93results about How to "Improve assembly density" patented technology

The invention provides a 3D assembling method for integrally integrating chips of T / R assembly, and aims to provide a T / R assembly which has advantages of reliable performance, higher density, more functions, high signal transmission speed, better performance and relatively lower cost. The 3D assembling method is realized through a solution which comprises the steps of performing z-direction expansion on a planar circuit with printed circuit patterns to a green ceramic chip laminate of a three-dimensional circuit through interlayer vertical interconnection; vertically packaging an active device in a rectangular chamber (7) of the green ceramic chip laminate (5), placing a power supply modulator on the back surface of the bottom of the green ceramic chip laminate, and inputting an outer signal from a low-frequency interface at the back surface of the green ceramic chip laminate to a pad of the green ceramic chip laminate (5); performing radio frequency connection among chips through a metal wire bonding vertical interconnection structure among the green ceramic chip laminates, accurately aligning and laminating the green ceramic laminates in a Z direction, and then sintering at a temperature of 900 DEG C, thereby preparing a three-dimensional circuit low-temperature co-sintered ceramic LTCC substrate which is used for high-density circuits with no three-dimensional space interference and is internally provided with a passive element and can be equipped with bare chips or package chips on the surface.

The invention belongs to the integrated circuit board assembling technology field, and especially relates to an adhesive, preparation method and application in integrated circuit board embedment thereof. The adhesive of the invention comprises, by weight, 100 parts of epoxy resin, 20 to 80 parts of curing agent, 20 to 120 parts of stress absorbent, 90 to 300 parts of filling material and 0.1 to 10 parts of promoter. In the preparation process, the adding sequence and activating time of the different raw materials are controlled to allow the adhesive to have very low curing shrinking stress, higher glass-transition temperature and lower modulus, thereby not only protecting the integrated circuit board well, but also enabling the integrated circuit board with application of the adhesive notto break or lift the adhesive due to reliability test, and improving the reliability and security of the integrated circuit board applied in the severe environment.

The invention discloses a micro-channel cold plate structure. The micro-channel cold plate structure comprises a substrate and a micro-flowing-channel network processed on the substrate; and the micro-flowing-channel network comprises a shunting structure, a partial micro-channel network and a confluence structure in a combined manner. The micro-channel cold plate structure has the beneficial effects as follows: reasonable flow deploying of a cooling working medium is realized through T-shaped flowing channels, and then heat transfer is strengthened by tree-like and parallel micro channels; finally, energy re-confluence is realized through inverse Y-shaped two-furcation flowing channels, so that high channel distribution uniformity is realized, and the network can be uniformly distributed in the whole to-be-dissipated region; the overall micro-fluid network is in all-parallel-connection way, so that high temperature consistency is achieved; the cooling working medium flows smoothly in the flowing channels, so that low flowing resistance is formed; and furthermore, the micro channels in each group of the partial micro-channel network are arranged in parallel, and the channels are more in branches and high in span, so that the process can be realized conveniently, partial pressure loss can be lowered, and the heat dissipation performance of the micro-channel cold plate can be further improved.

The invention discloses a three-network integrated dual-mode intelligent set top box. The three-network integrated dual-mode intelligent set top box is characterized by comprising a central processing unit, an AndroidDVB processing module, an intelligent card, a memory, a signal processing module, a camera, an audio and video input and output module, a tuner, a communication module and a network module, wherein the AndroidDVB processing module, the intelligent card, the memory, the signal processing module, the camera and the audio and video input and output module are connected with the central processing unit, the tuner is connected with the AndroidDVB processing module, and the communication module and the network module are connected with the signal processing module. The three-network integrated dual-mode intelligent set top box is compatible with traditional digital television direct transmission, on-demand unicast and other services and meanwhile has the network video playing, video call, game entertainment, family networking and other functions, and is suitable for efficiently developing data and internet services, capable of meeting three-network integrated service requirements, wide in application range and high in practicality.

