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High-thermal-conductivity and low-dielectric composite material and preparation method thereof

A composite material and low-dielectric technology, which is applied in the preparation of low-dielectric composite materials, low-dielectric composite materials, and high thermal conductivity fields, can solve problems such as low thermal conductivity and poor processability

Pending Publication Date: 2022-01-28
SHENZHEN GRADUATE SCHOOL TSINGHUA UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] In view of this, it is necessary to provide a preparation method of high thermal conductivity and low dielectric composite materials to solve the problems of low thermal conductivity and poor processability of existing polymer materials suitable for 5G high-frequency communication

Method used

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  • High-thermal-conductivity and low-dielectric composite material and preparation method thereof
  • High-thermal-conductivity and low-dielectric composite material and preparation method thereof
  • High-thermal-conductivity and low-dielectric composite material and preparation method thereof

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preparation example Construction

[0033] The preparation method of the high thermal conductivity, low dielectric composite material comprises the following steps:

[0034] Step S1: providing boron nitride nanosheet dispersion and polytetrafluoroethylene dispersion;

[0035] Step S2: mixing the boron nitride nanosheet dispersion and polytetrafluoroethylene dispersion to obtain a mixed dispersion;

[0036] Step S3: drying the mixed dispersion to obtain a mixed slurry;

[0037] Step S4: performing hot rolling treatment on the mixed slurry to obtain a mixed film; and

[0038] Step S5: Sintering the mixed film to obtain a high thermal conductivity, low dielectric composite material, wherein the high thermal conductivity, low dielectric composite material includes polytetrafluoroethylene and polytetrafluoroethylene distributed in the polytetrafluoroethylene Boron nitride nanosheets, the boron nitride nanosheets are overlapped end to end to form several layers of continuous heat conduction paths (refer to figure ...

Embodiment 1

[0074] Provide a boron nitride nanosheet dispersion with a concentration of 2 mg / mL, wherein the boron nitride nanosheet dispersion contains deionized water and boron nitride nanosheets with a sheet diameter of 0.2-1.0 μm;

[0075] Provide a polytetrafluoroethylene dispersion with a solid content of 60% by weight;

[0076] Slowly drop 0.5mL polytetrafluoroethylene dispersion into 400mL boron nitride nanosheet dispersion, and magnetically stir for 30 minutes to obtain a mixed dispersion, wherein, in the mixed dispersion, the proportion of the boron nitride nanosheets is 10wt%;

[0077] The mixed dispersion was placed in an oven at 80° C. for 1 hour to obtain a mixed slurry with a water content of 35 wt %;

[0078] Kneading the mixed slurry, so that the boron nitride nanosheets and polytetrafluoroethylene nanoparticles in the mixed slurry are uniformly mixed;

[0079] The kneaded mixed slurry was subjected to hot rolling treatment to obtain a mixed film, wherein, during the ho...

Embodiment 2

[0082] Provide a boron nitride nanosheet dispersion with a concentration of 2 mg / mL, wherein the boron nitride nanosheet dispersion contains deionized water and boron nitride nanosheets with a sheet diameter of 0.2-1.0 μm;

[0083] Provide a polytetrafluoroethylene dispersion with a solid content of 60% by weight;

[0084] Slowly drop 1mL of the polytetrafluoroethylene dispersion into 400mL of the boron nitride nanosheet dispersion, and stir magnetically for 30 minutes to obtain a mixed dispersion, wherein, in the mixed dispersion, the proportion of the boron nitride nanosheets is 20wt%;

[0085] The mixed dispersion was placed in an oven at 80° C. for 1 hour to obtain a mixed slurry with a water content of 35 wt %;

[0086] Kneading the mixed slurry, so that the boron nitride nanosheets and polytetrafluoroethylene nanoparticles in the mixed slurry are uniformly mixed;

[0087] The kneaded mixed slurry was subjected to hot rolling treatment to obtain a mixed film, wherein, d...

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Abstract

The invention discloses a preparation method of a high-thermal-conductivity and low-dielectric composite material. The preparation method comprises the following steps: providing a boron nitride nanosheet dispersion liquid and a polytetrafluoroethylene dispersion liquid; mixing the boron nitride nanosheet dispersion liquid and the polytetrafluoroethylene dispersion liquid to obtain a mixed dispersion liquid; drying the mixed dispersion liquid to obtain mixed slurry; carrying out hot rolling treatment on the mixed slurry to obtain a mixed film; and sintering the mixed film to obtain the high-thermal-conductivity and low-dielectric composite material, wherein the high-thermal-conductivity and low-dielectric composite material comprises polytetrafluoroethylene and boron nitride nanosheets distributed in the polytetrafluoroethylene, and the boron nitride nanosheets are in lap joint end to end to form a plurality of layers of continuous heat conduction channels. The invention further provides the high-thermal-conductivity and low-dielectric composite material prepared by the preparation method of the high-thermal-conductivity and low-dielectric composite material. The high-thermal-conductivity and low-dielectric composite material disclosed by the invention not only has relatively high thermal conductivity, but also has extremely low dielectric constant and dielectric loss and excellent machinability and mechanical properties.

Description

technical field [0001] This application relates to the technical field of thermally conductive materials, in particular to a method for preparing a high thermally conductive, low dielectric composite material, and a high thermally conductive, low dielectric composite material prepared by the method for preparing a high thermally conductive, low dielectric composite material. Material. Background technique [0002] The China Copper Clad Laminate Industry Association pointed out that the dielectric constant of polymer materials used in the field of 5G high-frequency communication must be kept below 2.4, and the dielectric loss must be kept below 0.0006, otherwise the transmission loss will increase and the transmission speed will be reduced. [0003] As a polymer material suitable for 5G high-frequency communication, PTFE has extremely low dielectric constant and dielectric loss, and is widely used in high-frequency copper clad laminates and smartphone motherboards. However, ...

Claims

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Application Information

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IPC IPC(8): C08J5/18C08L27/18C08K7/00C08K3/38C09K5/14
CPCC08J5/18C09K5/14C08J2327/18C08K2201/011C08K7/00C08K2003/385
Inventor 丘陵许兰淑成会明
Owner SHENZHEN GRADUATE SCHOOL TSINGHUA UNIV
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