a traditional testing device is large in size, and ports of a W-waveband multichannel chip are dense and not easy to test are effectively solved; miniaturization, high integration and test convenience of the test device are realized.

A measurement system for active load traction testing and an active load traction measurement method are described. The measurement system comprises a signal analysis module, a signal generator module, a control module and a DUT connector. The DUT connector may be connected to a device under test to receive an output signal of the device under test. The signal analysis module is connected to the DUT connector such that the signal analysis module receives a measurement signal corresponding to the output signal. The signal generator module is configured to generate a radio frequency (RF) test signal. The signal generator module is connected to the DUT connector such that the RF test signal is applied to the device under test. The signal analysis module is configured to digitize the measurement signal to obtain a digitized measurement signal. The control module is configured to control the signal generator module to generate the RF test signal based on the digitized measurement signal, based on known error parameters of an error model of the measurement system, and based on a desired reflection coefficient at a reference plane associated with the device under test.

A computer-controlled load pull tuner is embedded in a quarter-circle waveguide-to-wafer-probe adapter and creates a compact and handy assembly. The tuner includes two, along the 90-degree arc of the waveguide, sliding carriages, each holding a tuning probe inserted at fixed penetration without cumbersome vertical axis mechanisms. The carriages holding the tuning probes are spring preloaded against the waveguide wall and can tilt, when hitting a stop, lifting the tuning probes out of the waveguide cavity, thus allowing for a low residual reflection and high transmission behavior. On top of full load pull capacity, the assembly can be used for instantaneous s-parameter measurement when the tuning probes are lifted. High-speed calibration and tuning algorithms allow efficient operation.

The present invention discloses a method for eliminating the interference of isolator chip radiation on the radio frequency system. The method can measure the frequency of the low-frequency RC oscillator during the chip wafer test or the finished product test stage after packaging, and flexibly burn the corresponding frequency control signal of the storage unit according to the needs of the customer's product communication system to adjust the local oscillator frequency and its harmonic frequency of the isolator chip to avoid the customer's communication frequency band. This method uses a low-temperature drift RC oscillator circuit combined with frequency-locked loop technology to ensure that the frequency deviation of the local oscillator signal is controlled within 3% within different process deviations and the full temperature range. In addition, by accurately adjusting the frequency of the high-frequency oscillator until it is close to the target frequency, and storing these configuration parameters in a non-volatile storage module, the isolator chip will not interfere with other communication systems during actual operation, thereby improving the stability and reliability of the entire communication system.

The invention relates to the technical field of resonators, in particular to a resonator parameter analysis method and system based on artificial intelligence, and the method comprises the steps: generating an ideal coupling matrix of a target resonator according to the center frequency, the passband bandwidth and the in-passband return loss; acquiring a corresponding relationship among an external quality factor, a coupling coefficient between resonant cavities, a coupling window width and a resonant cavity length through electromagnetic simulation or theoretical calculation, constructing a training data set, and training a regression model to predict the coupling window width; obtaining an external quality factor and a coupling coefficient of a target frequency band by utilizing baseband-passband transformation, solving the width of each coupling window through a prediction model, calculating the length of a resonant cavity by combining interpolation and scale transformation to form an initial size, establishing a three-dimensional simulation model to extract a coupling matrix, and iteratively correcting the length of the resonant cavity according to diagonal elements, so as to obtain an initial size; and obtaining a final physical size meeting the index. According to the method, the problems that an existing resonator design and parameter analysis process depends on experience, the number of simulation iterations is large, and the parameter reverse solving efficiency is low can be solved.

This document describes a test fixture for PCB components. The test fixture includes a pad with holes configured to direct RF energy from the component on the PCB through an end of the PCB to a top clamp of the test fixture. The end of the PCB may correspond to a cut line for destructive testing. The test fixture also includes a top clamp with a test port and a tapered shape configured to direct RF energy from the holes to the test port. The test fixture also includes a bottom clamp attached to the top clamp to hold the PCB between the top and bottom clamps for testing. The test fixture allows for rapid mounting of the PCB and test component without modifying the PCB design or requiring specific drilling of the PCB.

A technique for calibrating signal currents in a radio frequency signal generator system, such as an arbitrary waveform generator system, is provided. The device includes a current measurement circuit and a current imbalance correction circuit. The current measurement circuit is configured to measure a first current in a first signal path of a radio frequency signal generator and a second current in a second signal path of the radio frequency signal generator during a calibration process. The current imbalance correction circuit is configured to adjust a current level in at least one of the first signal path and the second signal path of the radio frequency signal generator to compensate for an imbalance between the measured first current and the measured second current.

The invention belongs to the technical field of chip module testing, and particularly relates to a microwave chip module testing clamp device. A base; the base is arranged at one end fixedly connected to the top of the base; the two sets of limiting mechanisms are arranged on the top of the base and used for fixing the microwave chip module, and the base is electrically connected with the microwave chip module; the heat dissipation mechanism is arranged in the base; by arranging the heat dissipation mechanism, in the power-on test process, the temperature sensor detects that the temperature of the bottom of the chip module is higher than a certain threshold value, a temperature signal is transmitted to the system through the temperature sensor, the system controls a circulating water pump and a fan to be started, and cooling liquid in a cooling box is circularly conveyed into a cooling pipe through the circulating water pump; and then cold air is blown to the microwave chip module through the exhaust holes by the fan for cooling and heat dissipation of the microwave chip module, so that the function of rapid cooling and heat dissipation of the microwave chip module is realized.

