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Embedded vacuum scanning box titanium film cooling device

A cooling device and scanning box technology, applied in cooling/ventilation/heating transformation, electrical components, accelerators, etc., can solve the problems of increasing power consumption of cooling equipment, large fan air volume, and large heat loss of cooling liquid, etc., to increase energy Utilization, solve the effect of low thermal conductivity, reduce the power consumption of the whole machine

Pending Publication Date: 2021-02-23
SHANGHAI SINOTEX HIGH ENERGY TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] 1. The air-cooled method mainly relies on the high-speed airflow brought by the large-displacement fan to form thermal convection with the titanium film and take away the heat on the surface of the titanium film. However, the air volume of the fan is large. At this time, the fan noise is large and the volume Large, while causing the problem of excessive noise, it also puts forward strict requirements on the installation site of the external fan; the high-speed airflow will have an unstable impact on the placement of light-weight irradiated goods, and at the same time affect the shape of the air duct. There are also special requirements, complex manufacturing and large investment
[0006] 2. Water-cooling method: For the water-cooling heat dissipation method of the scanning box titanium film, it is necessary to set a cooling water circulation structure on the scanning box body and the titanium film mounting flange. At this time, the scanning box manufacturing structure is complicated, and it is necessary to realize the titanium film surface The high temperature is dissipated through radiation heat dissipation and heat conduction. At this time, a very low cooling temperature is required. At the same time, the outside of the scanning box and its mounting flange are in the atmospheric environment, and the heat loss of the cooling liquid is large, which further increases the power consumption of the cooling equipment; the cooling water circuit Blockage or breakage can result in replacement of the entire scan box or mounting flange, which breaks the vacuum and increases maintenance time and cost

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  • Embedded vacuum scanning box titanium film cooling device
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  • Embedded vacuum scanning box titanium film cooling device

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Embodiment Construction

[0025] The technical solutions of the present invention will be clearly and completely described below in conjunction with the accompanying drawings. Apparently, the described embodiments are some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0026] In the description of the present invention, it should be noted that if the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" appear ", etc., the indicated orientation or positional relationship is based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specif...

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Abstract

The invention discloses an embedded vacuum scanning box titanium film cooling device, and relates to the technical field of electron irradiation accelerators. The device comprises a heat conduction shell, a cooling liquid inlet pipe, a cooling liquid outlet pipe, a cooling liquid pipeline, a first branch pipeline and a second branch pipeline, wherein a beam passing square hole is formed in the middle part of the heat conduction shell, two cooling liquid pipelines are arranged in the heat conduction shell and located on the two sides of the beam passing square hole, one ends of the two coolingliquid pipelines are connected through the first branch pipeline, the other ends of the two cooling liquid pipelines are connected through the second branch pipeline, the cooling liquid inlet pipe isarranged at one end of the heat conduction shell, the cooling liquid inlet pipe is connected with the first branch pipeline, the cooling liquid outlet pipe is arranged at the other end of the heat conduction shell and connected with the second branch pipeline, a plurality of installation holes are evenly formed in the two sides of the heat conduction shell, and a titanium film heat conduction contact face is arranged on the upper surface of the heat conduction shell. The device is high in heat conduction efficiency, small in size, low in cost and convenient to use.

Description

technical field [0001] The invention relates to the technical field of electron irradiation accelerators, in particular to a titanium film cooling device for an embedded vacuum scanning box. Background technique [0002] Electron accelerator scanning box is a key component of the beam output of the accelerator system. The interior of the scanning box is a vacuum environment, and the beam output window is sealed with a thin titanium film. The working stability of the titanium film is the key to the normal operation of the entire accelerator device. However, high-energy beams are emitted through the titanium film during work. At this time, the surface temperature of the titanium film is very high, but the titanium film is very thin (0.02-0.05mm), and its thermal conductivity is extremely low, so that the titanium film cannot conduct heat. At the same time, the interior of the scanning box is a vacuum environment, and high-energy heat cannot be conducted out by convection. If t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05H7/00H05K7/20
CPCH05H7/00H05K7/20218H05K7/20272
Inventor 张海龙谭松清高宁黄敬松单云王复涛封淼伟赵平叶斌王凤涛徐粒峰
Owner SHANGHAI SINOTEX HIGH ENERGY TECH
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