A rope for an elevator in which a plurality of core rope strands are stranded on the outer circumference of a core strand. A core rope strand assembly is constituted of these core rope strands. The core strand has a core strand body, and a resin core strand coating covering the core strand body. Each core rope strand has a core rope strand body. The core rope strand assembly is covered with the resin core rope coating. Plurality of outer layer strands are stranded on the outer circumference of the core rope coating. An outer layer strand assembly is constituted of these outer layer strands. The outer layer strand assembly is covered with an outer layer resin coating.

The invention discloses an integration-type passive element and a manufacturing method thereof. The integration-type passive element is sequentially stacked with a first insulation layer, a second insulation layer and a third insulation layer on the upper surface of a substrate; a first circuit layer is arranged in the first insulation layer and comprises at least one capacitor structure and at least one resistor structure; a second circuit layer is arranged in the second insulation layer, has the thickness within 5 to 50 microns and forms at least one first inductor structure; and a third circuit layer is arranged in the third insulation layer, has the thickness within 5 to 25 microns and forms at least one second inductor structure. The integration-type passive element can be manufactured by adopting a semiconductor rear section encapsulation substrate device, has the capacitor structure with the thickness more than 5 microns, is further beneficial to reducing the inductor loss and improving the inductor efficiency and can improve the integration density of the passive element and reduce the element size.

The invention discloses a high bandwidth antenna servo control stable platform, and is aimed at providing a stable platform which is high in transmission stiffness and low in frictional resistance and can realize scan tracking of a same-caliber antenna. The stable platform is realized via the following technical solution: two push-pull connecting rod assemblies (7) are symmetric to a gyro assembly (5) and connected to a frame, a pitching drive motor (9) with a pitching rotary transformer (11) is fixedly connected to the middle part of two side azimuth drive motors via a pitching drive frame (6) fixedly connected with the two side azimuth drive motors (10), an azimuth drive frame (2) and the pitching drive frame are connected to an antenna feeder load upper frame (1) by the push-pull connecting rod assemblies to form a parallelogram mechanism of double frames and four push-pull rods, the lengths of the push-pull connecting rod assemblies (7) are adjusted via threads of a bulb (15), movement of two degrees of freedom of azimuth and pitching of the antenna feeder load upper frame is driven, the kinetic energy is transferred to the upper load frame, and the drive frame thus drives the load frame.

Anodes for lithium batteries and lithium batteries employing the anodes are provided. In one embodiment, an anode includes an anode active material, and a binder including a waterborne acrylic polymer and a water-soluble polymer. The binder permeates the anode active materials to provide binding force between the anode active materials through point binding. The binder has excellent binding force and elasticity, and does not experience the spring-back phenomenon during electrode manufacture. The anodes have improved assembly density, high capacity and high energy density. Further, the anodes have improved lifetime characteristics since the anode structure is maintained long term over repeated charge / discharge cycles.

The invention provides a stereo antenna capable of deforming arbitrarily. The stereo antenna comprises a flexible substrate and a coil which is arranged on the flexible substrate. The stereo antenna is connected with a chip. The stereo antenna can be folded into a two-dimensional or three-dimensional structure. Therefore, the stereo antenna can gain more magnetic flux, the card swiping distance is increased in disguised form, and the payment experience is improved.

The invention discloses a high-reliability ultra-small metal ceramic surface-mounted device packaging process. The packaging process adopts a deep cavity gold-base soldering terminal eutectic soldering process and a deep cavity bonding process; a chip is welded on a tube shell by adopting the deep cavity gold-base soldering terminal eutectic soldering process; the welding is high in shearing force, low in thermal resistance and high in reliability, so that the thermal resistance and the saturation voltage drop of the device are reduced, and the thermal fatigue resistance of the device is improved; meanwhile, a chip welding process for various kinds of back surface materials can be satisfied; by adopting the small-sized deep cavity bonding process, the atomic-level contact of the bonding material is realized, and the reliability in the bonding wire welding of the device is improved; the automation of the process can be easily realized, and the production efficiency is improved; and the working range of the packaging process is from minus 65 DEG C to 200 DEG C. The packaged product can be widely applied to computers, radars, communication transmitters, aerospace crafts, instruments and the like.

The invention discloses a nanometer red long-afterglow luminescent material and a preparation method of the nanometer red long-afterglow luminescent material, belonging to the technical field of nanometer luminescent materials. The chemical formula of the material is Y202S: xSm<3+> and x=0.01-0.08; the preparation method comprises the following steps: weighing water soluble yttrium salt, water soluble samarium salt, thiocarbamide, a surfactant and ethylene glycol according to a molar ratio of 2:(0.03-0.08):(6-8):(0.05-0.1):(40-60); mixing the weighed materials for dissolution to obtain a solution; preserving the heat of the solution at a temperature from 100 DEG C to 200 DEG C in an enclosed state for 6-24 hours to obtain a brown product; cooling the brown product, filtering, washing and drying the cooled brown product to obtain a precursor; and annealing the precursor at a temperature from 600 DEG C to 1100 DEG C in a reducing atmosphere for 2-3 hours to obtain the needed product. The nanometer red long-afterglow luminescent material disclosed by the invention is good in dispersity, uniform in size and hollow in sphere structure and can be widely used for bioluminescent markers, drug release and transmission materials, light filling materials and the like.

The invention discloses a micro-inertial measuring component structure to resist a high overload, and the micro-inertial measuring component structure comprises a supporting structure that is a hollowed-out hexahedral structure formed by supporting ribs. Three orthogonal axial sides of the hexahedral structure are open-through. At least one frame of one hollow plane extends outwardly to form a lugboss, so that the supporting structure has seven hollow planes for mounting circuit boards. A potting material is filled into the internal space of the hexahedral structure through the three orthogonal axial sides. The micro-intertial measuring component structure reduces the degree of assembly complexity of a sensor circuit board as well as an overall component, and reserves a space or a passagefor flowing of the material in the potting process to ensure the compactness of the potting. The micro-inertial measuring component structure is novel in design and easy for assembly operation, and high overload requirements can be met while realization of miniaturization.

The invention discloses a data collecting and alarming device of a wireless anti-collision pier monitoring and alarming system.The device comprises an analog signal filtering and signal processing module, a data latch module, a programmable logic module, a main control module, a level conversion module and a data communication interface module; the analog signal filtering and signal processing module comprises three channels, and the input ends of the channels are connected with a south-north sensor, an east-west sensor and a vertical sensor respectively.According to the data collecting and alarming device, the design method that the three channels conduct data collecting and signal processing synchronously is adopted for the characteristics of low-frequency signal collecting and bridge anti-collision pier structure testing, the three channels are independently designed, the main control module ensures complete synchronization of the three channels through a synchronous starting analog-digital conversion signal generated through massive programmable logic device decoding, the problems that in traditional data collecting, more channels are needed, and a large error is generated in synchronous collecting are solved, therefore, completely synchronous collection of the three channels is achieved, and the vibration monitoring requirement of an anti-collision pier is met.

The invention discloses a surface mount microwave device. Copper foil layers (4) and copper foil circuit layers (5) are symmetrically arranged between cover plates and a central medium material layer (3). Medium material layers (6) are arranged between the copper foil layers (4) and the copper foil circuit layers (5). Press-fitting glue film layers (7) for press-fitting are arranged between the copper foil circuit layers (5) and the medium material layers (6). A packaging process comprises the following steps of: tin paste printing, automatic mounting, curing, reflow soldering and cleaning to complete packaging. Since a strip line structure is used instead of a microstrip line and a copper foil circuit line in the strip line is in a folded and multilayer structure, the effective dielectric constant of the circuit is improved and the size of the microwave device is greatly reduced; and since a surface mount packaging method is adopted, slots for installation are not needed to be excavated in a printed circuit board and a chamber body, the printed circuit board is directly installed, the surface mounting is realized, the design and the realization of a microstrip circuit and a microstrip system are facilitated and optimized, the applicability is greatly increased and the application scope is wider.

