The package structure for a high-speed semiconductor light emission assembly comprises: a dish-type case with RF connector, a semiconductor refrigerator to control the work temperature of emission chip, a KOVAR metal heat sink, a medium heat sink substrate, a light emission device, a thermistor, a backlight detector, the metal wire to connect dc connection electrode and case pin, a coplanar waveguide transmission lie on medium substrate, and optical coupling assembly. Wherein, it uses BTF standard package form for dc terminals outside the case.