40results about How to "Solve the problem of low thermal conductivity" patented technology

The present invention relates to a phase change material and a heat storage mortar prepared by using the phase change material. The phase change material comprises, by weight: one part of an organic layered material, 1-4 parts of a heat conduction enhancer, and 10-20 parts of an organic phase change material. The phase change material has excellent heat storage effect and flame retardant properties, and has good compatibility with a base material. The heat storage mortar prepared by using the phase change material includes, by weight: one part of cement, 1.5-2.5 parts of a fine aggregate, 0.1-0.25 parts of a lightweight aggregate, 0.1-0.3 parts of the composite shape-stabilized phase change material, 0.005-0.02 parts of a binder, 0.001-0.004 parts of a water-retaining agent, 0.001-0.0025 parts of fiber, and 0.75 to 0.9 parts of water. The mortar has a high rate of heat storage, can improve the building thermal comfort, and reduce building energy consumption.

The invention provides a 3D assembling method for integrally integrating chips of T/R assembly, and aims to provide a T/R assembly which has advantages of reliable performance, higher density, more functions, high signal transmission speed, better performance and relatively lower cost. The 3D assembling method is realized through a solution which comprises the steps of performing z-direction expansion on a planar circuit with printed circuit patterns to a green ceramic chip laminate of a three-dimensional circuit through interlayer vertical interconnection; vertically packaging an active device in a rectangular chamber (7) of the green ceramic chip laminate (5), placing a power supply modulator on the back surface of the bottom of the green ceramic chip laminate, and inputting an outer signal from a low-frequency interface at the back surface of the green ceramic chip laminate to a pad of the green ceramic chip laminate (5); performing radio frequency connection among chips through a metal wire bonding vertical interconnection structure among the green ceramic chip laminates, accurately aligning and laminating the green ceramic laminates in a Z direction, and then sintering at a temperature of 900 DEG C, thereby preparing a three-dimensional circuit low-temperature co-sintered ceramic LTCC substrate which is used for high-density circuits with no three-dimensional space interference and is internally provided with a passive element and can be equipped with bare chips or package chips on the surface.

The invention relates to a thermally-conductive and electrically-conductive adhesive and a preparation method and application thereof. The thermally-conductive and electrically-conductive adhesive comprises the following components in percentage by mass: 5-20% of epoxy resin, 75-90% of a low-melting point alloy filler, 1-10% of a curing agent, 0.1-3% of an accelerant and 0.1-10% of a diluent, and can further comprise a film-forming agent and a thixotropic agent. The preparation method comprises the following steps: mixing the components, and performing vacuum mixing on an obtained mixture for 3-5min to obtain a uniform pasty material, namely the thermally-conductive and electrically-conductive adhesive. The thermally-conductive and electrically-conductive adhesive provided by the invention can achieve good metallurgical interconnection after being cured at low temperature, so that the thermally-conductive and electrically-conductive adhesive not only has good welding capability, but also has good thermal conductivity and electrical conductivity.

The invention provides a power storage type solar panel heat collector provided with a metal rolling fin, relating to the solar energy technical field, in particular to the solar energy heat collector capable of storing energy technical field. The solar panel heat collector comprises a transparent material layer, a phase-change material layer, a heat absorbing plate, a heat insulating material layer, a serpentuator and heat conducting metal, wherein, the heat absorbing plate is arranged under the transparent material layer, the phase-change material layer is arranged under the heat absorbing plate, the heat insulating material layer is arranged on the periphery of the transparent material layer, the phase-change layer and the heat absorbing plate, the serpentuator and the metal rolling fin are respectively arranged inside the phase-change layer. The power storage type solar panel heat collector fulfills the purpose of good energy storing effect, high energy storing efficiency and effectively increasing the phase-change and energy-storing speed.

The invention provides thermal conductive graphite blocks for a blast-furnace bottom and a hearth, belonging to the technical field of carbon refractory. The raw materials of the graphite blocks comprise the following components in parts by weight: 11-15 parts of petroleum coke with grain size of more than 2mm and less than or equal to 4mm, 10-14 parts of petroleum coke with grain size of more than 1mm and less than or equal to 2mm, 53-60 parts of petroleum coke with grain seize of more than 0.075mm and less than or equal to 0.15mm, 34-40 parts of petroleum coke with grain seize of less than or equal to 0.075mm, and 22-25 parts of mesothermal asphalt. In the formula of the thermal conductive graphite blocks for the blast-furnace bottom and the hearth, high-quality needle cokes with higherintensity and easy graphitization are used, a small grain formula is adopted, and a high-pressure multi-soaking and multi-baking method is adopted, so that an impregnant can penetrate through the holes of the graphite blocks, thus reducing the porosity of the graphite blocks, improving the compactness, volume density and intensity of the products, improving the coefficient of heat conductivity and alkali-resistant corrodibility of the graphite blocks greatly, fundamentally solving the problem of low coefficient of heat conductivity of the graphite blocks, and meeting the requirement on quality of the graphite blocks with high thermal conductivity for large blast furnaces.

