Device used for realizing microwave chip eutectic pressurization and pressurization method

A microwave chip and chip technology, which is applied in the manufacture of electrical components, electrical solid devices, semiconductor/solid devices, etc., can solve the problem of damage to microwave chips, and achieve the effect of uniform pressure, low cost, and convenient use

Inactive Publication Date: 2016-07-20
SOUTHWEST CHINA RES INST OF ELECTRONICS EQUIP
View PDF4 Cites 23 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Aiming at the technical problem of damaging the surface of microwave chips in pressurization in the prior ...

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Device used for realizing microwave chip eutectic pressurization and pressurization method
  • Device used for realizing microwave chip eutectic pressurization and pressurization method
  • Device used for realizing microwave chip eutectic pressurization and pressurization method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0018] The specific implementation manners of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0019] The invention discloses a device for microwave chip eutectic pressure, which specifically includes a substrate stopper 10 , a chip stopper 11 , a point contact pressing block 12 and a counterweight pressing block 13 .

[0020] The substrate stopper 10 is used for fixing the position of the substrate during the eutectic process.

[0021] The chip stopper 11 is used to fix the position of the chip, the point contact pressing block and the counterweight pressing block during the eutectic process.

[0022] The point contact pressing block 12 is used for point contact pressure on the chip surface during the eutectic process.

[0023] The counterweight press block 13 is used in the eutectic process to provide appropriate pressure to overcome the surface tension of the solder and cause large-area soldering holes on the edge of ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
Diameteraaaaaaaaaa
Heightaaaaaaaaaa
Login to view more

Abstract

The invention relates to the microwave chip eutectic technology and discloses a device used for realizing microwave chip eutectic pressurization. The device specifically comprises a substrate limiter, a chip limiter and a point contact press block, wherein the chip limiter is provided with a chip limit hole, the dimension of the chip limit hole is in matching with the dimension of a chip and is used for limiting the chip, the lower surface of the chip contacts with an upper surface of a substrate through a welding tab, the bottom board of the point contact press block is provided with micro supporting columns, the quantity of the micro supporting columns is smaller than or equal to the quantity of welding pads on the upper surface of the chip, positions of the micro supporting columns and positions of the welding pads on the upper surface of the chip are in mirror symmetric relationship, and the micro supporting columns on the point contact press block contact with the welding pads on the upper surface of the chip. When the chip and the substrate are in an eutectic state, on the point contact press block, only the micro supporting columns and the welding pads on the surface of the chip mutually contact, so a special structure such as an air bridge on the surface of the microwave chip can be prevented from being damaged. The invention further discloses a microwave chip eutectic pressurization method.

Description

technical field [0001] The invention relates to microwave chip eutectic technology, in particular to a device and method for eutectic pressure of microwave chips. The device and method can avoid damage to special structures such as "air bridges" on the surface of microwave chips. Background technique [0002] When the chip and the substrate are eutectically welded, because the self-weight of the chip is too small to overcome the surface tension of the solder, there are welding holes on the edge of the chip, and the eutectic is unqualified. Chinese patent CN201120514646.3 discloses a eutectic fixture for integrated packaging of multiple LEDs. The fixture uses a pressure column to press the chip. Chinese patent 201120569048.7 discloses a multi-LED integrated package eutectic fixture, including substrate fixture, chip positioning fixture and pressurized fixture, which is assembled in three parts, and solves the problem of chip and ceramic substrate in vacuum / controlled atmosphe...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): H01L21/60H01L21/603H01L21/67
CPCH01L21/67121H01L24/75H01L24/81H01L2224/7555H01L2224/8119H01L2224/818
Inventor 王辉庞婷
Owner SOUTHWEST CHINA RES INST OF ELECTRONICS EQUIP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap