Encapsulation structure and method of the high-speed semiconductor light emission component

A technology of light emission components and packaging structures, which is applied in the manufacture of semiconductor devices, semiconductor lasers, semiconductor/solid-state devices, etc., can solve problems such as difficult to achieve high speed, achieve the effect of reducing eccentricity, reducing load, and facilitating debugging and installation
CN101017956AInactive Publication Date: 2007-08-15SEMICON MFG INT (SHANGHAI) CORP +1
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
SEMICON MFG INT (SHANGHAI) CORP
Publication Date
2007-08-15
Estimated Expiration
Not applicable · inactive patent

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Abstract

The package structure for a high-speed semiconductor light emission assembly comprises: a dish-type case with RF connector, a semiconductor refrigerator to control the work temperature of emission chip, a KOVAR metal heat sink, a medium heat sink substrate, a light emission device, a thermistor, a backlight detector, the metal wire to connect dc connection electrode and case pin, a coplanar waveguide transmission lie on medium substrate, and optical coupling assembly. Wherein, it uses BTF standard package form for dc terminals outside the case.
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Description

technical field

[0001] The invention mainly relates to the field of optical fiber communication, and more specifically relates to a package structure of a light emitting component for high-speed, long-distance transmission. Background technique

[0002] In the field of optical fiber communication, semiconductor lasers and their integrated devices with other optoelectronic devices have always been the preferred devices as signal sources. Here we collectively refer to semiconductor lasers and their integrated devices with other optoelectronic devices as semiconductor light-emitting devices, for example, various semiconductor lasers; integrated devices of DFB / DBR lasers and modulators; lasers, modulators, amplifiers, and spot converters , integrated devices of various functional devices such as optical waveguides, but not limited to these.

[0003] After the optoelectronic device chip is manufactured, packaging is the key to whether the device can fully demonstrate its perform...

Claims

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