A kind of copper-clad alsic composite heat dissipation substrate and preparation method thereof

A technology of heat dissipation substrates and substrates, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of poor wettability of metals and ceramics, low reaction ability of metals and ceramics, and high requirements for molding dimensional accuracy, achieving good application prospects , expand practicability, and solve the effect of thermal expansion mismatch

Active Publication Date: 2016-06-08
惠州雷士光电科技有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Among them, the thermal conductivity of the metal core printed circuit board is limited by the insulating layer, the thermal conductivity is low, and on-board packaging cannot be realized; the copper-clad ceramic board adopts a direct bonding method to bond ceramics and metals together, which improves the thermal conductivity. At the same time, the thermal expansion coefficient is controlled in an appropriate range, but the reaction ability of metal and ceramics is low, and the wettability is not good, which makes the bonding difficult, the interface bonding strength is low, and it is easy to fall off; High dimensional accuracy is required, the process is complex, and there are also problems of poor wettability and easy fall off of metal and ceramics

Method used

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  • A kind of copper-clad alsic composite heat dissipation substrate and preparation method thereof
  • A kind of copper-clad alsic composite heat dissipation substrate and preparation method thereof

Examples

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Effect test

Embodiment 1

[0028] Such as figure 1 As mentioned above, the copper-clad AlSiC composite heat dissipation substrate of this embodiment includes an AlSiC substrate 1 and a copper layer 2 attached on the AlSiC substrate 1 . A copper-aluminum spinel eutectic interface is formed between the copper layer and the AlSiC substrate.

[0029] Among them, the AlSiC substrate is an Al-based composite material with SiC as a reinforcing phase. The thickness of the AlSiC substrate is 1 mm, and the thickness of the copper layer is 0.3 mm.

[0030] The preparation method of the copper-clad AlSiC composite heat dissipation substrate of this embodiment includes steps (1) to (4) as described below.

[0031] In step (1), polish one side of the unpolished AlSiC substrate to a mirror surface, then clean the soaked AlSiC substrate with absolute ethanol through an ultrasonic cleaner for 10 to 15 minutes, and dry it to remove the adhering Grease and other sundries.

[0032] In step (2), the polished side of the...

Embodiment 2

[0036] Such as figure 2 As shown, the copper-clad AlSiC composite heat dissipation substrate of this embodiment includes an AlSiC substrate 1 , a copper layer 2 and a thermally conductive adhesive 3 . Among them, a plurality of AlSiC substrates 1 are assembled into a plate shape and attached to the copper layer 2, and the gaps between adjacent AlSiC substrates 1 are filled with thermally conductive adhesive 3 to enhance the overall strength. A copper-aluminum spinel eutectic interface is formed between the copper layer and the AlSiC substrate.

[0037] Among them, the AlSiC substrate is an Al-based composite material with SiC as a reinforcing phase. The thickness of the AlSiC substrate is 1 mm, and the thickness of the copper layer is 0.5 mm.

[0038] The preparation method of the copper-clad AlSiC composite heat dissipation substrate of this embodiment includes steps (1) to (5) as described below.

[0039] Step (1), polish one surface of the unpolished AlSiC substrate to ...

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Abstract

The invention discloses a copper-covered ALSiC composite radiating substrate which comprises an ALSiC substrate body and a copper layer attached to the ALSiC substrate body. A copper-aluminum spinel interface is formed between the copper layer and the ALSiC substrate body. The ALSiC composite radiation substrate is simple in structure, good in radiating performance, capable of solving the problem that the radiating substrate body is not matched with thermal expansion of a chip material, capable of preventing an LED chip packaged on the substrate body from being easily disengaged, capable of prolonging the service life of an LED and applicable to manufacturing of low-cost large-power LEDs.

Description

technical field [0001] The invention relates to a heat dissipation substrate of a composite material, in particular to a copper-clad AlSiC composite heat dissipation substrate and a preparation method thereof. Background technique [0002] With the development of LEDs to high power, heat dissipation is a problem that cannot be ignored in the development process of LEDs, which directly restricts the development of LEDs. If the heat dissipation problem of the LED cannot be effectively solved, the working efficiency of the LED will be reduced, the normal light emission of the LED will be affected, and the LED will eventually fail. [0003] Traditional packaging materials include silicon substrates, metal substrates, and ceramic substrates. Silicon and ceramic substrates are difficult to process, high in cost, and low in thermal conductivity; the thermal expansion coefficient of metal materials does not match that of the LED chip substrate material, and thermal stress is prone ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/64
CPCH01L33/005H01L33/641H01L33/642
Inventor 洪晓松李国强张成良刘玫潭凌嘉辉
Owner 惠州雷士光电科技有限公司
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