1184 results about "Insertion loss" patented technology

The invention discloses a circuit board printing control method and system based on signal transmission loss. And obtaining a target differential transmission line parameter and a circuit board lamination parameter. And establishing an electromagnetic simulation model, and simulating insertion loss, return loss and impedance discontinuous point distribution. The line width, the line spacing and the interlayer hollowed-out area of the differential transmission line are dynamically adjusted through the reinforcement learning model, the proportion of the line width to the shielding layer spacing is limited by a preset critical value, and the line spacing is configured based on the multiple relation of the shielding layer spacing. And a sectional optimization strategy is adopted for the corners of the transmission line. The ratio of the aperture to the diameter of the anti-pad is optimized, and impedance mutation is reduced. According to the method, the key parameters of the target differential transmission line and the circuit board lamination parameters are acquired, and the electromagnetic simulation model is combined with the multi-physical field coupling algorithm, so that the insertion loss, the return loss and the impedance discontinuous point distribution can be accurately simulated. The method improves the adjustment efficiency, guarantees the accuracy of an adjustment result, and effectively reduces the signal transmission loss.

The invention discloses a broadband single-pole double-throw switch MMIC, and belongs to the field of radio frequency / microwave. The switch adopts a symmetrical dual-channel structure, each channel comprises an input end series switch circuit, an output end series switch circuit and two parallel switch branches, channel switching is realized through two complementary control voltages, and impedance matching is carried out between the circuits by adopting microstrip lines. According to the technical scheme, switching tubes, resistors and inductors are utilized to form a circuit network, and a signal transmission path is optimized through the resonance effect of the inductors and switching tube cut-off capacitors in parallel branches in combination with a resistor parallel structure and a microstrip line matching technology. According to the invention, the performance of low insertion loss and high isolation in a broadband is achieved, the voltage standing wave ratio of an off-state output port is reduced, the port matching capability is improved, and an efficient and stable solution is provided for signal routing in a radio frequency system.

The invention discloses a temperature compensation equalizer with adjustable equalization slope linearity, and relates to the technical field of microwave integrated circuits. The equalizer comprises a temperature compensation driving module and a temperature compensation equalization module. The temperature compensation driving module generates a control voltage changing along with the temperature by using the negative temperature characteristic of the diode. The temperature compensation equalization module comprises an equalization circuit formed by resonators and a pair of stacked switch tubes, and realizes a temperature compensation function by controlling voltage to adjust insertion loss; meanwhile, by changing the capacitance value of the equalization slope linearity adjusting capacitor C3 which is connected with the series resonator in parallel, the linearity of the equalization slope can be flexibly adjusted on the premise that the equalization quantity is kept unchanged. According to the invention, the temperature compensation and equalization functions are integrated, the structure is compact, the performance is stable, the slope linearity can be flexibly adjusted, and the device is suitable for gain frequency and temperature compensation in a broadband radio frequency link.

The invention discloses a parameter measuring device and method of an optical switch and optical communication equipment, and relates to the technical field of optical switch measurement, and the parameter measuring device of the optical switch comprises an optical path module, a signal conditioning circuit, a driving module, a signal acquisition module and an upper computer. The optical path module converts the optical signal into a current signal; the signal conditioning circuit conditions the signal into a voltage signal and amplifies the voltage signal; the driving module provides a driving signal and a synchronous triggering signal; the signal acquisition module acquires a voltage signal based on the trigger signal; the upper computer calculates performance parameters of the optical switch according to the voltage signals acquired for multiple times, wherein the performance parameters at least comprise two items of insertion loss, extinction ratio, switching time and the like; according to the technical scheme, one-key measurement of performance parameters such as insertion loss, extinction ratio, switching time, polarization-dependent loss, insertion-dependent loss and repeatability of the optical switch can be realized, meanwhile, the measurement cost of the optical switch is reduced, and the test efficiency and accuracy are improved.

The invention relates to the technical field of microelectronics, semiconductors and communication, and discloses a radio frequency switch chip, and the circuit structure of the radio frequency switch chip comprises a transformer type differential inductor T-L1, a transformer type differential inductor T-L2, a capacitor C1, an NMOS transistor M1, an NMOS transistor M2, a gate resistor RG1, and a gate resistor RG2. The radio frequency switch chip provided by the invention adopts a differential structure, so that the parasitic inductance effect of a grounding key and a wire during packaging and testing can be eliminated, and the insertion loss and the isolation performance are improved; compared with a single-end port, the lower impedance of the differential port is more beneficial to improving the power capacity of the switch; the differential structure allows the transformer type differential inductor to use differential signal characteristics, the equivalent quality factor of the inductor is improved, and the circuit performance is improved; the differential structure can improve the linearity of the circuit, especially the second-order intermodulation effect; the differential structure can be compatible with a modern silicon-based CMOS radio frequency system, and an additional balun is not needed for signal conversion.

The invention provides an all-optical switching system and method based on AWGR and WSS, and relates to the technical field of optical communication, the system comprises a three-stage Clos network structure, the input stage is composed of N N * N WSS modules and used for receiving external optical signals, and the WSS represents a wavelength selection switch; the middle stage is composed of AWGR modules and WSS modules which are deployed in a mixed mode, the number proportion of the AWGR modules is adjustable so as to achieve balance of cost and performance, and AWGR represents an array waveguide grating router; the output stage is composed of N N * N WSS modules; the output port of the input stage WSS module is connected with the input port of the intermediate stage AWGR / WSS module, and the output port of the intermediate stage AWGR / WSS module is connected with the input port of the output stage WSS module. While the optical path blocking performance is ensured, the system cost and insertion loss are reduced, wavelength conflicts are reduced, and the balance between the cost and the performance is realized.

The invention relates to the technical field of optical communication equipment testing, in particular to an integrated optical module multi-parameter testing system and method.The method comprises the steps that a multi-channel parallel testing unit synchronously collects light spot morphology, divergence angles, insertion loss and return loss space and transmission characteristic parameters through a transmission light path and a reflection light path; the parameter collaborative analysis module performs nonlinear correlation analysis and dynamic performance threshold evaluation based on a cross-dimension correlation model; the intelligent calibration engine dynamically adjusts the test benchmark and compensation parameters according to the environment temperature and the equipment aging attenuation model; the fault diagnosis and prediction unit identifies potential defect types of the collimator, constructs a performance degradation prediction model in combination with a working state and environmental stress, and predicts a performance evolution trend according to test data; and the test report generation module automatically generates a standardized and customized dual-mode test report, a quality grade label and a performance optimization suggestion according to the prediction result and the diagnosis conclusion. Therefore, the problems of poor test precision, low test efficiency and the like in the prior art are solved.

The invention discloses an insertion loss board, test equipment, a signal transmission method and a program product, and is applied to the technical field of signal quality test, and the insertion loss board comprises a storage unit which is used for storing each preset signal frequency and a corresponding initial S parameter; the main control unit is used for determining a target signal frequency and a target length; the signal processing unit is used for determining the S parameter of the transmission line with the target length and extracting the insertion loss from the S parameter based on the initial S parameter corresponding to the target signal frequency and the target length; receiving an original to-be-tested signal through an input interface of a signal transmission path, and adjusting the signal transmission path based on the insertion loss so as to enable the insertion loss from the input interface to an output interface of the signal transmission path to accord with the extracted insertion loss; and signal output is carried out through an output interface of the signal transmission path. By applying the scheme of the invention, the size can be reduced on the basis of meeting the functional requirements of the insertion loss plate.

