Adhesive, preparation method and application in integrated circuit board embedment thereof

A technology for adhesives and circuit boards, applied in the direction of adhesives, adhesive additives, printed circuits, etc., can solve the problems of reducing curing stress and modulus, low production efficiency, and large elongation at break, etc., to achieve stress reduction and production High efficiency and easy processing

Active Publication Date: 2011-06-08
东莞市腾威电子材料技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] In order to further protect the integrated circuit board and components, and increase its reliability and stability, a layer of protective adhesive layer is usually covered on its surface. However, the current integrated circuit board must be integrated when processing modules. Only when the circuit board and glue are completely cut off can the functional modules be separated, especially for low-temperature co-fired ceramics (LTCC). Such a processing process will not only waste a lot of time, but also cause greater wear and tear on the equipment and lower production efficiency.
The main reason why this kind of glue is difficult to separate is that the elongation at b

Method used

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  • Adhesive, preparation method and application in integrated circuit board embedment thereof
  • Adhesive, preparation method and application in integrated circuit board embedment thereof
  • Adhesive, preparation method and application in integrated circuit board embedment thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0053] An adhesive: including 100 parts of epoxy resin (including 60 parts of liquid bisphenol A epoxy resin and 40 parts of solid bisphenol A epoxy resin), 70 parts of methyl tetrahydrophthalic anhydride, stress absorber 30 parts (including phenylmethyl silicone oil and polytetrafluoroethylene powder), 150 parts of aluminum oxide, 1 part of accelerator (the accelerator is 2-ethyl-4 methylimidazole) and 1 part of additive (wherein, Including 0.2 parts of dispersants such as BYK-163, 0.2 parts of defoamers such as KS-66 and 0.6 parts of carbon black);

[0054] Adhesive preparation method:

[0055] First add the amount of epoxy resin in the mixing tank, heat to 120 ° C, stir until the epoxy resin is completely melted and form a uniform liquid; cool the melted epoxy resin in the mixing tank to room temperature, add the amount of Add additives, and stir evenly; add liquid stress absorber, solid stress absorber, stir evenly, then add curing agent, filler, and stir evenly to obtain...

Embodiment 2

[0070] A kind of adhesive: comprise 100 parts of epoxy resins (wherein, comprise 70 parts of liquid bisphenol A type epoxy resins and 30 parts of solid bisphenol A type epoxy resins), 20 parts of curing agent (wherein, curing agent is formazan tetrahydrophthalic anhydride), 120 parts of stress absorber (including 80 parts of benzyl silicone oil, 30 parts of polytetrafluoroethylene powder and 10 parts of polymethyl methacrylate powder), 200 parts of filler (including trioxide 40 parts of dialuminum, 160 parts of silicon dioxide), 2 parts of accelerator (the accelerator is 2,4,6-(N,N-dimethylaminomethyl)-phenol), 4 parts of additives (including dispersing agent such as BYK-163 1 part, defoamer such as KS-66 1 part and carbon black 2 parts)

[0071] The preparation method of adhesive: preparation method is the same as embodiment 1, and its difference is,

[0072] (1), the heating temperature in the stirring tank is 140°C;

[0073] (2), the mixing time in the planetary mixer is ...

Embodiment 3

[0079] An adhesive: including 100 parts of epoxy resin (including 80 parts of liquid bisphenol A type epoxy resin and 20 parts of liquid bisphenol F type epoxy resin), 50 parts of curing agent (including 80 parts of liquid bisphenol F type epoxy resin), 50 parts of curing agent (including 30 parts of hydrophthalic anhydride, 10 parts of methyl endomethylene tetrahydrophthalic anhydride and 10 parts of tetrahydrophthalic anhydride), 20 parts of stress absorber (including phenylmethyl silicone oil, dimethyl silicone oil and polytetrafluoroethylene ethylene powder), 175 parts of filler (silica as filler), 3 parts of accelerator (1-ethylimidazole as accelerator), 3 parts of additive (including 1 part of dispersant such as BYK-163, defoamer such as 1 part of KS-66 and 1 part of carbon black)

[0080] The preparation method of adhesive: preparation method is the same as embodiment 1, and its difference is,

[0081] (1), the heating temperature in the stirring tank is 90°C;

[0082...

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PUM

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Abstract

The invention belongs to the integrated circuit board assembling technology field, and especially relates to an adhesive, preparation method and application in integrated circuit board embedment thereof. The adhesive of the invention comprises, by weight, 100 parts of epoxy resin, 20 to 80 parts of curing agent, 20 to 120 parts of stress absorbent, 90 to 300 parts of filling material and 0.1 to 10 parts of promoter. In the preparation process, the adding sequence and activating time of the different raw materials are controlled to allow the adhesive to have very low curing shrinking stress, higher glass-transition temperature and lower modulus, thereby not only protecting the integrated circuit board well, but also enabling the integrated circuit board with application of the adhesive notto break or lift the adhesive due to reliability test, and improving the reliability and security of the integrated circuit board applied in the severe environment.

Description

technical field [0001] The invention relates to the technical field of integrated circuit board assembly, in particular to an adhesive, a preparation method thereof and an application in the assembly and potting of integrated circuit boards. technical background [0002] In order to further protect the integrated circuit board and components, and increase its reliability and stability, a layer of protective adhesive layer is usually covered on its surface. However, the current integrated circuit board must be integrated when processing modules. Only when the circuit board and glue are completely cut off can the functional modules be separated, especially for low-temperature co-fired ceramics (LTCC). Such a processing process will not only waste a lot of time, but also cause greater wear and tear on the equipment and lower production efficiency. The main reason why this glue is difficult to separate is that the elongation at break of the adhesive is too large in order to redu...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J163/02C09J163/04C09J183/04C09J127/18C09J123/06C09J133/12C09J11/04C09J11/06H05K3/00
Inventor 邬全生
Owner 东莞市腾威电子材料技术有限公司
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