190 results about "Contact test" patented technology

The invention relates to an in-situ analysis detection method and device for electrical contact surface film damage. The in-situ analysis detection method comprises the following steps: 1) adjusting the height and angle of a sample test platform to a proper position; 2) switching on an electric contact test platform circuit, simulating an in-situ working process of an electric contact, and obtaining electric contact information and elliptically polarized light detection information; (3) transmitting polarized light detection information to light source acquisition equipment, and (4) establishing a proper physical optical model and a vibrator model, and performing data fitting analysis to obtain the in-situ change condition of the surface of the electrical contact. By adopting a non-contact in-situ spectrum testing technology, the early-stage in-situ failure process of the electrical contact is accurately, quickly and nondestructively detected in real time, and an equipment means and a test basis are provided for research on an electrical contact early-stage failure mechanism of an electrical contact material.

The invention discloses a water supply and water delivery pipeline welding positioning device, and relates to the technical field of water supply and water delivery pipeline welding, the water supply and water delivery pipeline welding positioning device comprises two fixing frames, the bottom of each fixing frame is provided with two symmetrically arranged moving roller mechanisms, the fixing frames are provided with lifting adjusting mechanisms, and the lifting adjusting mechanisms are connected with grabbing clamping jaw mechanisms; a synchronous folding mechanism is arranged between the two fixing frames, a lifting seat mechanism is arranged on the synchronous folding mechanism, a rotating arc plate mechanism is arranged on the lifting seat mechanism, two feeding welding mechanisms which are symmetrically arranged are arranged on the rotating arc plate mechanism, and a contact testing mechanism is arranged on the rotating arc plate mechanism; by arranging the grabbing clamping jaw mechanism, pipelines with different diameters can be grabbed and fixed, the lifting adjusting mechanism can drive the pipelines to ascend and descend for displacement, the synchronous folding mechanism can control butt joint of the two pipelines, meanwhile, folding, storage and carrying can be facilitated, and the water supply and delivery pipeline positioning and welding performance is improved.

The invention belongs to the technical field of electronic packaging board level interconnection, and particularly relates to a DIC-based surface-mounted component welding spot vibration strain non-contact test method and system. The testing method comprises the following steps: testing the amplitude of a welding spot by adopting a laser displacement sensor method through carrying out a vibration test, or carrying out calculation and analysis on the vibration amplitude of a welding spot area by establishing a finite element model; carrying out the type selection of telecentric / double telecentric lenses, and selecting the lens with the smallest field of view under the condition that the depth of field is close to the amplitude of the welding spot; further determining erection angles of a high-speed camera and a lens; speckles of the welding spots to be detected are manufactured; carrying out speckle quality evaluation by adopting DIC analysis software; assembling a three-dimensional strain test system, completing the setting of shooting parameters of a high-speed camera, and completing the calibration of the three-dimensional strain test system by adopting DIC analysis software; setting control parameters of a vibration table, carrying out a vibration test of the board-level assembly welding spot, and synchronously collecting a vibration image of the welding spot; and carrying out strain calculation on the welding spots under the vibration working condition by adopting DIC calculation and analysis software. According to the DIC-based non-contact test method and system for the vibration strain of the welding spot of the surface-mounted component, the strain response process of the surface-mounted welding spot can be accurately obtained, quantitative analysis and research on the vibration reliability of the welding spot are supported, and key data support is provided for reliability design of board-level interconnection products of the surface-mounted component.

The invention discloses a device electroluminescence characteristic test system comprising an AC voltage signal source for providing an AC voltage signal; the conductive test bench comprises a base station and a contact probe, the base station is made of a conductive material and is used for placing a sample to be tested, the contact probe comprises a conductive material and is used for forming electric contact with the sample to be tested, and during testing, the sample to be tested is placed on the base station, and the contact probe is used for forming electric contact with the sample to be tested. AC voltage generated by the AC voltage signal source is applied to a to-be-tested sample through the contact probe, and the AC voltage is large enough to drive the to-be-tested sample to emit light; the series resistors are used for forming series connection with a sample to be tested; and a detection instrument. According to the method, the problems of etching damage and complicated operation caused by metal contact in a traditional EL detection method and the problem of inaccurate spectrum test in a PL detection method are solved, a simple and efficient novel EL characterization means without pretreatment is realized, and the method is suitable for rapid test and performance evaluation of various material systems and luminescent devices.