The invention discloses a method and a device for determining working parameters of an adaptive equalizer. The method comprises the following steps: selecting a first initial value and a first offset of an adaptive equalizer in a chip according to a current link rate and cable information; determining a first working parameter of the adaptive equalizer according to the first initial value and the first offset; receiving signal feedback information of a receiving end corresponding to the chip is acquired; when determining that the signal transmission quality is lower than a preset value according to the received signal feedback information, reselecting a second initial value and a second offset of the adaptive equalizer, and obtaining a second working parameter of the adaptive equalizer according to the second initial value and the second offset, and the signal transmission quality is not lower than the preset value when the adaptive equalizer operates according to the second working parameter. According to the method and the device, the technical problem that in the prior art, due to the fact that self-adaptive balanced insertion loss changes exist in a chip under different cable lengths and cable types, frequent manual parameter adjustment is needed, and the operation is relatively tedious is solved.

The invention discloses a C wave band reflection type phase shifter based on a cross-direction coupling line coupler, and belongs to the field of wireless communication and digital signal processing, the reflection type phase shifter is designed based on the cross-direction coupling line coupler, and compared with an existing branch line coupler and an existing Lange coupler, the C wave band reflection type phase shifter has the advantages of being small in size, low in insertion loss, wide in broadband and the like. A digital phase shifter used by a traditional phased-array antenna can be replaced, and the pain point problems of high cost, high power consumption and the like of the traditional phased-array antenna are solved; besides, the reflective phase shifter provided by the invention can be integrated on a PCB, has the advantages of being easy to process, low in cost, small in size and the like, is easy to integrate with a planar printing phased array antenna, and realizes miniaturization and low cost of the phased array antenna.

The invention discloses an ultra-wideband RCS (radar cross section) reduction metasurface with mixed wave absorption and diffuse scattering and a wave-transparent window, and belongs to the technical field of electromagnetic metamaterials. The metasurface adopts a four-layer cascade structure and comprises a first layer of polarization conversion structure, a second layer of 2.5 D lossy structure, a third layer of Jerusalem cross-shaped lossy structure and a fourth layer of frequency selective surface structure. By loading a lumped resistor at a specific position and adopting a metal through hole interconnection technology, dual functions of radar cross section reduction in a 1-20GHz ultra-wideband and low insertion loss wave transmission in a 8-12GHz frequency band are realized. The structure of each layer adopts a highly symmetrical design and has the characteristic of polarization insensitivity, and meanwhile, by optimizing interlayer air gaps and dielectric material selection, the structure compactness is realized on the premise of ensuring the performance. The method has important application value in the aspect of integration of stealth equipment and a communication system.

The invention provides a micro-ring resonator and a wavelength division multiplexing network system, and relates to the technical field of photoelectricity. A microring resonator includes: an input port to receive an input optical signal; the two heat adjusting couplers are located on the two sides of the micro-ring waveguide respectively and used for adjusting the coupling ratio of the micro-ring waveguide; the two multi-mode interference devices are respectively connected with the heat adjusting coupler and are used for carrying out heat-light adjustment based on the heat adjusting electrode; the two thermal adjusting electrodes are respectively connected with the multi-mode interference device and are used for adjusting interference parameters of the multi-mode interference device; the voltages of the two thermal adjusting electrodes are the same or different; the micro-ring waveguide is located between the two thermally tunable couplers and is used for performing resonance enhancement on the optical signal of the target wavelength; and the two straight waveguides are respectively connected with the two thermal modulation couplers and the two multi-mode interference devices and are used for transmitting optical signals. Therefore, insertion loss and crosstalk are effectively reduced, and wavelength drift caused by temperature change is compensated at the same time.

A high-speed transmission circuit comprises, as part of a signal path, a connector pin disposed on a pad that comprises an unused pad region. The unused pad region is not considered part of the signal path but is part of a resonant sub-circuit. In various embodiments, by properly adjusting the dimensions of the pad region and other structures in the high-speed transmission circuit, resonant frequencies of the sub-circuit are shifted to a frequency range that is outside of the frequency range of interest in the signal path, thereby, reducing insertion loss and increasing signal integrity without compromising mechanical stability.

The invention discloses a radiation-inhibiting needle point structure, a two-dimensional probe and a microwave test system, belongs to a microwave radio frequency test technology, and aims to solve the problems that radiation crosstalk is aggravated and insertion loss is abnormal in a millimeter wave to terahertz frequency band on-chip test, and a traditional three-dimensional probe is limited by process precision and is difficult to meet high-frequency test requirements. The radiation-inhibiting needle point structure comprises a ground wire and a signal wire, the ground wire is located on two sides of the signal wire to form a GSG needle point structure, and a supporting structure is arranged between the ground wire and the signal wire; a cantilever type shielding layer is arranged above the ground wire, and a G needle root hollowed-out structure is arranged at the position, close to the root of the needle tip, of the cantilever type shielding layer; each of the ground wire and the signal wire comprises a GSG needle point structure lower nickel layer and a GSG needle point structure upper copper layer, the needle point part of the ground wire is provided with a transition structure, and the thickness of the transition structure is gradually reduced from the root of the needle point to the tip of the needle point; a signal line is constrained in a quasi-TEM mode for transmission, so that high-frequency radiation leakage is effectively inhibited; and the stress of the needle tip can be optimized by adjusting structural parameters.

The present invention belongs to the field of electromagnetic functional devices, and specifically relates to a fin-line terahertz multi-phase shifter based on a gallium arsenide diode, comprising: a rectangular waveguide input port, a substrate, a rectangular waveguide-fin-line transition structure, a fin-line structure, a probe-type microstructure phase shifter unit, its feeding opening portion, a fin-line-rectangular waveguide transition structure, and a rectangular waveguide output port. The present invention addresses the problems of the existing terahertz wave phase modulator having few phase shifting technical solutions, large insertion loss during phase shifting, a small phase shift range, a large device size, and low integrability. By controlling the on-off of the diode on the probe-type microstructure phase shifter unit by voltage, the perturbation intensity of the probe on the fin line is changed, so that the equivalent dielectric constant of the fin line changes, thereby achieving the phase shift of the terahertz wave; then, by superimposing the phase shifters in a centrally symmetrical and parallel arrangement, a low-insertion-loss multi-bit terahertz wave phase shift is finally achieved, ensuring a good working state and promoting the development of terahertz phase control technology.

According to the low-insertion-loss broadband balun equivalent circuit for the base station and the balun thereof, the low-insertion-loss broadband balun equivalent circuit is based on the LTCC (Low Temperature Co-fired Ceramic) technology, the Marchand structure principle design is adopted, a 1 / 4 wavelength coupling line is realized through a broadside coupled spiral structure, the size of the balun is greatly reduced, meanwhile, two groups of coupling transmission lines adopt a folding mode, the three-dimensional wiring advantage of the LTCC technology is fully utilized, and the size of the balun is greatly reduced. Signal shielding cover is carried out in the middle through GND, crosstalk between two groups of coupling transmission lines is avoided, and the novel base station has the functional characteristics of small insertion loss, good amplitude flatness, high phase consistency, broadband and small size.

The embodiment of the invention provides a packaging chip, a radio frequency communication module and communication equipment, and is applied to the technical field of semiconductor packaging. The package chip includes a wafer. The packaging chip further comprises at least one first attenuation element and at least one first tuning element, the first attenuation element is an equivalent capacitor or an equivalent resistor, and the first tuning element is an equivalent capacitor, an equivalent inductor or an equivalent resistor. Wherein the wafer is provided with a filtering structure, and the filtering structure comprises a first filtering resonance structure. The at least one first attenuation element is connected with the first end and the second end of the first filtering resonance structure so as to form a parallel structure with the first filtering resonance structure. The first end of each first tuning element is connected to a transmission path formed by the first end and the second end of the first filtering resonance structure and the at least one first attenuation element, and the second end of each first tuning element is grounded. According to the embodiment of the invention, the suppression degree and / or isolation degree of the filter device are / is greatly improved on the basis of not increasing the signal insertion loss.

