Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Heat conducting glue for high-power LED encapsulation and preparation method thereof

A technology of LED packaging and heat-conducting adhesive, which is applied in the field of solar photovoltaic utilization, can solve the problems of low thermal conductivity of heat-conducting adhesive, etc., and achieve the effect of solving low thermal conductivity, cheap raw materials, and reducing thermal resistance

Inactive Publication Date: 2013-04-17
郝勇
View PDF2 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Compared with the prior art, a method for preparing a thermally conductive adhesive for high-power LED packaging of the present invention has the following beneficial effects: the present invention aims to solve the problem of low thermal conductivity of the thermally conductive adhesive for packaging materials

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0012] A kind of preparation method of thermally conductive adhesive for high-power LED encapsulation of the present invention is to adopt water glass Na 2 o · NSiO 2 It is a thermally conductive matrix with a modulus N of 3.5. Use deionized water to prepare a water glass sol with a concentration of 45%. The preparation method is to stir it with a magnetic stirrer at 70-80°C until it is evenly mixed, and then ultrasonically shake at room temperature for 30- 40min.

[0013] 1, the present invention adopts Na 2 o · NSiO 2 (water glass) is a thermally conductive matrix with a modulus N of 3.5. Use deionized water to prepare a water glass sol with a concentration of 45%. The preparation method is to stir it with a magnetic stirrer at 70-80°C until it is evenly mixed, and then leave it at room temperature. Ultrasonic vibration for 30-40min

Embodiment 2

[0015] A preparation method of thermally conductive adhesive for high-power LED packaging is to combine nano-scale boron nitride BN with nano-scale silicon nitride Si 3 N 4 Mixed at a molar ratio of 8:2 as a thermally conductive mixed filler, mixed at a molar ratio of thermally conductive mixed filler to water glass sol of 45:100, stirred with a magnetic stirrer at 70-80°C until uniformly mixed, and then ultrasonicated at room temperature Shake for 30-40min.

[0016] 2. The present invention is characterized by combining nanoscale BN (boron nitride) with nanoscale Si 3 N 4 (Silicon nitride) mixed at a molar ratio of 8:2 as a thermally conductive mixed filler, mixed at a molar ratio of thermally conductive mixed filler to water glass sol of 45:100, stirred with a magnetic stirrer at 70-80°C until uniform Mix and then ultrasonically shake at room temperature for 30-40min.

[0017]

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
modulusaaaaaaaaaa
Login to View More

Abstract

The invention relates to the field of solar PV utilization, in particular to a heat conducting glue for the high-power LED encapsulation and a preparation method thereof. The method is characterized is in that a soluble glass Na2O / NSiO2 is adopted as a heat conducting base body, the mode number N is 3.5, and deionized water is utilized to prepare a soluble glass colloidal sol with concentration of 45 percent. The preparation method comprises the following steps: and using a magnetic stirring apparatus to stir the soluble glass colloidal sol to be uniform, and then conducting 40-50 min of ambient-temperature ultrasonic oscillation. The method has the benefits that the problem that the thermal conductivity of the heat conducting glue for encapsulation material is low is solved; the problems that the wafer is in failure and the thermal conductivity is greatly reduced because a traditional heat conducting glue has high probability of falling-off of the wafer, is easily separated and is easy to separate from heat conducting fillers, are eased. The method has the advantages of inexpensive raw materials, simple preparation technology, higher high-thermal conductivity of the heat conducting glue, complete satisfaction of high-power LED encapsulation heat radiating requirement, and better market outlook.

Description

technical field [0001] The invention relates to the field of solar photovoltaic utilization, in particular to a preparation method of a heat-conducting adhesive for high-power LED packaging. Background technique [0002] With the popularization of various LED lamps, the heat dissipation problem of LED has been paid more and more attention by people, because the light decay and life of LED are related to the junction temperature of LED. If the heat dissipation is not good, the junction temperature will be high and the life will be short. It decreases exponentially with the increase of LED chip junction temperature. The lower the operating temperature of the LED, the better. In order to ensure the life of the device, the junction temperature is generally required to be below 110°C. However, in practical applications, LEDs are generally required to have high power and high packaging density to obtain high brightness. When the LEDs are required to operate at full load to obtai...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C09J1/02C09J11/04H01L33/56
Inventor 郝勇张聪林郝婷婷
Owner 郝勇
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com