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Diamond/aluminum composite material and low-cost preparation method thereof

An aluminum composite material and a composite material technology are applied in the field of diamond/aluminum composite materials and their preparation, which can solve the problems of low thermal conductivity and high preparation cost, and achieve the effects of improving thermal conductivity, improving interface bonding strength and saving costs.

Active Publication Date: 2018-03-06
HARBIN INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The present invention proposes a diamond / aluminum composite material and its low-cost preparation method in order to solve the problems of harmful interfacial reactants, low thermal conductivity and high preparation cost of the diamond / aluminum composite material prepared in the prior art

Method used

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  • Diamond/aluminum composite material and low-cost preparation method thereof
  • Diamond/aluminum composite material and low-cost preparation method thereof
  • Diamond/aluminum composite material and low-cost preparation method thereof

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specific Embodiment approach 1

[0040] Embodiment 1: The diamond / aluminum composite material of this embodiment is composed of aluminum metal and diamond powder with a coating layer, and the aluminum metal is filled in the gap of the diamond powder with a coating layer;

[0041] The aluminum metal is pure aluminum or aluminum alloy;

[0042] The coating layer of the diamond powder with coating layer is one layer or more than two layers;

[0043] The material of the coating layer is Ti, Cr, W, Mo or Zr;

[0044] The volume fraction of diamond powder in the diamond / aluminum composite material is 61%-70%.

[0045] This embodiment has the following beneficial effects:

[0046] The density of the diamond / aluminum composite material of the method of this embodiment reaches more than 99.8%, which solves the problem of low density of the diamond / aluminum composite material prepared in the prior art; the surface of the single crystal diamond powder is coated to improve the diamond powder. The wettability with alum...

specific Embodiment approach 2

[0047] Embodiment 2: This embodiment is different from Embodiment 1 in that: the thickness of the coating layer is 30-500 nm. Other steps and parameters are the same as those in the first embodiment.

specific Embodiment approach 3

[0048] Embodiment 3: This embodiment is different from Embodiment 1 or Embodiment 2 in that: the particle size of the diamond powder is 10-300 μm. Other steps and parameters are the same as those in Embodiment 1 or 2.

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Abstract

The invention discloses a diamond / aluminum composite material and a low-cost preparation method thereof and aims to solve the problem that a diamond / aluminum composite material prepared by using the prior art has harmful interface reaction substances and is low in heat conductivity and high in preparation cost. The diamond / aluminum composite material consists of an aluminum metal and diamond powder with a filmed layer, wherein gaps of the diamond powder with the filmed layer are filled with the aluminum metal. The preparation method comprises the following steps: I, preparing a near-net forming; II, performing filming treatment on the surface of the diamond powder; III, performing air pressure infiltration preparation; IV, performing air pressure infiltration; and V, performing demolding.The density of the diamond / aluminum composite material disclosed by the invention is up to 99.8% or greater; by adopting the preparation method, an aluminum metal is saved, the interface binding strength of the diamond powder and the aluminum metal is increased, and the problem that a conventional diamond / aluminum composite material is low in heat conductivity; and the preparation method is applicable to preparation of diamond / aluminum composite materials.

Description

technical field [0001] The invention relates to a diamond / aluminum composite material and a preparation method thereof Background technique [0002] The rapid development of the electronics industry in recent years has made the power consumption of the circuit more and more large, which has seriously increased the reliability and life expectancy requirements of key electronic components such as chips. In the field of electronic communication, the power consumption of chips is increasing at an annual rate of more than 50%. Existing electronic packaging materials used for heat conduction, such as molybdenum copper, tungsten copper, and silicon carbide aluminum, have become increasingly difficult to meet the needs of the industry, and have even become a bottleneck restricting the development of the industry. The thermal conductivity of diamond / aluminum composite materials is more than twice that of molybdenum or copper, and has an appropriate thermal expansion coefficient, whi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C26/00C22C1/10
CPCC22C1/101C22C1/1036C22C26/00C22C1/1073
Inventor 武高辉丁伟张强苟华松陈国钦修子扬姜龙涛康鹏超杨文澍
Owner HARBIN INST OF TECH
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