The invention discloses a power distribution estimation method for optical performance monitoring of an optical communication system, and relates to the technical field of optical communication. A received signal is preprocessed to generate a complex value signal, the complex value signal is divided into two paths of signals, one path of signals is subjected to standard digital signal processing, the other path of signals is subjected to partial dispersion compensation, nonlinear compensation and residual dispersion compensation after dispersion reloading, absolute values of the two paths of signals are taken for related processing, and power is obtained; a power distribution diagram is obtained after repeated processing for n times, links of the power distribution diagram are changed, insertion losses are added to different link sections, then power is obtained by repeating the calculation method, multiple power distribution diagrams are obtained after repeated processing for n times, and all obtained power distribution diagram data are input into a deep neural network to train and recognize abnormal power distribution; according to the power distribution estimation method for optical performance monitoring of the optical communication system, the nonlinear Kerr effect of the optical fiber is utilized for longitudinal monitoring, and power distribution of multiple cross optical links is measured.

The invention relates to the technical field of optical fiber connector connection monitoring, in particular to an AI-based optical fiber connector connection reliability monitoring method and system, and the method comprises the steps: constructing a multi-mode monitoring data source through synchronously collecting time sequence parameters including optical power, insertion loss, return loss and other physical quantities and a connector end face image, the image is subjected to feature mapping through the convolutional neural network, spatial features of pollution, scratches and alignment deviation are automatically extracted, manual inspection is replaced, and the recognition efficiency and objectivity are improved. Time sequence parameters are input into the modeling performance evolution trend of the long-short-term memory network, and weak dynamic characteristics such as chronic degradation are effectively captured. And through fusing image space features and parameter trend features, strengthening key factor characterization, and outputting a reliability determination result of the connector through a residual error classification network, accurate classification of normal, to-be-maintained and fault states is realized, traceability alarm information can be generated, and intelligent monitoring and early warning of the operation state of the connector are realized.

The invention relates to the technical field of insertion loss test, and discloses a spring force control insertion loss test probe device which comprises a mounting seat, an elastic probe assembly and a fine adjustment assembly. A supporting frame is arranged at the bottom of the mounting base, the elastic probe assembly is located below the mounting base, the elastic probe assembly is connected with the supporting frame, the height of the elastic probe assembly is adjustable, the fine adjustment assembly is located on one side of the probe assembly, one end of the fine adjustment assembly is connected with the elastic probe assembly, and the fine adjustment assembly is used for adjusting the elastic value of the elastic probe assembly. The optimal contact pressure can be accurately set according to the characteristics of different circuit boards, poor contact caused by too small pressure or needle mark damage caused by too large pressure is avoided, the same set of device can adapt to the test pressure requirements of different circuit boards, and the problem that the fixed elastic K value cannot be adjusted, and consequently the needle mark difference between different boards is large is solved.

The invention provides a packaging-level integrated optical fiber micro-vibration sensing device which comprises a photoelectric function cavity and a micro-bend sensing optical fiber with a long-period fiber grating structure, a light source assembly and a signal processing device are arranged in the photoelectric function cavity at intervals, the light source assembly is optically connected with the input end of the micro-bend sensing optical fiber, and the signal processing device is electrically connected with the input end of the micro-bend sensing optical fiber. The signal processing device is optically connected with the output end of the micro-bend sensing optical fiber, the signal processing device is used for converting an optical signal of the output end into an electric signal and restoring an original vibration signal, and the optical fiber micro-vibration sensing device further comprises micro-bend sensing cavities which are integrally packaged with the photoelectric functional cavity and are arranged at intervals; an oscillation block and a flexible material layer covering the oscillation block are arranged in the microbend sensing cavity, and the long-period fiber grating structure is embedded in the flexible material layer and penetrates through the oscillation block. According to the optical fiber micro-vibration sensing device, extra insertion loss can be reduced, the mechanical stability, the sensing sensitivity and the response speed are improved, and the anti-interference capability and the adaptability to fine scenes are enhanced.

The invention belongs to the technical field of electromagnetic compatibility design, and discloses a circuit topology and frequency-dependent inductance type selection design method considering frequency-dependent parameter influence and used for a wide-band multi-order EMI filter. According to the method, the problem of EMI filter high-frequency insertion loss deformation failure caused by the fact that actual source impedance, load impedance and filtering branch impedance change along with frequency is considered at the same time, and the method capable of rapidly and simply generating insertion loss of various EMI filtering topological structures is provided. Therefore, the target inductance value frequency spectrums on the standard exceeding frequency points under different filtering topologies can be accurately and quickly calculated; calculating a required maximum design coefficient according to the relative permeability spectrum of the frequency-dependent inductor with the high broadband attenuation rate, guiding the design of the spatial structure and the number of turns of the inductor of the filter, and evaluating the optimal filtering topology by comparing the maximum design coefficients under different topological structures with the same order; therefore, the accuracy of topology selection and inductance design of the EMI filter is improved, and the development cost of the EMI filter is finally reduced.

The invention discloses a vertical plasmon waveguide device structure capable of being coupled by an optical fiber and a preparation method of the vertical plasmon waveguide device structure, and belongs to the technical field of integrated optoelectronics, and the structure is composed of a pair of metal gratings and a vertical metal-medium-metal plasmon waveguide. The structure comprises a silicon substrate layer, a lower metal layer, a dielectric layer and an upper metal layer which are arranged from bottom to top and is divided into a grating area and a waveguide area, the grating area comprises a dielectric grating area and a metal grating layer, and the waveguide structure comprises the lower metal layer, the dielectric layer and the upper metal layer. According to the design of the invention, the limitation of mass production caused by an overlay process of a mode converter between heterogeneous integrated waveguides is avoided, and the preparation robustness of the device is improved. The optical insertion loss caused by the roughness of the side wall of the waveguide is improved in a metal deposition-dielectric spin coating-metal deposition mode, and the dielectric layer can be replaced to realize multiple device functions.

This application provides a spatial light modulator and a wavelength-selective shape. The spatial light modulator includes a backplane with a built-in driving circuit, a phase adjustment unit, electrodes, and an electrical connection. The phase adjustment unit includes a lower cavity mirror, a cavity layer, and an upper cavity mirror, with the lower cavity mirror located between the cavity layer and the backplane. The electrodes include a first electrode and a second electrode, located in the phase adjustment unit on the side of the lower cavity mirror facing away from the backplane. The electrical connection electrically connects the electrodes and the driving circuit to form a driving electric field between the first and second electrodes, thereby adjusting the refractive index of the phase adjustment unit. This application can achieve low insertion loss, high-efficiency light conversion while increasing the duty cycle.

The present disclosure describes an optical system that accounts for insertion loss of ports. According to an embodiment, the system includes an optical module and a host device. The optical module includes a memory that stores a table that includes a first pre-equalizer parameter for a first insertion loss. The host device includes a port, a pre-equalizer, a memory, and a processor communicatively coupled to the memory. The port receives the optical module. The memory stores a second pre-equalizer parameter for the pre-equalizer. The processor performs an operation that includes retrieving, based on an insertion loss of the port and the first insertion loss, a portion of the table that includes the first pre-equalizer parameter, determining a convolution of the second pre-equalizer parameter with the first pre-equalizer parameter, and adjusting the pre-equalizer based on the convolution.

The invention relates to the technical field of wireless communication, and discloses a liquid crystal antenna and communication equipment, and the liquid crystal antenna comprises a liquid crystal box and a metal waveguide; the liquid crystal box at least comprises a first substrate, a second substrate and a liquid crystal layer, wherein the first substrate and the second substrate are oppositely arranged, and the liquid crystal layer is located between the first substrate and the second substrate. The metal waveguide is located on the side, away from the second substrate, of the first substrate. The liquid crystal box further comprises a first metal layer which is located on the side, away from the metal waveguide, of the first substrate. The first metal layer is grounded, and the first metal layer comprises two hollow grooves; the length direction of the metal waveguide is the same as that of the hollow groove; in the direction perpendicular to the plane where the first substrate is located, the metal waveguide and the two hollowed-out grooves are at least partially overlapped. The communication equipment comprises the liquid crystal antenna. According to the invention, insertion loss can be effectively reduced, antenna bandwidth is improved, and antenna gain is ensured.

Liquid metal (LM) interconnects have angled features to reduce reflection loss and / or insertion loss of signals sent across the interconnects. The LM interconnects may be used to couple two electronic components, e.g., to physically and electrically couple an IC device and a circuit board together. One component has an array of LM wells, and the second component has a corresponding array of pins. The LM wells have tapered shapes, e.g., tapered sidewalls with LM within the sidewalls. A cap layer along seals the wells to hold the LM inside the wells. The pins on the second component have a flared portion that widens in the direction of the second component and tapers in the direction of the tip. When a pin is inserted into a corresponding LM well, the tip and straight (e.g., cylindrical) sections may be within the LM well, while the flared portion remains within the cap layer.

The invention discloses a polarization independent mode multiplexing / demultiplexing device based on a transverse sub-wavelength grating structure, and belongs to the technical field of photoelectrons. The device adopts an asymmetric directional coupler structure and mainly comprises a bus waveguide formed by a transverse sub-wavelength grating waveguide and a coupling waveguide parallel to the bus waveguide. The core is that longitudinal sub-wavelength grating waveguides with specific duty ratios are introduced to the coupling side of a bus waveguide and the two sides of a coupling waveguide, and accurate matching of dual-polarization-state effective refractive indexes and coupling lengths is achieved through combined regulation and control of geometric parameters of transverse and longitudinal gratings. And the dual-polarization fundamental mode in the coupling waveguide and the dual-polarization same-order high-order mode in the bus waveguide can realize synchronous conversion in a coupling region. The invention overcomes the defect of strong polarization correlation of the traditional device, has the advantages of polarization independence, low crosstalk, low insertion loss, compact structure, high process tolerance, easiness in mode expansion and the like, and can be used for multi-dimensional multiplexing transmission in optical communication and optical interconnection systems.

The embodiment of the invention provides a light reflection detection device and a light reflection detection method, which are applied to the technical field of optical communication. The device comprises a light reflectometer, a calibration piece and a signal processor. The calibration member has a preset reflection intensity or a preset Rayleigh scattering intensity. The output end of the light reflectometer is connected with the calibration piece and is used for being connected with the test optical fiber through the calibration piece. The light reflectometer is used for transmitting a test light signal based on the output end of the light reflectometer and receiving an echo light signal of the test light signal. And the signal processor is used for outputting signal insertion loss at different positions of the test optical fiber according to the echo optical signal. The light reflection detection device provided by the embodiment of the invention can realize the purpose of accurately detecting the insertion loss of the near end of the test optical fiber.

The present application provides a radio frequency chip signal transceiver and communication equipment, which includes: a chip body; a coupling structure, including: a resonator, forming a resonant cavity, the inner wall of the resonant cavity being made of metal; a redistribution layer, arranged above the resonant cavity, including an RDL dielectric layer; a radiator, made of metal, formed into a centrally symmetrical shape, arranged on the surface of the dielectric layer facing the resonant body, and accommodated in the resonant cavity; a feed line, one end of which is connected to the chip body and the other end is inserted into the resonant cavity; a packaging structure, used to package the chip body and cover the redistribution layer, so that the signal generated by the chip body can be efficiently coupled to the polymer transmission line. Since the above structure is packaged in the chip, it can reduce the insertion loss caused by the connection between the chip and the coupling structure, thereby improving the coupling efficiency, and can improve the integration of the chip and the coupling structure, facilitating large-scale processing.