The present disclosure relates to the technical field of sensitive element
processing equipment, and an embodiment of the present disclosure provides a
grinding wheel
cutting device for sensitive element manufacturing, which comprises a
chassis, a conveying belt and a feeding rack, the conveying belt is arranged inside the
chassis, the feeding rack is arranged on the side surface of the
chassis, a feeding conveying
assembly is arranged on the chassis and the conveying belt, and a positioning
cutting assembly is arranged outside the chassis, the positioning
cutting assembly comprises a high-speed motor, the high-speed motor is arranged on the chassis, a cutting
grinding wheel is arranged at the output end of the high-speed motor, an outer cover is fixed outside the driving motor, and the outer cover wraps outside the cutting
grinding wheel. Through the above technical scheme, the technical problem that the ordinary mechanical cutting equipment in the prior art can improve the speed, but lacks precise positioning and self-adaptive adjustment capability, and for thin
willow silk with a
diameter of only dozens of microns to hundreds of microns, axial deviation or
radial deformation is easy to occur during cutting, resulting in uneven cutting and end face damage is solved.