The embodiment of the invention relates to a shaped MOF-based composite phase change material and a preparation method and application thereof. The shaped MOF-based composite phase change material comprises an MOF-based carrier and an organic phase change core material loaded on the MOF-based carrier, and the MOF-based carrier comprises foam metal and MOF covering the surface of the foam metal. According to the obtained shaped MOF-based composite phase change material, the shape and the size of the foam metal are controlled, so that the obtained shaped MOF-based composite phase change materialhas the shape and the size of the foam metal; and the foam metal is used as one part of the shaped MOF-based composite phase change material, and the foam metal has higher heat conductivity, so thatthe heat conductivity of the composite phase change material can be enhanced.

A solar heat collector with a film hole structure comprises a heat preservation box with the upper end open, a phase-change material layer is arranged in the heat preservation box, a coiled pipe is arranged in the phase-change material layer, a conical metal foam layer is arranged at the top of the phase-change material layer, the outer wall of the conical metal foam layer is wrapped by a transparent outer layer which can transmit light, and metal foam is added into the phase-change material layer. The content of air in a heat collecting area is greatly increased due to the metal foam structure, an air layer is divided into parts with small volumes, and therefore heat loss caused by convection is prevented. Sunlight can illuminate the conical metal foam layer through the transparent outer layer, the conical metal foam layer has the function of a heat absorber and converts light energy into heat energy, and the transparent outer layer has the function of a heat insulating layer and prevents heat in the heat absorber from being dissipated to the outside. The solar heat collector can effectively absorb solar radiation and fast store the energy and can be widely used for drying, food processing, household heat supplying , cooking and the like.

The invention discloses a scratch-resistant black heat transfer printing ink and a preparation method thereof. The printing ink comprises the following components in percent by weight: 25-35 percent of epoxy resin, 5-8 percent of phenolic resin, 3.5-5.0 percent of a curing agent, 45-60 percent of a heat conducting filling material, 10-12 percent of a coloring agent and 0.5-0.7 percent of an additive. The printing ink has a rigidity larger than 6 H after being roasted and pressed to meet the scratch-resistant requirement of Al-based copper-clad plate production and manufacturing, has the thermal conductivity reaching 1.5 W to facilitate the radiating of an Al-based copper-clad plate compared with an anodic oxidation film and a PET protecting film, and has a maximum bearing temperature of 230 DEG C and maximum pressure of 100 kg/cm<2>, and therefore, a novel method for using the heat transfer printing ink is found, the radiating function of the Al-based copper-clad plate is not affected while the aluminium surface is prevented from scratching. The heat transfer printing ink is a new measure for protecting the aluminium surface of the Al-based copper-clad plate.

The invention discloses a carbon nanotube array-based liquid-absorbing core support column integral structure flat heat pipe, including upper and lower metal cover plates and upper and lower metal cover plate liquid-absorbing cores formed on the inner sides of the upper and lower metal cover plates respectively The support column is an integrated structure; the upper and lower metal cover plates are sealed to form an airtight cavity by edge sealing, and the airtight cavity after vacuuming is filled with working liquid; the upper and lower metal cover plate liquid-absorbing core support column The integrated structure includes thin-layer carbon nanotubes grown on the inner surface of the metal cover plate and several vertical carbon nanotubes that continue to grow in specific regions of the thin-layer carbon nanotubes, which respectively constitute the capillary core of the flat heat pipe and the support column of the flat heat pipe ; The upper and lower metal cover support columns are staggered to form an integrated structure of liquid-absorbing core support columns in the form of fork rows. The invention has the characteristics of high thermal conductivity, small size, light weight, etc., can not only ensure the heat transfer performance of the flat heat pipe, but also achieve the mechanical strength and safety of the heat pipe during operation.

The invention provides a high-performance water-based phase change coating and a preparation method thereof. The high-performance water-based phase change coating is prepared from, by weight, 20-30 parts of phase change microcapsule powder, 10-20 parts of water-based resin, 20-30 parts of deionized water, 2-4 parts of heat conduction filler, 0.5-1 part of dispersing agent, 0.1-0.5 part of levelingthickener, 0.06-0.3 part of defoaming agent and 2-5 parts of slow drying agent; the preparation method comprises the following steps: performing ultrasonic stirring on the dispersing agent and the deionized water, adding the defoaming agent to obtain a dispersion liquid, adding the water-based resin, the leveling thickener and the slow drying agent to the dispersion liquid, and defoaming the mixture to obtain the phase-change coating. According to the invention, the phase-change microcapsule powder content in the phase-change coating is high, the enthalpy value of the dried coating is high, the heat conductivity is high, and the problem of poor stability is solved.

