Weight-optimized stiffener and sealing structure for direct liquid cooling module

A reinforcement and weight technology, applied in the direction of cooling/ventilation/heating transformation, electrical components, semiconductor devices, etc.
CN112185906APending Publication Date: 2021-01-05GOOGLE LLC
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
GOOGLE LLC
Publication Date
2021-01-05

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Abstract

The invention relates to a weight-optimized stiffener and seal structure for a direct liquid cooling module. A weight-optimized stiffener for a semiconductor device is disclosed. In one example, the reinforcement is made of AlSiC due to the weight and thermal characteristics of AlSiC. The O-shaped ring provides a seal between the top surface of the stiffener and a component of the semiconductor device, and the adhesive provides a seal between the bottom surface of the stiffener and another component of the semiconductor device. The stiffener provides warpage control for the lidless package while achieving direct liquid cooling of the chip or substrate.
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Description

technical field

[0001] The present disclosure relates to weight optimized stiffener and sealing structures for direct liquid cooling modules. Background technique

[0002] Complementary metal-oxide-semiconductor ("CMOS") circuits are found in several types of electronic components, including microprocessors, batteries, and digital camera image sensors. The main features of CMOS technology are low static power consumption and high noise immunity.

[0003] Beyond industry-standard chip packaging, the search for specialized silicon could lead to high-power heat sources in servers. This technology can also be applied to graphics processing units ("GPUs") and custom application specific integrated circuits ("ASICs"). In addition, services such as imaging and artificial intelligence ("AI") will likely require massive computing resources at high densities, with many servers in close proximity to each other. Data centers around the world are being asked to simultaneously improve ...

Claims

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