Anti-corrosion graphite fiber AlSiC composite for electronic packaging and preparation method of composite

A graphite fiber, electronic packaging technology, applied in circuits, electrical components, electrical solid devices, etc., can solve the problems of poor SiC interface compatibility, material properties can not be lasting and stable, SiC contact point area is small, etc., to improve the interface Compatibility, reduce thermal conductivity anisotropy, improve roughness effect
CN106567020AInactive Publication Date: 2017-04-19HEFEI LONG DUO ELECTRONICS SCI & TECH
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
HEFEI LONG DUO ELECTRONICS SCI & TECH
Publication Date
2017-04-19
Estimated Expiration
Not applicable · inactive patent
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Abstract

The invention discloses an anti-corrosion graphite fiber AlSiC composite for electronic packaging. The composite is prepared from raw materials in parts by weight as follows: 11-13 parts of graphite fibers, 75-78 parts of SiC, 95-100 parts of a 6061 aluminium alloy, 0.4-0.6 parts of aluminum oxide, 4-4.3 parts of phosphoric acid, 13-14 parts of a pore-forming agent, 2-2.5 parts of PVP, a proper amount of dichloromethane, a proper amount of DMF, 1.3-1.5 parts of nano lanthanum borate, 1.5-1.8 parts of flaky carbon powder, 1.1-1.4 parts of nano aluminum hydroxide, 1.6-1.8 parts of germanium diboride and 43-45 parts of ethyl alcohol. The graphite fibers are added, a linear heat dissipation path is formed, and the heat dissipation performance is better than that of separate point contact of SiC; the germanium diboride is used, and the molten metal etching resistance, the active gas corrosion resistance, abrasion resistance and the oxidation resistance of the composite are improved; and the flaky carbon powder and the nano aluminum hydroxide are used cooperatively, and the heat dissipation performance and the strength of the composite are improved.
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Description

technical field

[0001] The invention relates to the technical field of heat dissipation materials for electronic packaging, in particular to a graphite fiber AlSiC composite material for corrosion-resistant electronic packaging and a preparation method thereof. Background technique

[0002] With the development of microelectronic devices in the direction of high performance, light weight and miniaturization, microelectronics puts forward more and more stringent requirements for packaging materials. AlSiC composite materials have outstanding advantages such as cheap raw materials, high thermal conductivity, and adjustable thermal expansion coefficient, and have been more and more widely used in the field of electronic packaging. In the experiment, ɑ-SiC particles were used as reinforcement, aluminum alloy as matrix, pore forming agent and binder to prepare AlSiC composite materials. The preparation process adopts the process of combining the molding method and the vacuum pre...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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