The invention belongs to the field of electromechanical servo driving, and specifically discloses a digital isolation type high-power three-phase brushless motor driving module. The signal output endof an optical coupling isolation unit and the signal output end of an overcurrent protection unit are both connected with the signal input end of a logic unit; the signal output end of the logic unitand the signal output end of the overcurrent protection unit are both connected with the signal input end of an H bridge driving control unit; the signal output end of the H bridge driving control unit is connected with the signal input end of a field effect transistor output unit; the signal output end of the field effect transistor output unit is connected with the signal input end of the overcurrent protection unit and external motor windings U, V and W separately; the optical coupling isolation unit, the logic unit and the H bridge driving control unit are all connected with a working power supply V<cc>; and the overcurrent protection unit and the field effect transistor output unit are both connected with a power power-supply V<s>. The driving module disclosed in the invention is highin reliability, integration, working current and power density, and short in production period.

The invention relates to a vacuum encapsulation device for high-power high-packaging-density electronic products, and an encapsulation method thereof. The encapsulation device comprises an encapsulation adhesive trough and a product accommodation groove which is provided at the lower side of the encapsulation adhesive trough and is used to place an electronic product. The top of the encapsulation adhesive trough is in an open state, and the bottom is provided with many openings corresponding to encapsulation holes in the electronic product. The openings and the encapsulation holes are mutually sealed and fixed via a rubber elastic ring. The invention is used for products with high power, high packaging density and great heat-dissipating demand. Encapsulation of electronic products via the encapsulation device and the vacuum device is convenient with dense encapsulation and good quality, thereby guaranteeing the product heat-dissipating effect and reducing product failure.

The invention relates to a COB encapsulation method. The COB encapsulation method is characterized by comprising the following steps: preparing a single-sided FPC board (1), wafer expansion, gum application, chip ejection, curing, die bonding, bonding, dispensing and curing. With the COB encapsulation method adopted, improvement on precision and weight of the COB during package and bonding is achieved.

The invention discloses a strong earthquake record acquisition system based on the wireless technology. The system comprises acceleration sensors, analog signal processors, an analog-to-digital signalconverter, a master control CPU controller, a remote wireless 4G communication system, a GPS timing system, a power supply conversion module and a wind-solar complementary power supply system, threeacceleration sensors are separately connected with the analog-to-digital signal converter through respective analog signal processors, the analog-to-digital signal converter is connected with the master control CPU controller in a bidirectional manner, and the master control CPU controller is separately connected with the remote wireless 4G communication system and the GPS timing system in a bidirectional manner. According to the strong earthquake record acquisition system, data communication is performed by employing a mobile 4G communication technology adopted in a large area, large-range monitoring and laying of a monitoring network of a strong earthquake system can be realized, and the reliability of strong earthquake monitoring is guaranteed. The strong earthquake record acquisition system has characteristics of flat frequency characteristic response, linear phase change, good consistence of technical parameters, stable and reliable performance, low power consumption, and small size.

The embodiment discloses a switch and a network computer room for placing the switch. The switch comprises a cabinet, a middle plate and a plurality of plug-in cards, wherein each plug-in card includes two port switch chip, one internal connection switch chip, a port connector, a middle plate connector and a guide rail, wherein the ports of the port switch chip are divided into the same number of external connection ports and inner connection ports; the external connection ports are connected with the port connector; the internal connection ports are respectively connected with the internal connection switch chip in each plug-in card; the internal connection ports and the ports of the internal connection switch chips, which are connected across the plug-in cards, are respectively connected with the middle plate connector, so as to achieve connection between the internal connection ports and the internal connection switch chips of different plug-in cards through the middle plate connector; the cabinet includes guide rail slots with the same number of the plug-in cards; and the plug-in cards can be plugged in or pulled out by inserting or pulling the guide rail along the insertion hole of the guide rail slots. The embodiment can improve integrity degree and reduce number of the plug-in cards of the switch, thereby effectively reducing the switch size.

The invention discloses a fabrication process of a multi-layer semiconductor printed circuit board. The fabrication process comprises the following steps of 1, substrate cutting; 2, inner-layer pattern; 3, lamination; 4, mechanical drilling; 5, drill dirt removal and copper deposition, 6, outer-layer pattern; 7, resistant soldering; 8, character making; 9, formation; 10, electrical test; 11, finished product inspection; and 12, finished product package. In the step 1, an original copper-coated plate is cut to form a plate which can be fabricated on a production line. According to the fabrication process of the multi-layer semiconductor printed circuit board, the multi-layer printed circuit board is fabricated by the step process; compared with a single- and dual-layer circuit board, the multi-layer semiconductor printed circuit board has the advantages of high assembly density, small size and good shielding effect, a connection line between electrical component is shortened, the signaltransmission speed is improved, and wiring is facilitated; and for a high-frequency circuit, a ground line is added, so that constant low impedance of a signal line on ground is formed.

The invention discloses a package structure of a thick film hybrid integrated circuit and a manufacturing method of the package structure. According to the package structure of the thick film hybrid integrated circuit provided by the technical schemes of the present invention, a support structure is mounted on a thick film formation substrate, so that a first type of components can be assembled through the thick film formation substrate and the support structure, and therefore, a 3D package structure can be formed, the assembly area of the first type of components in a product can be increased, the assembly density of the thick film hybrid integrated circuit product can be increased, and the miniaturization design of an electronic device can be facilitated.

The invention discloses a packaging technology of a highly-reliable surface mounting glass-packaged diode. The diode comprises a glass housing, a chip arranged in the glass housing and lead-out ends sleeving two ends of the glass housing. A soldering sheet is arranged between each of the lead-out ends and the chip. The lead-out ends are bonded to the glass housing, the soldering sheets and the chip via the high-temperature metallurgical technology. The metallurgical bonding structure is advantaged by high reliability, resistance to big current impact and small thermal resistance, is wide in working temperature range (from -55 DEG C to 125 DEG C) and is anti-high temperature welding. Parameters will not be deteriorated after the metallurgical bonding structure is arranged at a temperature of 550 DEG C for 15 minutes. Thus, thermal matching in whole working temperature range of the product is achieved; nitrogen is used as protective gas during the whole process, so the diode can be safely produced without use of danger gas; the manufactured diode is small in installation size, high in assembly density and light; and operation is simple and batch production or large-scale production can be easily achieved.

The invention relates to a preparation method of sea urchin-shaped basic cobalt carbonate, which is characterized by comprising the following steps: dissolving cobalt nitrate hexahydrate in a mixed solution of deionized water and ethylene glycol to form a solution A, dissolving urea in a mixed solution of ammonia water with a mass fraction of 25% and ethylene glycol to form a solution B, heating the solution A to 70-80 DEG C, dropwise adding the solution B into the solution A while stirring at the speed of 150-180rpm, carrying out solvothermal reaction, conducting centrifuging after the reaction is finished to obtain a precipitate, and sequentially conducting washing and drying. The prepared sea urchin-shaped basic cobalt carbonate nano material is formed by self-assembly of a large number of one-dimensional nanorods, the nanorods radially grow from the center of a sea urchin-shaped structure, the nanorods are high in assembly density and excellent in dispersity, the nanorods are not agglomerated, the assembled sea urchin structure is regular in morphology, uniform in particle size and narrow in distribution, the particle size is about 2-2.5 micrometers, and the product has high purity and no impurity.

The invention discloses a package structure of a thick film hybrid integrated circuit and a manufacturing method of the package structure. According to the package structure of the thick film hybrid integrated circuit provided by the technical schemes of the present invention, a support structure is mounted on a thick film formation substrate, so that a first type of components can be assembled through the thick film formation substrate and the support structure, and therefore, a 3D package structure can be formed, the assembly area of the first type of components in a product can be increased, the assembly density of the thick film hybrid integrated circuit product can be increased, and the miniaturization design of an electronic device can be facilitated.

A surface labeling LED sunlight lamp pertains to lighting device technique field. An inserting LED sunlight lamp in prior art has poor heat radiating property, larger light decay and a shorter service life. The invented surface labeling LED sunlight lamp comprises a glass light tube with two opening ends, two end covers assembled with the two ends of the glass lamp tube respectively, two conductive electrodes assembled with each end cover, a circuit board, a constant-current driver and a plurality of SMD LEDs. The circuit board is disposed axially in the glass lamp tube, the two ends of the circuit board are assembled with the two end covers of the glass lamp tube respectively, the constant-current driver is disposed on the rear surface of the circuit board, and a plurality of SMD LEDs are disposed on the circuit board which is connected electrically with the conductive electrodes through the constant-current driver. The inventive surface labeling LED sunlight lamp can be used in sunlight lamp seats in prior art, is provided with convenient assembly, electric energy saving, good heat radiating property, small light decay, a long service life, and no environmental pollution, and meets energy saving and environmental protection requests.

The invention discloses a wireless multicast and point-to-point communication method for a computer cluster system, which comprises the following steps: sending a communication control frame on a session channel by a sending node, wherein the communication control frame comprises an identification of a data transmission channel for transmitting a data frame and an identification of a receiving node; distributing the session channel and the data transmission channel on the basis of a frequency range of a wireless radio-frequency signal transmitted by an antenna unit; sending a confirming frame by the receiving node after the communication control frame is received by the session channel; switching to the data transmission channel for sending the data frame by the sending node after the confirming frame of the received node is received by the session channel; and switching to the data transmission channel and receiving the data frame sent by the sending node by the receiving node. According to the wireless multicast and point-to-point communication method provided by the embodiment of the invention, the flexibility of the communication between computer nodes in wireless connection is increased and the high throughput of the communication between the computer nodes is kept.

The invention provides a high-density three-dimensional stacking and assembling method for electronic modules. The stacking and assembling method comprises the following steps: completing parallel stacking for functional circuit boards, function circuit sub cards and a radiating plate, and forming a functional circuit module; completing assembling for a back mother board and a machine case back cover board, and assembling for a front mother board and a machine case front cover board; enabling multiple functional circuit modules to be placed horizontally, and perpendicularly stacking the functional circuit modules with a back mother board cover board module through a bottom board connector; coating a machine case left cover board, a machine case right cover board, a machine case upper frame and a machine case lower frame for forming a machine case body; enabling a three-dimensional stacked body to be fixed in the machine case upper frame and the machine case lower frame through locking strips that are positioned on the functional circuit boards; completing the assembling and stacking for the front mother board cover board module; and finally forming the high-density electronic module with an anti-severe environment function. Compared with the existing electronic module assembling method in severe environments, the high-density three-dimensional stacking and assembling method provided by the invention has the advantages of high assembling density, light structural weight, high radiating efficiency, high support for high-speed signals, strong shock-proof and anti-impact capability, and the like.

The invention provides a blind plug type assisting handle mechanism for multi-pin type port control cabinet cases. The blind plug type assisting handle mechanism comprises plugging assisting handle mechanisms, wherein the plugging assisting handle mechanisms are of the same structure and are symmetrically installed on front panels of the multi-pin type port control cabinet cases. Each plugging assisting handle mechanism comprises a handle, a rotary knob assembly and a rotary knob fixing dowel. The handles are connected to the front panels of the multi-pin type port control cabinet cases in a rotating mode, the front panels of the multi-pin type port control cabinet cases are provided with through holes, and the through holes correspond to vertical beams of control cabinets arranged on the multi-pin type port control cabinet cases. One ends of the rotary knob assemblies are installed at the upper ends of the handles, the other ends of the rotary knob assemblies penetrate through the through holes to be arranged in the vertical beams of the control cabinets, and rotary knob fixing dowel hole sites are reserved in the rotary knob assemblies. Handle fixing dowel hole sites matched with the rotary knob fixing dowel hole sites are reserved in the upper ends of the handles. The rotary knob fixing dowels penetrate through the handle fixing dowel hole sites and the rotary knob fixing dowel hole sites to fix the handles and the rotary knob assemblies. Thus, blind plugging and pulling with assistance are achieved, the manual effect is reduced, and the installation performance and the maintenance performance of a measurement and control circuit module are improved.

The invention discloses a stacking structure and method for chips with central bonding points, and the structure effectively solves the lowest assembly problem of the chips with the central bonding points in an insulating glue stacking mode, enables the assembly density of a module to be greater than or equal to 200%, and reduces the size of the module. Due to the fact that the stacking mode can be compatible with processes such as bare chip welding, chip bonding, pressure welding and packaging, the method can solve the problem of stacking of chips with center bonding points, the chips can beeffectively integrated in a high-density mode, model selection of the chips with module function integration of the same function is richer, and the method is an effective integration method for system integration.