The invention provides a chip test system and a test method thereof. The test system comprises a test machine, a switch circuit and a bias power supply. The bias power supply is introduced between the to-ground reference end of the chip to be tested and the power ground of the test system, so that the potential of the to-ground reference end of the chip to be tested relative to the power ground is improved, and a voltage difference exists between the grounding end of the test machine and the to-ground reference end of the chip to be tested; therefore, the testing machine can perform reverse testing on the electronic component in the chip to be tested without a negative voltage power supply, and the cost of the testing machine is reduced. Meanwhile, the switching circuit is arranged between the grounding end of the testing machine and the ground reference end of the chip to be tested, and the voltage difference between the ground reference end and the grounding end of the chip to be tested is controlled by controlling the switching circuit to be switched on and switched off, so that the testing structure can meet different requirements of contact testing and high-speed data transmission testing.

The utility model relates to the technical field of battery testing, in particular to a main-grid-free battery testing device which comprises a testing base, the testing base comprises an elastic base station capable of elastically deforming, and the upper surface of the elastic base station is of a three-dimensional curved surface structure which is arched upwards in the direction from the periphery to the middle of the elastic base station. A plurality of contact test points used for forming ohmic contact with fine grid lines on a battery to be tested are arranged on the elastic base table, a flexible pressing and fixing mechanism capable of ascending and descending relative to the thickness direction of the test base is further arranged above the test base, and the flexible pressing and fixing mechanism comprises a pressing and fixing wire net. The pressing and fixing wire net comprises a plurality of first pressing wires parallel to one another and a plurality of second pressing wires parallel to one another, and the first pressing wires and the second pressing wires are arranged in a crossed mode to form a net structure. According to the testing device, the to-be-tested battery does not shake or displace when being pressed, the stress is more uniform, the thin grid lines at all positions can be in stable contact with the contact testing points, and the reliability of a detection result is ensured.

The present invention discloses a portable ovulation detector, which relates to the field of ovulation detectors, including a detector body, a display screen, and a control button. A buckle push plate is provided on the inner side of a connection bin, and a touch detection member is installed at one end of the detector body away from the connection bin. The present invention sets a buckle push plate. When a test card passes through a jack and enters the interior of the connection bin, the end of the test card close to the locking hole will push a locking slider to move. When the locking pin is aligned with the locking hole and the locking hole, the locking pin will be inserted into the locking hole. After the test card is used, the pressure plate is pushed toward the detector body to separate the locking pin from the locking hole and the locking hole. At this time, the locking slider will quickly recover under the action of the elastic restoring force of the first reset spring, so that the test card is separated from the connection bin under the action of inertia. In this way, the test card can be separated from the connection bin without contacting the test card, which is simple and hygienic to operate.

This invention discloses a method for manufacturing anti-slip children's shoes, relating to the field of anti-slip children's shoe production technology. The manufacturing process comprises a testing platform, a dynamic abrasive unit, a segmented control contact mechanism, and an asynchronous linkage mechanism. The dynamic abrasive unit automatically adjusts and changes the coefficient of friction during abrasion resistance testing. A shoe sole block is mounted on the right side of the trigger component. A cooperating unit works with the trigger component to move the shoe sole block, pushing against the foot area of ​​the shoe sole to contact the dynamic abrasive unit for testing. This invention uses a segmented control contact mechanism to bend the anti-slip children's shoe into three sections, allowing for separate testing of the forefoot, midfoot, and heel areas of the sole, providing more detailed wear data. Furthermore, by simulating the actual wear under heel-first and forefoot-first gait conditions through reciprocating oscillation, the invention improves the accuracy, representativeness, and data quality of the test, making the test results more practically meaningful.

A probing system includes a device-under-test, a probe device, and a die bonder. The device-under-test includes test patterns. The probe device includes tilt angle sensors. The tilt angle sensors include spikes that protrude from the probe device. The die bonder is operational to mount the device-under-test, mount the probe device facing the device-under-test, compress the probe device and the device-under-test together to causes a subset of the spikes to contact the test patterns, measure a number of connections formed between the tilt angle sensors and the test patterns, determine a first offset angle and a second offset angle between the device-under-test and the probe device based on the number of connections, adjust the spherical positioner in one or more rotational axes in response to the first offset angle and the second offset angle to change a parallelism between the device-under-test and the probe device.