The invention relates to the field of solar PV utilization, in particular to a heat conducting glue for the high-power LED encapsulation and a preparation method thereof. The method is characterized is in that a soluble glass Na2O/NSiO2 is adopted as a heat conducting base body, the mode number N is 3.5, and deionized water is utilized to prepare a soluble glass colloidal sol with concentration of 45 percent. The preparation method comprises the following steps: and using a magnetic stirring apparatus to stir the soluble glass colloidal sol to be uniform, and then conducting 40-50 min of ambient-temperature ultrasonic oscillation. The method has the benefits that the problem that the thermal conductivity of the heat conducting glue for encapsulation material is low is solved; the problems that the wafer is in failure and the thermal conductivity is greatly reduced because a traditional heat conducting glue has high probability of falling-off of the wafer, is easily separated and is easy to separate from heat conducting fillers, are eased. The method has the advantages of inexpensive raw materials, simple preparation technology, higher high-thermal conductivity of the heat conducting glue, complete satisfaction of high-power LED encapsulation heat radiating requirement, and better market outlook.

The invention discloses a solid medium energy storage system and method based on fluidized bed heating. The solid medium energy storage system based on fluidized bed heating comprises a heating lifting chamber, a high temperature storage tank, a heat exchange device and a low temperature storage tank which are sequentially connected. High-temperature resistant solid particles such as sand are usedas an energy storage and heat exchange medium of the system. The heating lifting chamber is selected and used as a fluidized bed heating lifting device; and a heating air distribution device is arranged at the bottom of the heating lifting chamber. The upper part of the low temperature storage tank is provided with a feeding device, and the lower part is provided with an overflow port. A returning device is arranged between the low temperature storage tank and the heating lifting chamber. A cold state solid heat storage medium is fed into the low temperature storage tank through the feeding device, is fed into the heating lifting chamber from the low temperature storage tank through the returning device, and is fluidized and heated to become a high temperature solid heat storage medium, and the high temperature solid heat storage medium is stored in the high temperature storage tank. When the high temperature solid heat storage medium is needed, the high temperature solid heat storagemedium is subjected to heat exchange for utilization through the heat exchange device. A low temperature solid heat storage medium obtained after heat exchange is stored in the low temperature storage tank. The solid medium energy storage system has the advantages of simple technical requirements, high comprehensive utilization rate of energy sources and the like.

The invention belongs to the technical field of electronic packaging and particularly relates to a high-thermal-conductivity and low-expansion conductive pattern board and a preparation method therefor. The preparation method comprises: by taking a high-thermal-conductivity and low-expansion composite material as a base material, preparing a high-thermal-conductivity insulation medium layer on single or both surfaces of the base material with a physical or chemical method of welding, gluing, chemical vapor deposition, magnetron sputtering or physical vapor deposition; and finally depositing a conductor circuit pattern layer on the insulation medium layer with a chemical vapor deposition technology, a magnetron sputtering technology, a physical vapor deposition technology or an etching method so as to obtain the lamellar high-thermal-conductivity and low-expansion conductive pattern board. The conductive pattern board has the properties of high breakdown strength, high dielectric constant and the like in addition to high thermal conductivity, low expansion coefficient, high strength and high size stability; and a conductor circuit pattern is directly formed on a substrate, so that a preparation process for the conductor circuit pattern layer is simplified.

The invention belongs to the technical field of fuel cells, in particular to a bipolar plate of a proton exchange membrane fuel cell with uniform thermal conductivity. The bipolar plate comprises a diffusion layer and a catalytic layer, wherein opposite surfaces of the diffusion layer and the catalytic layer are fixedly connected through phase change heat conduction insulating tubes that are distributed in a rectangular array between the diffusion layer and the catalytic layer, the central outer surfaces of the phase change heat conduction insulating tubes are fixedly sleeved with proton exchange membranes that are located between the diffusion layer and the catalytic layer, and reverse surfaces of the diffusion layer and the catalytic layer are fixedly mounted with positioning frames. Thebipolar plate of the proton exchange membrane fuel cell with uniform heat conduction, by fixedly connecting the opposite surfaces of the diffusion layer and the catalytic layer through the phase change heat conduction insulating tubes, achieves the effect of guiding and conducting the heat inside the diffusion layer and the catalytic layer and prevents the accumulation of heat in the diffusion layer and the catalytic layer from adversely affecting the battery, thereby solving the technical problem of low thermal conductivity of the existing fuel cell.

