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Weight-optimized stiffener and sealing structure for direct liquid cooling module

A reinforcement and weight technology, applied in the direction of cooling/ventilation/heating transformation, electrical components, semiconductor devices, etc.

Pending Publication Date: 2021-01-05
GOOGLE LLC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Exploration of specialized silicon beyond industry-standard chip packaging could lead to high-power heat sources in servers

Method used

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  • Weight-optimized stiffener and sealing structure for direct liquid cooling module
  • Weight-optimized stiffener and sealing structure for direct liquid cooling module
  • Weight-optimized stiffener and sealing structure for direct liquid cooling module

Examples

Experimental program
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Effect test

Embodiment Construction

[0023] figure 1 is a perspective view of a packaged subassembly 100 of a semiconductor device including a substrate 1200 bonded to a stiffener 140 with fasteners or threaded hardware 18 mounted to the stiffener.

[0024] The stiffener 140 has a top surface, a bottom surface, and a hole passing through the top surface and the bottom surface. The holes may be generally centered relative to the outer perimeter of the stiffener 140, although in other examples the location of the holes may be adjusted. For example, the size, shape, and location of the holes may be tailored based on the circuitry that the underlying substrate 120 is to expose through the holes.

[0025] Substrate 120 may be coupled to the bottom surface of the reinforcement, such as by adhesive or other bonding technique. A portion of the reinforcement 140 may cover a portion of the substrate 120 when the substrate is coupled to the bottom surface of the reinforcement. For example, the substrate may include circu...

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PUM

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Abstract

The invention relates to a weight-optimized stiffener and seal structure for a direct liquid cooling module. A weight-optimized stiffener for a semiconductor device is disclosed. In one example, the reinforcement is made of AlSiC due to the weight and thermal characteristics of AlSiC. The O-shaped ring provides a seal between the top surface of the stiffener and a component of the semiconductor device, and the adhesive provides a seal between the bottom surface of the stiffener and another component of the semiconductor device. The stiffener provides warpage control for the lidless package while achieving direct liquid cooling of the chip or substrate.

Description

technical field [0001] The present disclosure relates to weight optimized stiffener and sealing structures for direct liquid cooling modules. Background technique [0002] Complementary metal-oxide-semiconductor ("CMOS") circuits are found in several types of electronic components, including microprocessors, batteries, and digital camera image sensors. The main features of CMOS technology are low static power consumption and high noise immunity. [0003] Beyond industry-standard chip packaging, the search for specialized silicon could lead to high-power heat sources in servers. This technology can also be applied to graphics processing units ("GPUs") and custom application specific integrated circuits ("ASICs"). In addition, services such as imaging and artificial intelligence ("AI") will likely require massive computing resources at high densities, with many servers in close proximity to each other. Data centers around the world are being asked to simultaneously improve ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/32H01L23/40H01L23/473
CPCH01L23/473H01L23/32H01L23/4006H01L2023/4087H01L2023/405H01L23/16H05K7/20H01L23/36H01L23/367H01L23/44H01L23/04H01L23/562H01L25/04
Inventor 马德胡苏丹·K·延加尔康纳·伯吉斯帕丹姆·贾殷伊马德·萨马迪亚尼李元
Owner GOOGLE LLC
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