The application discloses a method for non-contact testing of quantum efficiency (EQE) and short-circuit current (ISC) of a solar cell, relates to the technical field of photovoltaic device testing, and aims to solve the problems that the existing quantum efficiency and short-circuit current measurement must contact electrodes, is slow and cannot cover new gateless or process pieces; a non-contact testing method of "multi-wavelength LED excitation + local shielding + carrier lateral diffusion" is provided; the method blocks the excitation light by using a shielding filter, and only transmits the electroluminescence signal of the shielding area; the EL power of each wavelength is extracted through phase-locked amplification and deep learning denoising, the continuous EQE curve is calculated by using the calibrated incident photon flux ratio, and the ISC is obtained by convolution of the AM1.5 spectrum.

1. The name of the design product: non-contact test pen. 2. The use of the design product: for non-contact detection of whether the measured object has AC voltage, with lighting function. 3. The design points of the design product: in shape. 4. The picture or photo that best indicates the design points: perspective view 1.

The present invention provides a non-contact test method for moisture conductivity, which belongs to the technical field of fabric detection, and includes a test method and a characterization method, wherein the test method is used to obtain detection parameters characterizing the moisture conductivity of fabrics, and the test method specifically includes the following steps: test preparation, clamping, unsupporting, closed test environment, liquid supply, detection, reverse side testing, and data analysis. The non-contact test method for moisture conductivity provided by the embodiment of the present invention obtains accurate and reliable fabric moisture conductivity data, which can truly reflect the performance indicators related to ensuring human comfort of the material under the premise of strong exercise and phase change of sweat.

The invention discloses a test fixture for a microwave surface-mounted device, and belongs to the field of microwave component testing, the fixture comprises a micro bump test fixture main body, a test connector and a test connector fixing plate which are sequentially connected from top to bottom, the front surface of the micro bump test fixture main body is provided with a test cavity used for installing a tested device, and the test cavity is provided with a test cavity used for installing the tested device. A transmission contact balance micro bump, a transmission contact test matching hole and a device grounding micro bump are arranged in the test cavity, and a connector grounding micro bump is arranged on the back surface of the micro bump test fixture main body; according to the invention, the simulation optimization time of the test fixture is greatly reduced, and the design efficiency and the processing efficiency are improved compared with the traditional PCB switching test; the loss of the vertical conductive film is converted into the loss of the connector, so that the cost of a clamp in a device test can be greatly reduced; the service life of the test connector is far longer than the effective test service life of the vertical conductive film, and the broadband high-performance index test can be realized.

An analyte detection apparatus is disclosed and configured for testing a substance for the presence or absence of at least one target analyte. In at least one embodiment, a housing provides a mixing chamber and a testing chamber in selective fluid communication with the mixing chamber. During use of the apparatus, a volume of the substance is collected via a collection scoop and introduced into the mixing chamber where it is mixed with a delivery fluid within the mixing chamber. An end cap is engaged with the housing in order to seal the mixing chamber, and a mixing valve is moved into an open position, allowing the substance to travel into the testing chamber and come into contact with a test medium, with a resulting visual indication from the test medium being viewable via a result window.

The invention relates to the field of solid state disks, in particular to a memory particle testing device and a testing method thereof. Intermittent rotation of a driven groove wheel and an eccentric rotating disc is achieved through a driving gear at the same time, so that a placing disc rotates, to-be-tested memory particles on the placing disc rotate to the left side or the right side of the placing disc, meanwhile, the eccentric rotating disc rotates, and a pressing block is moved to the left side or the right side of the placing disc; the to-be-tested memory particles are pushed downwards to be in contact with the vibrating needle for testing, and are rotated to the rear side or the front side of the placing disc after testing, so that testers can take down the tested memory particles conveniently, and meanwhile, the to-be-tested memory particles can be placed again. Therefore, when the memory particles are tested on the left side and the right side of the placing disc, taking and placing of the memory particles to be tested are completed in front of and behind the placing disc, the horizontal pressing block which vertically descends in the testing process can ensure that the stress of the memory particles can be balanced, and the situation that the memory particles are damaged or displaced due to uneven stress is avoided.

The invention belongs to the technical field of circuit testing, and discloses a digital circuit wafer-oriented contact testing device, which comprises a probe card; a controllable power supply circuit framework and a contact test loop are integrated on the probe card; the controllable power supply circuit architecture is used for power supply multiplexing of various tested memory wafers, power supply switch adjustment under different working conditions and safety protection; and the contact test loop is used for detecting whether the probe on the probe card is connected with the signal of the tested memory wafer. The controllable power supply circuit architecture supports power supply multiplexing of multiple tested memory wafers, an independent power supply module does not need to be independently configured for each wafer or each test channel, the hardware layout of the test system is simplified, the overall building complexity is reduced, a contact test loop detects the signal connection state of a probe and the wafers in advance, and the test efficiency is improved. And misjudgment caused by poor contact such as installation deviation and inaccurate probe alignment can be directly eliminated, and a qualified wafer does not need to be misjudged as functional failure to be eliminated.

The application discloses a kind of non-contact test solar cell IV characteristic method, it is related to optical imaging technology, for improving the problem of inaccurate test and mechanical damage to solar cell caused by poor contact due to contact type test, including setting excitation light source and light energy capture device;Utilize light energy capture device to capture transition light energy and generate light energy image, obtain the pixel point brightness value fluctuation of light energy image and judge light energy capture effect, and select whether to reset for secondary capture;After light energy capture is completed, first, the transition light energy in the local area of solar cell is photoelectric conversion characterization, and the local IV space uniformity difference is obtained;Then, the whole IV of solar cell is characterized, and the comprehensive IV characteristic curve of the whole to-be-tested cell is obtained.

The invention relates to a device (1) for testing at least one electrical energy store (2), comprising at least one coupling device (3) and at least one testing device (4). The connection device (3) and the test device (4) can be connected via at least one charging line (5). The coupling device (3) has at least one first coupling element (6a) and at least one second coupling element (6b) for electrical contact with the energy store (2). The test device (4) has at least one test device (9) and at least one safety circuit (10), the energy store (2) being able to be charged and discharged by means of the test device (9) via the charging line (5) with a test current. The test device (9) has at least one first measurement channel (15) and at least one second measurement channel (16). The first measuring channel (15) has at least two measuring lines (15a, 15b) which are each connected to the charging line (5) at a test device-side location (18a, 18b). The second measuring channel (16) has at least two measuring lines (16a, 16b) which are each connected to the charging line (5) at a connection-device-side location (19a, 19b). An electrical connection between the connection device (3) and the test device (9) can be established or disconnected at the charging line (5) by means of a safety circuit (10). In this case, the test device (9) has at least one third measurement channel (17), the third measurement channel (17) having at least one first measurement line (17a) and at least one second measurement line (17b), and the first measurement line (17a) is connected to the charging line (5) at a connection device-side location (19c) and the second measurement line (17b) at a test device-side location (18b).

The utility model relates to the technical field of electronic testing, in particular to an automobile battery flexible board function testing jig which comprises a base, a pushing device is fixedly connected to the upper portion of the left end of the base, a rear board is fixedly connected to the rear portion of the upper end of the base, and a detection device is fixedly connected to the middle of the upper end of the rear board. The detection device comprises a first electric push rod, the output end of the first electric push rod penetrates through the rear plate and is fixedly connected with a connecting block, the front portion of the upper end of the test plate is fixedly connected with a data interface, and the first electric push rod is fixedly connected to the middle of the upper end of the rear plate. According to the automobile battery flexible plate function test tool, through arranging the detection device and the pushing device, the flexible plate is ensured to be stably clamped and not damaged, the U-shaped clamping plate provides a more stable clamping effect, the tool is suitable for flexible plates of different shapes, the tool can fully contact test points, and efficient and accurate test is realized.

The invention provides a solder strip contact test method and a solder strip contact test device. The solder strip contact method comprises the following steps that a to-be-tested device is provided, the to-be-tested device comprises a connecting electrode and a plurality of solder strips, the plurality of solder strips are arranged side by side at intervals, the connecting electrode is arranged between two adjacent solder strips, the connecting electrode is connected to the two adjacent solder strips, and a solder strip distance and a resistance value exist between the two solder strips; obtaining a plurality of different solder strip intervals and a plurality of corresponding resistance values; and performing linear fitting processing on the plurality of obtained solder strip distances and the plurality of resistance values, and judging whether the contact performance of the solder strip is qualified or not according to a linear relation obtained by fitting. According to the testing method, the difference of the contact resistance between the welding strip and the substrate can be accurately detected, so that whether pseudo soldering exists in the welding strip or not is judged.