The invention discloses a preparation method of a high-thermal-conductivity and low-dielectric composite material. The preparation method comprises the following steps: providing a boron nitride nanosheet dispersion liquid and a polytetrafluoroethylene dispersion liquid; mixing the boron nitride nanosheet dispersion liquid and the polytetrafluoroethylene dispersion liquid to obtain a mixed dispersion liquid; drying the mixed dispersion liquid to obtain mixed slurry; carrying out hot rolling treatment on the mixed slurry to obtain a mixed film; and sintering the mixed film to obtain the high-thermal-conductivity and low-dielectric composite material, wherein the high-thermal-conductivity and low-dielectric composite material comprises polytetrafluoroethylene and boron nitride nanosheets distributed in the polytetrafluoroethylene, and the boron nitride nanosheets are in lap joint end to end to form a plurality of layers of continuous heat conduction channels. The invention further provides the high-thermal-conductivity and low-dielectric composite material prepared by the preparation method of the high-thermal-conductivity and low-dielectric composite material. The high-thermal-conductivity and low-dielectric composite material disclosed by the invention not only has relatively high thermal conductivity, but also has extremely low dielectric constant and dielectric loss and excellent machinability and mechanical properties.

The invention relates to a method for improving the wear resistance of a surface of an iron-based powder metallurgy product by electron beam remelting. The method comprises the following steps that firstly, iron-based alloy powder is pressed and sintered to prepare the iron-based powder metallurgy product; the sintered powder metallurgy product is fixed to a workbench, and a molding cavity is sealed and pumped to a high vacuum state; and high-energy electron beam scanning is performed on the surface of the product, so that the surface of the product is molten, and rapidly solidified. Accordingto the electron beam surface remelting iron-based powder metallurgy product prepared through the method, a martensite remelting layer structure with fine grains and uniform structures is formed aftercooled to the room temperature, and the hardness and the wear resistance of the product can be remarkably improved by the surface remelting layer.

The invention relates to an intermediate heat conduction aluminum substrate manufacturing method. The method includes the steps that a silane coupling agent is selected and used for performing surface treatment on filler A and filler B; a glue solution is prepared from resin, heat conduction filler, the filler A and the filler B, wherein in percentage by mass, the resin accounts for 60%, the heat conduction filler accounts for 40%, and the proportion between the filler A and the filler B is 1:5-1:20; 1080 glass cloth is used as a base body, the 1080 glass cloth is coated with the prepared glue solution, and drying is performed on the 1080 glass cloth to obtain a glue sheet; copper foil, the glue sheet and an aluminum plate are overlapped in sequence and formed through pressing of a press, and an intermediate heat conduction aluminum substrate is obtained. According to the intermediate heat conduction aluminum substrate manufacturing method, detection is performed according to the IPC-TM-650-2.4.13.1 standard, a plate material is immersed into tin at the temperature of 288 DEG C for 10-15 minutes, layering and bubbling are avoided, the problem of low heat-conducting property of the aluminum substrate is solved, market requirements are met, economic benefits are obvious, and the implementation effect is good.

The invention discloses an embedded vacuum scanning box titanium film cooling device, and relates to the technical field of electron irradiation accelerators. The device comprises a heat conduction shell, a cooling liquid inlet pipe, a cooling liquid outlet pipe, a cooling liquid pipeline, a first branch pipeline and a second branch pipeline, wherein a beam passing square hole is formed in the middle part of the heat conduction shell, two cooling liquid pipelines are arranged in the heat conduction shell and located on the two sides of the beam passing square hole, one ends of the two coolingliquid pipelines are connected through the first branch pipeline, the other ends of the two cooling liquid pipelines are connected through the second branch pipeline, the cooling liquid inlet pipe isarranged at one end of the heat conduction shell, the cooling liquid inlet pipe is connected with the first branch pipeline, the cooling liquid outlet pipe is arranged at the other end of the heat conduction shell and connected with the second branch pipeline, a plurality of installation holes are evenly formed in the two sides of the heat conduction shell, and a titanium film heat conduction contact face is arranged on the upper surface of the heat conduction shell. The device is high in heat conduction efficiency, small in size, low in cost and convenient to use.

The invention discloses an aerospace high-power lamp. The aerospace high-power lamp comprises a protective window, condensing lenses, an LED lamp panel, a thermal dissipating plate, a sealing strip, athermal buffer medium and a shell; a thermal buffer medium filling area is arranged in the shell and filled with the thermal buffer medium; a sealing strip mounting groove is formed between the thermal buffer medium filling area and the inner wall of the shell, and a sealing strip is mounted in the sealing strip mounting groove; the thermal dissipating plate is arranged above the filling area andis in close fit with the thermal buffer medium; the LED lamp panel is mounted on the upper part of the thermal dissipating plate, and the condensing lenses are mounted on all LED lamps in the LED lamp panel; and the protective window is mounted at the top of the shell. The thermal buffer medium is added on the aerospace high-power lamp, a close frame type structure is adopted, and thus it is ensured that the lamp meets the using requirements of high-power lighting under high and low temperature environments.