Cordierite-based microcrystalline glass material and preparation method thereof

A technology of glass-ceramics and cordierite, which is applied in the field of electronic ceramic materials, can solve the problems of poor matching of silicon chips, large thermal expansion coefficient, and high dielectric loss, and achieve high density, lower sintering temperature, and low dielectric loss.

Inactive Publication Date: 2018-12-07
UNIV OF ELECTRONICS SCI & TECH OF CHINA
View PDF6 Cites 16 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The purpose of the present invention is to provide a cordierite-based low-thermal-expansion A glass-ceramic material and a preparation method thereof, and an electronic packaging substrate made of the material can not only achieve good thermal matching with a silicon chip, but also have high bending strength, good dielectric properties, simple production process, high stability, low cost

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Cordierite-based microcrystalline glass material and preparation method thereof
  • Cordierite-based microcrystalline glass material and preparation method thereof
  • Cordierite-based microcrystalline glass material and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0019] The present invention will be described in further detail below in conjunction with the accompanying drawings and embodiments.

[0020] The present invention provides 5 examples, respectively numbered NO.1-5, wherein the components and sintering conditions of cordierite-based low thermal expansion glass-ceramic materials in each example are shown in the following table:

[0021]

[0022] Concrete preparation process is as follows:

[0023] Accurately calculate the actual amount of the corresponding raw materials according to the mass percentage of each oxide in Table 1 of the design formula, mix and ball mill for 2 hours, mix evenly and dry, put the mixture in a crucible, and melt at a high temperature of 1400-1450°C for 1 hour , the glass slag is obtained after water quenching, and the glass slag is wet ball milled for 5 to 6 hours, then dried and sieved to obtain a uniformly dispersed powder, which is granulated with acrylic acid as a binder, pressed and formed, an...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
flexural strengthaaaaaaaaaa
flexural strengthaaaaaaaaaa
flexural strengthaaaaaaaaaa
Login to view more

Abstract

Belonging to the field of electronic ceramic materials, the invention provides a cordierite-based microcrystalline glass material and a preparation method thereof, and overcomes the problem of poor matching with silicon chips caused by large thermal expansion coefficient, low flexural strength, high dielectric constant, high dielectric loss and the like of existing ceramic materials. The cordierite-based microcrystalline glass material provided by the invention belongs to a magnesium-aluminum-silicon system, the principal crystalline phase is cordierite, the density is high, the flexural strength is up to 230MPa, the Young's modulus is 80-100GPa high, the thermal stability is good, the thermal expansion coefficient is 1.5-2.5*10<-6> / DEG C (20-600DEG C) low, and the cordierite-based microcrystalline glass material can form good match with silicon chips. At the same time, the dielectric constant can be adjusted to 4.5-5.0, the dielectric loss is tan Delta is less than 0.6*10<-3>, the signal transmission speed is greatly improved, and the power consumption is greatly reduced. In addition, in the preparation process, the temperature is lowered from the 1100DEG C or above in the traditional sintering process to 900DEG C or below, under the premise of improving the performance, the sintering temperature is further reduced and the production cost is saved. Moreover, the whole preparation technology has the characteristics of simple process, abundant raw material sources and energy consumption reduction, thus being of important significance for industrial production.

Description

technical field [0001] The invention belongs to the field of electronic ceramic materials, and relates to a cordierite-based low-thermal-expansion glass-ceramic material and a preparation method thereof; the material is suitable for electronic packaging, especially for ultra-large-scale integrated circuits. Background technique [0002] The rapid development of information technology promotes the continuous development of integrated circuit systems towards high density, ultra-large scale and multi-functionalization. The rapid improvement of semiconductor chip performance also makes electronic packaging technology develop towards more advanced high-density and three-dimensional packaging. , which puts forward higher requirements for electronic packaging substrate materials, especially the need to have sufficiently high flexural strength and excellent dielectric properties, and the thermal expansion coefficient needs to match the substrate and chip. Electronic ceramic material...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): C03C10/08C03C12/00
CPCC03C10/0045C03C12/00
Inventor 李波荆柯
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products