The embodiment of the invention provides a test structure and a test method, the test structure comprises a first comb-shaped structure, a snakelike structure and a second comb-shaped structure, and the first comb-shaped structure and the snakelike structure are not in contact with each other; the test structure is used for carrying out a metal interlayer dielectric layer test and an electromigration test, and the snakelike structure is used for carrying out the electromigration test; the first comb-shaped structure comprises a plurality of first metal wires which extend along a first direction and are arranged at intervals along a second direction, the snakelike structure comprises a plurality of second metal wires which extend along the first direction and are arranged at intervals along the second direction, and the second comb-shaped structure comprises a plurality of third metal wires which extend along the first direction and are arranged at intervals along the second direction; the plurality of first metal wires and the plurality of second metal wires are located on a first metal layer, the plurality of third metal wires are located on a second metal layer, and the first metal layer and the second metal layer are two adjacent metal layers; and one second metal wire is positioned between two adjacent first metal wires.

A method includes providing a semiconductor package including an encapsulant body and a plurality of leads that protrude out from the encapsulant body; providing a semiconductor device testing apparatus including a package holder, a plurality of contact test probes, and a lead extender; arranging the semiconductor package within the package holder; actuating the semiconductor device testing apparatus such that a first one of the contact test probes directly contacts a first one of the leads and such that a second one of the contact test probes directly contacts the lead extender; and applying a test current to the semiconductor package such that part of the test current flows through the first one of the contact test probes directly contacting the first one of the leads and such that part of the test current flows through the second one of the contact test probes directly contacting the lead extender.

The present invention discloses an electromagnetic relay, which comprises an electromagnetic system and a housing assembly. The housing assembly includes a housing and a test switch. A sunken groove is provided on the housing. The test switch is installed in the sunken groove and has an unlocking position, a test position and a locking position when sliding along the sunken groove. A first locking portion is provided in the sunken groove. The test switch is provided with a first locking portion cooperating with the first locking portion and a triggering portion cooperating with the armature of the electromagnetic system. When the test switch slides to the unlocking position, the first locking portion of the test switch is locked with the first locking portion, so that the triggering portion of the test switch cannot contact the armature. When the test switch slides to the test position or the locking position, the locking between the first locking portion and the first locking portion is released. The electromagnetic relay of the present invention has an anti-misoperation function. When the test switch is in the unlocked state, the first locking portion is engaged with the first locking portion, preventing the test switch from pressing down the armature to cause misoperation and improving the reliability of the product.

This application relates to a semiconductor module testing device, comprising a fixture plate for holding a semiconductor module, the fixture plate having an interface for connecting to the pins of various functional devices in the semiconductor module; a test box including a current source, a measurement unit, and a switch module, the switch module connecting the current source and the measurement unit, and also connecting to the interface of the fixture plate; the switch module, through switching, changes the connection relationship between the current source, the measurement unit, and the interface of the fixture plate, enabling the current source and the measurement unit to perform pin contact tests on various functional devices in the semiconductor module; and an insulation withstand voltage tester connected to the switch module, the switch module also changing the connection relationship between the insulation withstand voltage tester and the interface of the fixture plate, enabling the insulation withstand voltage tester to perform insulation tests on the semiconductor module. By simply switching the switch module, pin contact tests and insulation tests on the semiconductor module can be performed separately, improving testing efficiency.

The utility model discloses a semi-automatic electrical testing machine which comprises a rack, a transplanting mechanism and an electrical testing mechanism, a workbench is arranged in the rack, the transplanting mechanism is arranged on the workbench, a replaceable jig with a workpiece is arranged on the transplanting mechanism, the semi-automatic electrical testing machine can move at different stations and can adapt to workpieces of multiple specifications, the equipment acquisition cost is reduced, the universality is improved, and automatic circulation of electrical testing of the workpiece is achieved. The efficiency is improved. The electrical testing mechanism is arranged above the transplanting mechanism and comprises a vertical guide column, a top plate, a second linear driving mechanism and an electrical testing assembly, the guide column is used for accurate guiding, and the driving mechanism controls the electrical testing assembly to move downwards to make contact with the workpiece for testing. The jig has a specific layout, and a carrier block precisely limits a workpiece. The machine frame is provided with the touch display screen, the idler wheels and the base, the advantages of being convenient and fast to operate, flexible to move and stable in supporting are achieved, and various production requirements are met.