An example process determines a first error vector magnitude (EVM) of a signal output by a device under test (DUT). The process includes adding attenuation on a signal path between the DUT and a vector signal analyzer (VSA), where the attenuation is changeable; measuring, at the VSA, at least two second EVMs for different values of attenuation of the signal output by the DUT, where the at least two second EVMs are corrupted by noise from the VSA, and where each of the at least two second EVMs is based on two or more measurements; and determining the first EVM based on a linear relationship that is based on the first EVM, the at least two second EVMs, and a function based on the attenuation, where the first EVM is without at least some of the noise from the VSA.

Methods and systems for automated testing of extremely-high frequency devices are disclosed. A device under test (DUT) is set in a simultaneous transmit and receive mode. The DUT receives a lower frequency radio frequency (RF) signal from a test unit and up-converts the lower frequency RF signal to a higher frequency RF signal. The DUT transmits the higher frequency RF signal using a first antenna, and receives the higher frequency RF signal using a second antenna. The DUT down-converts the received higher frequency RF signal to a received test RF signal and provides the received test RF signal to the test unit for comparing measurements derived from the received test signal to a design specification for the DUT.

The invention discloses a semiconductor structure and a forming method thereof, and the structure comprises a substrate which comprises a first device region, a second device region, and a loading region located between the first device region and the second device region; the first signal welding pad is located in the loading area; the second signal welding pad is positioned in the loading area at the side part of the first signal welding pad, and the second signal welding pad and the first signal welding pad are arranged along the first direction; a first coil device in the first device region; a second coil device in the second device region; a first signal lead electrically connecting the first coil device and the first signal pad; a second signal lead electrically connecting the first coil device and the second signal pad; a third signal lead electrically connecting the second coil device and the first signal pad; and a fourth signal lead electrically connecting the second coil device and the second signal pad. The accuracy of capacitance values of the first coil device and the second coil device obtained through parasitic capacitance de-embedding is improved, and the accuracy of device coil parameter measurement is improved.

The application discloses a correction and group measurement system and method of radio frequency unit, which comprises a control device, a signal source device, a test platform and a measurement device. The test platform and the measurement device are used for M times of measurement. In each measurement, the microwave signal source provided by the signal source device is converted into a random microwave signal with N random amplitudes and phases by the test platform, and the N radio frequency units placed on the test platform are excited to output each random microwave signal. Each random microwave signal is superimposed on the measured path to form a measurement signal. The measurement device receives the measurement signals of the M times of measurement and converts them into M measurement information respectively. The control device solves the signal of the M measurement information, and performs iteration and convergence calculation on all the solving results to obtain the correction information of the N radio frequency units in a specific state, so as to correct the radio frequency unit by using the correction information.

The disclosure relates to a system for testing a device-under-test, DUT. The system comprises: an output port arranged for being connected to the DUT; a waveform generator configured to generate an RF output signal and to forward said RF output signal to the DUT via the output port; a communication interface configured to receive a feedback signal from the DUT; and a processing unit configured to dynamically generate waveform information based on the received feedback signal, wherein the processing unit is configured to generate the waveform information from stored and / or from real time calculated waveform samples; wherein the waveform generator is configured to adjust the RF output signal based on the waveform information.

An electronic device may be provided with an antenna module having a substrate. A phased antenna array of dielectric resonator antennas and a radio-frequency integrated circuit for the array may be mounted to one or more surfaces of the substrate. The dielectric resonator antennas may include dielectric columns excited by feed probes. The feed probes may be printed onto sidewalls of the dielectric columns or may be pressed against the sidewalls by biasing structures. A plastic substrate may be molded over each dielectric column and each of the feed probes in the array. The feed probes may cover multiple polarizations. The array may include elements for covering multiple frequency bands. The dielectric columns may be aligned a longitudinal axis and may be rotated at a non-zero and non-perpendicular angle with respect to the longitudinal axis.

A test and / or measurement system includes a signal generator module is configured to generate a modulated radio frequency (RF) signal based on a predetermined waveform. The system further includes a signal analysis module is configured to receive an analysis signal via at least one signal path, and wherein the analysis signal corresponds to the modulated RF signal. The analysis signal includes at least one wanted signal portion and at least one unwanted signal portion. The unwanted signal portion corresponds to a spurious signal originating in the due to signal leakage and / or due to reflections. The signal analysis module is configured to identify the unwanted signal portion in the analysis signal based on the predetermined waveform. The signal analysis module further is configured to analyze the analysis signal taking the identified unwanted signal portion into account, thereby obtaining analysis data.

A system for measurement management is configured to obtain a configuration set and an associated configuration unique identifier (UID). The system is also configured to obtain at least one measurement result and an associated result UID. A relation between the configuration UID and the result UID is determined, and the relation is stored.

Apparatuses, systems, and methods are disclosed for generating and transmitting radio frequency (RF) energy by a first device, which may be captured by a second device. The captured RF energy may be used to power the second device. A first device may determine a resonant frequency of a variable slot configured to radiate RF energy. Furthermore, apparatuses, systems, and methods for encoding communication data onto transmitted RF energy are disclosed that optimize data pattern sensitivity and device-to-device variability. The devices and methods may be configured for use with implants (e.g., neurostimulation implants).

A circuit and method for testing a failure of a connection between a radio frequency (RF) integrated circuit and an external circuitry is described herein. The circuit includes a first amplifier having an input path and an output path; a second amplifier having an input path and an output path; a combiner for combining signals from the output path of the first amplifier and the output path of the second amplifier; a coupler for receiving an output of the combiner; and a power detector coupled to an output of the coupler, the combiner configured to transmit a signal to the external circuitry, where the power detector receives a reflected voltage from the external circuitry, and when the reflected voltage exceeds a preset threshold voltage, outputs the signal to the external circuitry. It is determined that there is a connection fault between the RF circuit and the external circuitry.