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Intermediate heat conduction aluminum substrate manufacturing method

A production method and technology for aluminum substrates, which are applied in the manufacture of printed circuits, electrical components, printed circuits, etc., can solve the problems that medium thermally conductive aluminum substrates cannot meet market requirements, delamination, blistering, etc., and achieve significant economic benefits and implementation effects. Good, the effect of meeting the market demand

Inactive Publication Date: 2014-02-26
TONGLING HAORONG ELECTRONICS TECH
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Problems solved by technology

According to the IPC-TM-650-2.4.13.1 standard detection, the existing aluminum substrate boards will appear delamination and blistering in about 2~3 minutes in the 288 °C immersion tin, and the existing medium thermal conductivity aluminum substrates cannot meet the requirements. market requirements

Method used

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Embodiment Construction

[0016] The content of the present invention will be described below in conjunction with specific embodiments.

[0017] In the invention, the epoxy resin with good adhesion is used to replace the original tetrabromobisphenol A resin, and thermal conductive filler is added to solve the thermal conductivity of the aluminum substrate.

[0018] The manufacturing method of the medium thermally conductive aluminum substrate of the present invention comprises the following steps:

[0019] Step 1. Surface treatment

[0020] Use silane coupling agent to carry out surface treatment on thermal conductive filler A and filler B, choose 5-50μm spherical alumina powder for filler A, choose 10-50μm ordinary type alumina powder for filler B;

[0021] Step 2. Glue preparation

[0022] According to the mass percentage, the resin accounts for 60%, the thermally conductive filler is 40%, and the ratio between filler A and B is 1:5~1:20. At the same time, add phenolic curing agent and tertiary ami...

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Abstract

The invention relates to an intermediate heat conduction aluminum substrate manufacturing method. The method includes the steps that a silane coupling agent is selected and used for performing surface treatment on filler A and filler B; a glue solution is prepared from resin, heat conduction filler, the filler A and the filler B, wherein in percentage by mass, the resin accounts for 60%, the heat conduction filler accounts for 40%, and the proportion between the filler A and the filler B is 1:5-1:20; 1080 glass cloth is used as a base body, the 1080 glass cloth is coated with the prepared glue solution, and drying is performed on the 1080 glass cloth to obtain a glue sheet; copper foil, the glue sheet and an aluminum plate are overlapped in sequence and formed through pressing of a press, and an intermediate heat conduction aluminum substrate is obtained. According to the intermediate heat conduction aluminum substrate manufacturing method, detection is performed according to the IPC-TM-650-2.4.13.1 standard, a plate material is immersed into tin at the temperature of 288 DEG C for 10-15 minutes, layering and bubbling are avoided, the problem of low heat-conducting property of the aluminum substrate is solved, market requirements are met, economic benefits are obvious, and the implementation effect is good.

Description

technical field [0001] The invention relates to a method for manufacturing a medium heat-conducting aluminum substrate, which belongs to the technical field of printed circuit boards. Background technique [0002] At present, in the field of printed circuit board technology, the insulating layer of the aluminum substrate is mainly made of ordinary tetrabromobisphenol A resin, and the thermal conductivity of the pressed aluminum substrate is not good. Now that the LED products on the market have increased significantly, the requirements for the thermal conductivity of aluminum substrates are getting higher and higher. According to the IPC-TM-650-2.4.13.1 standard detection, the existing aluminum substrate plate will appear delamination and foaming phenomenon in about 2~3 minutes in the immersion tin at 288 ℃, and the existing medium thermal conductivity aluminum substrate cannot meet the requirements. Market requirements. Contents of the invention [0003] The present inv...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00
Inventor 钱笑雄凌云王永东
Owner TONGLING HAORONG ELECTRONICS TECH
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