The embodiment of the invention provides a self-adaptive contact test state and jitter fault test device and method, and the device converts a signal of a to-be-tested contact into a proper voltage signal UA through a voltage dividing module, compares a voltage signal UC with the voltage signal UA through two set voltage signals UB, converts the voltage signal UB into a pulse signal, and carries out the judgment. A power supply mode does not need to be changed, signal sources do not need to be distinguished, multi-contact rapid jitter detection can be directly carried out, and the signal sources carried by the contacts can be accurately recognized through one-time detection. The embodiment of the invention further provides a corresponding method and a computer readable storage medium.

The utility model provides a rebound amount test system relates to material test field, and test system is used for measuring the product to be tested, and the product to be tested includes product bottom support, product support beam and product top support, and product support beam is located between product bottom support and product top support, and it includes: support mechanism, support mechanism is used for supporting the product to be tested, and the product to be tested is connected with support mechanism;Telescopic mechanism, telescopic mechanism is located above support mechanism, and telescopic mechanism can extrude or stretch product top support;Test mechanism, the detection end of test mechanism is in contact with product top support, and test mechanism can detect the displacement distance of product top support, and the test system of the utility model can effectively realize the rebound amount test of the pressure of " C character " type product, prevents the product from the non - intended deformation of the test process simultaneously, improves the accuracy of test result.

The invention relates to a probe needle system (1, 2, 3, 4) and a method for using the probe needle system (1, 2, 3, 4). The probe needle system (1, 2, 3, 4) comprises a plate (100, 200, 300, 400), a temperature-controlled substrate holder (12, 22, 32, 42), a test assembly (14, 24, 34, 44), and an active heat control mechanism (16, 26, 36, 46). The temperature-controlled substrate holder (12, 22, 32, 42) supports a substrate (18, 28, 38, 48) containing a device under test (DUT). The temperature-controlled substrate holder (12, 22, 32, 42) regulates the temperature of the substrate (18, 28, 38, 48). The test assembly (14, 24, 34, 44) is arranged on the plate (100, 200, 300, 400). The test assembly (14, 24, 34, 44) includes a waveguide interface instrument (140, 240, 340, 440) and a waveguide probe needle (142, 242, 342, 442).The waveguide probe needle (142, 242, 342, 442) has a probe needle tip (T1, T2, T3, T4) configured to contact the test specimen. The active thermal control mechanism (16, 26, 36, 46) is configured to stabilize the thermal state of the waveguide probe needle (142, 242, 342, 442) and block heat conduction from the temperature-controlled substrate holder (12, 22, 32, 42) to the waveguide probe needle (142, 242, 342, 442).

An electric contact test knife for a solar cell belongs to the field of solar cell test devices and is characterized by comprising a knife body, a flexible strip and a conductive strip, the cutter body is arched; fixing holes are formed in the two ends of the cutter body; the flexible strip is arranged at the top of the cutter body; the conductive strip is arranged on the flexible strip, and the flexible strip is located between the conductive strip and the cutter body. A conductive strip and a flexible strip are sequentially arranged at the top of an arched test knife from top to bottom, the conductive strip is used for being in contact with a to-be-tested solar cell to collect electric signals, and the flexible strip is used for being deformed when the conductive strip is in contact with the to-be-tested solar cell, so that the contact surface of the conductive strip and the to-be-tested solar cell is increased; the device provides stable and reliable contact, reduces the possibility that the solar cell to be tested is fragile, does not need to be adjusted when testing the solar cell modules to be tested with different main grid numbers, is simple in structure, is easy to operate, is low in manufacturing and later maintenance cost, and is suitable for popularization and application.

The utility model discloses an FPC line impedance automatic acquisition and determination intelligent device, and relates to the field of FPC line impedance testing. The FPC line impedance automatic acquisition and determination intelligent device comprises a test platform, a DC resistor, a test ammeter, a USB converter and a test sample. According to the intelligent device for automatically collecting and judging the FPC line impedance, the testing electric meter is in contact with the terminals of the testing sample, loop testing is carried out, a membrane switch is pressed, detection is carried out, the testing sample is placed between the fixing base and the clamping base, the testing sample is fixed, the testing electric meter is in contact with the corresponding terminals on the testing sample conveniently, and the testing efficiency is improved. The multi-point test can be conveniently carried out, and the situation that the single-point test efficiency is low can be effectively avoided.