Flexible copper-clad plate material based on perfluoroalkene ether copolymer and processing equipment thereof

A technology of flexible copper clad laminates and perfluoroalkene ethers, which is applied in the direction of layered products, metal layered products, synthetic resin layered products, etc., and can solve the problems of low heat resistance temperature, large dielectric loss, and high dielectric constant. , to achieve the effect of low dielectric constant, low dielectric loss, and small dielectric loss

Active Publication Date: 2021-07-13
HANGZHOU NORMAL UNIVERSITY
View PDF10 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the existing invention still has problems such as high dielectric constant, large dielectric loss and low heat resistance temperature.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Flexible copper-clad plate material based on perfluoroalkene ether copolymer and processing equipment thereof
  • Flexible copper-clad plate material based on perfluoroalkene ether copolymer and processing equipment thereof
  • Flexible copper-clad plate material based on perfluoroalkene ether copolymer and processing equipment thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0024] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, not all of them. Unless otherwise specified, the technical means used in the embodiments are conventional means well known to those skilled in the art.

[0025] In describing the invention, it is to be understood that the terms "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", " The orientations or positional relationships indicated by "horizontal", "top", "bottom", "inner", "outer", etc. are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the invention, rather than indicating or implying the It should not be construed as limiting the invention that a de...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
Login to view more

Abstract

The invention relates to the field of copper-clad plate materials, in particular to a flexible copper-clad plate material based on a perfluoroalkene ether copolymer and processing equipment of the flexible copper-clad plate material. According to the specific technical scheme, the flexible copper-clad plate material based on the perfluoroalkene ether copolymer comprises a base material film layer, and the base material film layer is composed of the perfluoroalkene ether copolymer or a composite material of the perfluoroalkene ether copolymer. The processing equipment of the flexible copper-clad plate material based on the perfluoroalkene ether copolymer comprises a pressurizing mechanism and a turnover mechanism, wherein the pressurizing mechanism has pressurizing and heating functions; and the turnover mechanism can integrally turnover the pressurizing mechanism. Compared with the prior art, the flexible copper-clad plate material and the preparation method thereof have the advantages of low dielectric constant, small dielectric loss, high temperature resistance, few processing steps and high processing efficiency.

Description

technical field [0001] The invention relates to the field of copper clad laminate materials, in particular to a flexible copper clad laminate material based on a perfluoroalkene ether copolymer and processing equipment thereof. Background technique [0002] With the continuous development of science and technology, due to the miniaturization, light weight and thinness of electronic products, printed circuit boards must have various high-quality and high-tech features, so that printed circuit board manufacturing technology directly involves various contemporary high-tech , its main and most important material - copper clad laminate, must also have various high-quality and high-tech characteristics; at present, mainland China has already become a major producer of copper clad laminate in the world, but it is still facing the problem of excessive output speed of copper clad laminate Slow, low yield rate, low overall production capacity. [0003] The traditional FR-4 copper cla...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): C08L29/10C08L27/18C08K3/36C08J5/18B32B15/08B32B15/20B32B27/06B32B27/30B29C70/68B29C70/88
CPCC08J5/18B32B15/08B32B15/20B32B27/06B32B27/30B29C70/68B29C70/681B29C70/88C08J2329/10C08J2327/18C08K3/36C08K2201/011
Inventor 李勇进叶立峰
Owner HANGZHOU NORMAL UNIVERSITY
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap