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Vacuum encapsulation device for high-power high-packaging-density electronic products, and encapsulation method thereof

A technology of electronic products and assembly density, applied in the direction of sealing shell, cooling/ventilation/heating transformation, etc., can solve the problems of high void rate, difficult to fill products, product failure, etc. handy effect

Active Publication Date: 2016-01-27
NO 43 INST OF CHINA ELECTRONICS TECH GRP CETC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, electronic products with high power and high assembly density need to be potted with high thermal conductivity potting glue because of their large heat dissipation. Since the viscosity of high thermal conductivity potting glue is higher than that of glue, in electronic products with high assembly density, Difficult potting and high void rate will eventually affect the heat dissipation effect of the product and even lead to product failure
For this kind of product, whether it is filled with automatic equipment or manually, it is difficult to fill the product, and the yield is low

Method used

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  • Vacuum encapsulation device for high-power high-packaging-density electronic products, and encapsulation method thereof
  • Vacuum encapsulation device for high-power high-packaging-density electronic products, and encapsulation method thereof
  • Vacuum encapsulation device for high-power high-packaging-density electronic products, and encapsulation method thereof

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Experimental program
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Embodiment Construction

[0018] The present invention will be further described below in conjunction with accompanying drawing:

[0019] Such as Figure 1~3 As shown, the vacuum potting device for high-power and high-density electronic products in this embodiment includes a potting rubber tank 1 and a product placement tank 4 installed on the lower side of the potting rubber tank 1 and used for placing electronic products 7 , the top opening of the potting rubber tank 1, the bottom of which is provided with a plurality of openings 11 corresponding to the potting holes 71 on the electronic product 7, and the openings 11 and the potting holes 71 are mutually sealed by the rubber elastic ring 6 fixed.

[0020] Such as figure 2 As shown, the potting compound tank 1 is a cuboid structure with an open top, and the two sides of the cuboid have a first connecting plate 12 extending horizontally outward along its bottom surface. The cross section of the product placement tank 4 is U-shaped, and the U-shaped...

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Abstract

The invention relates to a vacuum encapsulation device for high-power high-packaging-density electronic products, and an encapsulation method thereof. The encapsulation device comprises an encapsulation adhesive trough and a product accommodation groove which is provided at the lower side of the encapsulation adhesive trough and is used to place an electronic product. The top of the encapsulation adhesive trough is in an open state, and the bottom is provided with many openings corresponding to encapsulation holes in the electronic product. The openings and the encapsulation holes are mutually sealed and fixed via a rubber elastic ring. The invention is used for products with high power, high packaging density and great heat-dissipating demand. Encapsulation of electronic products via the encapsulation device and the vacuum device is convenient with dense encapsulation and good quality, thereby guaranteeing the product heat-dissipating effect and reducing product failure.

Description

technical field [0001] The invention relates to the technical field of potting and sealing of electronic products, in particular to a vacuum potting device and a potting method for electronic products with high power and high assembly density. Background technique [0002] At present, electronic products with high power and high assembly density need to be potted with high thermal conductivity potting glue because of their large heat dissipation. Since the viscosity of high thermal conductivity potting glue is higher than that of glue, in electronic products with high assembly density, Difficult potting and high void rate will eventually affect the heat dissipation effect of the product and even lead to product failure. For this kind of product, it is difficult to fill the product, and the yield is low, no matter whether it is filled with automatic equipment or manually. Contents of the invention [0003] The object of the present invention is to provide a vacuum potting ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K5/06H05K7/20
Inventor 刘涛周军朱敬东汤春江王多笑
Owner NO 43 INST OF CHINA ELECTRONICS TECH GRP CETC
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