46 results about "AlSiC" patented technology

The invention discloses a method for preparing an aluminum silicon carbide composite material. Liquid metal aluminum is filled in a porous silicon carbide substrate which is prepared from spherical silicon carbide powder and spherical silicon powder which serve as raw materials and has a three-dimensional through hole structure through an injection molding process so as to form a bicontinuous phase, the density of the aluminum silicon carbide composite material and the product uniformity are improved, and a high-strength AlSiC substrate is obtained by changing molding pressure, adjusting ingredients of the spherical powder with different particle sizes, adding a pore-forming agent, and sintering at the temperature of between 1,400 and 2,400 DEG C. The porous substrate is fixed in a cavityof an injection machine, and the liquid metal aluminum enters the cavity from an injection port and is filled in through holes of the AlSiC substrate through a gas-liquid mixed injection process so as to form the aluminum silicon carbide composite material with a silicon carbide and metal aluminum bicontinuous phase structure. The aluminum silicon carbide composite material prepared by the process has the heat conductivity of 190 to 280 W / mK and the thermal expansion coefficient of 5.5 to 11.5*10(-6)K at room temperature of 200 DEG C, and has high rigidity, low density, high weldability and low machining amount.

A feed-through, in particular a feed-through which passes through part of a housing, in particular a battery housing, for example made of metal, in particular light metal, for example aluminum, an aluminum alloy, AlSiC, magnesium, an magnesium alloy, titanium, a titanium alloy, steel, stainless steel or high-grade steel. The housing part has at least one opening through which at least one conductor, in particular an essentially pin-shaped conductor, embedded in a glass or glass ceramic material, is guided. The base body is, for example, an essentially annular-shaped base body.

A feed-through component for a conductor feed-through which passes through a part of a housing, for example a battery housing, is embedded in a glass or glass ceramic material and has at least one conductor, for example an essentially pin-shaped conductor, and a head part. The surface, in particular the cross-sectional surface, of the head part is greater than the surface, in particular the cross-sectional surface, of the conductor, for example of the essentially pin-shaped conductor. The head part is embodied such that is can be joined to an electrode-connecting component, for example an electrode-connecting part, which may be made of copper, a copper alloy CuSiC, an aluminum alloy AlSiC or aluminum, with a mechanically stable and non-detachable connection.

A feedthrough, for example through a part of a housing, such as a battery housing, is, for example, made of a metal, such as a light alloy, for example aluminum, an aluminum alloy, AlSiC, magnesium, a magnesium alloy, titanium, a titanium alloy, steel, stainless steel or high-grade steel. The housing part has at least one opening through which at least one conductor having a cross-section is guided in a glass or glass ceramic material. The conductor has at least two sections, a first section having a first, substantially round, for example a circular, cross section having a diameter in the region of the feedthrough through the glass or glass ceramic material, and a second section having a second, substantially non-round, for example a substantially rectangular cross-section, and the conductor is formed in one piece.

Metal-matrix composites with combinations of physical and mechanical properties desirable for specific applications can be obtained by varying and controlling selected parameters in the material formation processes, particularly by increasing the microstructural homogeneity of the composite, while maintaining a constant mixture ratio or volume fraction. In one embodiment of the invention, a CuSiC composite having increased thermal conductivity is obtained by closely controlling the size of the SiC particles. In another embodiment of the invention, AlSiC composites which exhibit increased ultimate tensile and yield strengths are made by closely controlling the size of SiC and Al particles.

A feedthrough, for example through a part of a housing, such as a battery housing, is, for example, made of a metal, such as a light alloy, for example aluminum, an aluminum alloy, AlSiC, magnesium, a magnesium alloy, titanium, a titanium alloy, steel, stainless steel or high-grade steel. The housing part has at least one opening through which at least one conductor having a cross-section is guided in a glass or glass ceramic material. The conductor has at least two sections, a first section having a first, substantially round, for example a circular, cross section having a diameter in the region of the feedthrough through the glass or glass ceramic material, and a second section having a second, substantially non-round, for example a substantially rectangular cross-section, and the conductor is formed in one piece.

The invention relates to an electrical device, in particular an electrical storage device or sensor housing, preferably a battery, in particular a micro-battery or capacitor, having a feedthrough through a housing part which has the material thickness T of the housing of the device and is made of a metal, in particular iron, iron alloys, iron-nickel alloys, iron-nickel-cobalt alloys, KOVAR, steel, stainless steel, aluminum, aluminum alloys, AlSiC, magnesium, magnesium alloys, titanium or titanium alloys, wherein the housing part has at least one opening, the opening receiving a contact element, in particular a conductor, made of a conductive material in a glass or glass ceramic material. The invention is characterized in that the housing part has a flange in the region of the opening and thus forms an inner wall of the through-opening of the height H, EL which is greater than the material thickness T, the glass length EL of the glass or glass ceramic material preferably corresponding to the height H.

The invention relates to a power electronic device IGBT (Insulated Gate Bipolar Translator) module with a heat dissipation structure and a preparation method, and belongs to the technical field of power electronic manufacturing and sealing testing. The power electronic device IGBT module with the heat dissipation structure comprises a bonding wire, an IGBT chip, an FRD chip, a solder layer, a DBC substrate, a heat conduction grease layer, the heat dissipation structure and a micropump. The heat dissipation structure comprises a micro-channel copper substrate, wherein AlSiC dielectric layers are machined on the two faces of the micro-channel copper substrate. The AlSiC dielectric layers are processed to the two sides of the micro-channel copper substrate through a laser shock peening manufacturing process, so that the heat dissipation structure has a low thermal expansion coefficient, a high-strength heat conduction coefficient and low cost, heat generated by a module can be efficiently dissipated, and rapid cooling is achieved. The problems that an existing IGBT module heat dissipation system is large in weight, high in manufacturing cost and poor in heat dissipation performance are solved, the problem that heat dissipation of a radiator is unbalanced can be effectively solved, and therefore the reliability of a device is improved, and the service life of the device is prolonged.

The invention discloses an anti-corrosion graphite fiber AlSiC composite for electronic packaging. The composite is prepared from raw materials in parts by weight as follows: 11-13 parts of graphite fibers, 75-78 parts of SiC, 95-100 parts of a 6061 aluminium alloy, 0.4-0.6 parts of aluminum oxide, 4-4.3 parts of phosphoric acid, 13-14 parts of a pore-forming agent, 2-2.5 parts of PVP, a proper amount of dichloromethane, a proper amount of DMF, 1.3-1.5 parts of nano lanthanum borate, 1.5-1.8 parts of flaky carbon powder, 1.1-1.4 parts of nano aluminum hydroxide, 1.6-1.8 parts of germanium diboride and 43-45 parts of ethyl alcohol. The graphite fibers are added, a linear heat dissipation path is formed, and the heat dissipation performance is better than that of separate point contact of SiC; the germanium diboride is used, and the molten metal etching resistance, the active gas corrosion resistance, abrasion resistance and the oxidation resistance of the composite are improved; and the flaky carbon powder and the nano aluminum hydroxide are used cooperatively, and the heat dissipation performance and the strength of the composite are improved.

The invention discloses a copper-covered ALSiC composite radiating substrate which comprises an ALSiC substrate body and a copper layer attached to the ALSiC substrate body. A copper-aluminum spinel interface is formed between the copper layer and the ALSiC substrate body. The ALSiC composite radiation substrate is simple in structure, good in radiating performance, capable of solving the problem that the radiating substrate body is not matched with thermal expansion of a chip material, capable of preventing an LED chip packaged on the substrate body from being easily disengaged, capable of prolonging the service life of an LED and applicable to manufacturing of low-cost large-power LEDs.

The invention relates to a weight-optimized stiffener and seal structure for a direct liquid cooling module. A weight-optimized stiffener for a semiconductor device is disclosed. In one example, the reinforcement is made of AlSiC due to the weight and thermal characteristics of AlSiC. The O-shaped ring provides a seal between the top surface of the stiffener and a component of the semiconductor device, and the adhesive provides a seal between the bottom surface of the stiffener and another component of the semiconductor device. The stiffener provides warpage control for the lidless package while achieving direct liquid cooling of the chip or substrate.

A weight optimized stiffener for use in a semiconductor device is disclosed herein. In one example, the stiffener is made of AlSiC for its weight and thermal properties. An O-ring provides sealing between a top surface of the stiffener and a component of the semiconductor device and adhesive provides sealing between a bottom surface of the stiffener and another component of the semiconductor device. The stiffener provides warpage control for a lidless package while enabling direct liquid cooling of a chip or substrate.

The invention discloses a preparation method of an AlSiC flaky powder. The method comprises the following steps: 1) mixing weighed raw materials so as to obtain a mixture, wherein the raw materials comprise the following components by weight percent: 45-60% of Al2O3 raw material, 10%-20% of SiO2 raw material, 25-40% of carbon raw material and 14% of SiC raw material; and 2) heating the mixture for 2-5 hours at the temperature of 1900-2200 DEG C at the mixed atmosphere of CO and Ar, cooling, and then removing the impurity layer on the surface of the product so as to obtain the AlSiC flaky powder, wherein the total pressure of the mixed atmosphere is 1 atmosphere pressure. The method in invention is simple and practicable and is suitable for scale production, and the yield and purity of theobtained product are high; and the length and width sizes of the obtained AlSiC flaky powder are 50-200 mu m, and the thickness of the AlSiC flaky powder is 4-5 mu m. The flaky structure of AlSiC is beneficial to enhancement of a ceramic product structure and improvement of product strength, thermal shock resistance and chemical corrosion resistance.

The invention discloses an LED packaged with an AlSiC composite substrate. The LED comprises the AlSiC composite cooling substrate, an LED light source module, gold threads and an alumina ceramic frame, wherein the surface of the AlSiC composite cooling substrate is plated with a copper film and a silver film sequentially; the LED light source module is packaged on the AlSiC composite cooling substrate; the alumina ceramic frame is arranged on the outer side of the LED light source module and adheres to the LED light source module; two copper-film electrodes are plated on the alumina ceramic frame and connected with a positive pole and a negative pole of the LED light source module through the gold threads respectively. According to the LED, thermal expansion coefficients of the AlSiC composite substrate and an LED chip material are matched, so that an LED chip which is packaged on the substrate is not prone to falling, and the service life of the LED is prolonged.

A feed-through, in particular a feed-through which passes through part of a housing, in particular a battery housing, for example made of metal, in particular light metal, for example aluminum, an aluminum alloy, AlSiC, magnesium, an magnesium alloy, titanium, a titanium alloy, steel, stainless steel or high-grade steel. The housing part has at least one opening through which at least one conductor, in particular an essentially pin-shaped conductor, embedded in a glass or glass ceramic material, is guided. The base body is, for example, an essentially annular-shaped base body and is hermetically sealed with the housing part such that the helium leakage rate is smaller than 1*10−8 mbar l / sec.