Easy-to-process graphite fiber AlSiC composite for electronic packaging and preparation method of composite

Abstract

The invention discloses an easy-to-process graphite fiber AlSiC composite for electronic packaging. The composite is prepared from raw materials in parts by weight as follows: 11-13 parts of graphite fibers, 75-78 parts of SiC, 95-100 parts of a 6061 aluminium alloy, 0.4-0.6 parts of aluminum oxide, 4-4.3 parts of phosphoric acid, 13-14 parts of a pore-forming agent, 2-2.5 parts of PVP, a proper amount of dichloromethane, a proper amount of DMF, 1.3-1.5 parts of nano lanthanum borate, 1.3-1.5 parts of BeC, 1.2-1.4 parts of silver-coated TiO2 microspheres, 0.7-0.9 parts of graphite fluoride and 43-45 parts of ethyl alcohol. The graphite fibers are added, a linear heat dissipation path is formed, the heat dissipation performance is better than that of separate point contact of SiC, and the thermal expansion coefficient is further reduced; the BeC, the silver-coated TiO2 microspheres and the graphite fluoride are used, the machinability and the formability of the composite are improved, the size is accurate, and the heat dissipation performance is good.

Description

technical field [0001] The invention relates to the technical field of heat dissipation materials for electronic packaging, in particular to an easy-to-process graphite fiber AlSiC composite material for electronic packaging and a preparation method thereof. Background technique [0002] With the development of microelectronic devices in the direction of high performance, light weight and miniaturization, microelectronics puts forward more and more stringent requirements for packaging materials. AlSiC composite materials have outstanding advantages such as cheap raw materials, high thermal conductivity, and adjustable thermal expansion coefficient, and have been more and more widely used in the field of electronic packaging. In the experiment, ɑ-SiC particles were used as reinforcement, aluminum alloy as matrix, pore forming agent and binder to prepare AlSiC composite materials. The preparation process adopts the process of combining the molding method and the vacuum pressu...

AI Technical Summary

Problems solved by technology

[0003] The obtained AlSiC composite material has good thermal conductivity and small thermal expansion coefficient, but the interface compatibility between SiC and aluminum is not good, and it is easy to separate, so that the performance of the material cannot be stable for a long time. Moreover, the pure granular SiC has a small contact point area and thermal conductivity. Reached the best, need to improve, also need to improve the processability of the material