1200V/50A IGBT power module based on rapid sintering nano-silver soldering paste pressure-free interconnection technology

A rapid sintering and nano-silver technology, which is applied in semiconductor/solid-state device manufacturing, semiconductor/solid-state device parts, electrical components, etc., can solve the problems of automatic production of packaged power semiconductor devices, permanent chip damage, improper pressure selection, etc. problems, achieve excellent thermal cycle fatigue aging resistance, avoid pre-stress damage, reduce contact resistance and thermal resistance

CN109411464AInactive Publication Date: 2019-03-01TIANJIN UNIV
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Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
Publication Date
2019-03-01
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention relates to a 1200V / 50A IGBT power module based on a rapid sintering nano-silver soldering paste pressure-free interconnection technology; a bottom plate adopts a nickel-plated thick copper block or AlSiC; two ceramic copper-clad DBC substrates with the same circuit style are arranged on the bottom plate in a reversed mode; the substrates are connected through a connecting bridge; twogroups of IGBT chips and follow-up diode chip parallel branch groups are in interconnection with the substrates; a double-layer printing variable-temperature preheating solder paste method is adopted, and the chips and the DBC substrates are connected in an instant mode through continuous pulse current auxiliary pressure-free sintering nano-silver solder paste; the sintering connection time is not more than 15 seconds; and then steps of lead bonding, vacuum backflow secondary welding, tube shell mounting, and sealing agent filling are carried out to prepare the IGBT module. Compared with commercial IGBT modules of the same grade, the IGBT module of the invention has high electrical performance, lower thermal resistance and better heat dissipation characteristics, and meanwhile has excellent thermal cycling fatigue aging resistance.
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Description

technical field

[0001] The invention relates to a 1200V / 50A IGBT power module based on rapid sintering nano-silver solder paste non-pressure interconnection technology, belonging to the technical field of packaging of power electronic devices. Background technique

[0002] IGBT modules are widely used in traditional industries such as communications, computers, consumer electronics, automotive electronics, ship drives, aerospace, processing equipment, national defense and military industries, as well as strategic emerging industries such as rail transit, new energy, smart grids, and new energy vehicles. IGBT has become the main power device in the power electronics industry due to its characteristics of low driving power, high input impedance, fast switching speed, small on-state voltage drop, high current carrying density, and high blocking voltage. The use of IGBT for power conversion can improve the efficiency and quality of power consumption, and has the characteristics ...

Examples

example 1

[0034] Example 1: Conduct insulation leakage test on 1200V / 50A IGBT power module based on rapid sintering nano-silver solder paste interconnection technology, static I-V characteristic, dynamic switching characteristic test, basically consistent with the leakage curve of commercial modules of the same level, with the same good electrical performance performance.

example 2

[0035] Example 2: Conduct thermal resistance test on a 1200V / 50A IGBT power module based on rapid sintering nano-silver paste interconnection technology. Compared with commercial modules of the same level, the thermal resistance is reduced by 12%, and it has better heat dissipation characteristics. Under certain conditions, the junction temperature of the IGBT module prepared by current rapid sintering of nano-silver solder paste is lower.

example 3

[0036] Example 3: The 1200V / 50A IGBT power module based on the rapid sintering nano silver solder paste interconnection technology was subjected to high and low temperature impact aging and power cycle aging tests. After 500 cycles of aging, the same level of commercial modules failed. The thermal resistance of the IGBT module prepared by current rapid sintering nano-silver solder paste experienced 1000 cycles of high and low temperature aging shock, and its thermal resistance did not increase significantly. The lifespan of commercial modules of the same level fails after 63K cycles, and the lifespan of IGBT modules prepared by current rapid sintering nano-silver solder paste is 80K cycles.

[0037] The present invention is based on the 1200V / 50A IGBT power module of the rapid sintering nano-silver solder paste pressureless interconnection technology. The sintering connection process does not require additional auxiliary pressure, and the current-assisted pressureless sintering...