Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

COB encapsulation method

A packaging method and technology for printed circuit boards, which are used in electrical components, circuits, semiconductor devices, etc., can solve problems such as product defects, short circuits, and affect product appearance, and achieve cutting speed improvement, cut damage reduction, carbonization and debris. Phenomenon improvement effect

Active Publication Date: 2016-07-06
SHENZHEN JUXIN IMAGE CO LTD
View PDF4 Cites 5 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] At present, laser cutting FPC has been widely used in the industry. The carbides formed after cutting not only affect the appearance of the product, but also in terms of performance, the surface elements of the carbides are easy to form a short circuit during the post-production process, resulting in defective products. The traditional method is organic. Solvent wiping or controlling laser cutting energy, but the effect and efficiency cannot meet

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • COB encapsulation method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0053] Below in conjunction with specific embodiment, further illustrate the present invention.

[0054] A COB packaging method is characterized in that comprising the following steps:

[0055] The first step: preparing a single-sided FPC board (1);

[0056] The second step: puncture the LED chip on the FPC printed circuit board with a thorn pen through the steps of crystal expansion, back glue and thorn;

[0057] Step 3: Put the thorny FPC printed circuit board into a thermal cycle oven to keep the temperature constant so that the silver paste on it is cured;

[0058] Step 4: Paste the chip, use black glue to paste the chip on the FPC board, and put it in a thermal cycle oven to cure;

[0059] Step 5: Bonding, bridge the chip with the corresponding pad on the FPC board;

[0060] Step 6: Pre-test, and rework the unqualified FPC board;

[0061] The seventh step: glue dispensing, use the glue dispenser to package the prepared glue.

[0062] Step 8: Curing, put the sealed FP...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Thicknessaaaaaaaaaa
Thicknessaaaaaaaaaa
Concentrationaaaaaaaaaa
Login to View More

Abstract

The invention relates to a COB encapsulation method. The COB encapsulation method is characterized by comprising the following steps: preparing a single-sided FPC board (1), wafer expansion, gum application, chip ejection, curing, die bonding, bonding, dispensing and curing. With the COB encapsulation method adopted, improvement on precision and weight of the COB during package and bonding is achieved.

Description

technical field [0001] The patent of the present invention relates to a COB packaging method. Background technique [0002] Electronic products are developing in the direction of high precision and high density. COB packaging has become the main integrated product in the industry. Due to the difficulty of packaging technology, mass production of COB high-precision bonding boards is rare in the industry; [0003] The key technology of COB packaging lies in wire bonding and sealing molding, which refers to the process of packaging the exposed body circuit chip to form electronic components; [0004] Crystal chip packaging completes the connection of the circuit in order to play the existing function. Generally, after binding, the chip is packaged with black colloid, and the measured wafer body is implanted into the special circuit, and then the wafer circuit is connected with a gold wire. In FPC, the gold wire and FPC need to have a good bonding force in this wire bonding pro...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L33/48H01L33/62
Inventor 阙民辉李帅兵张玉才
Owner SHENZHEN JUXIN IMAGE CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com