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Anti-corrosion graphite fiber AlSiC composite for electronic packaging and preparation method of composite

A graphite fiber, electronic packaging technology, applied in circuits, electrical components, electrical solid devices, etc., can solve the problems of poor SiC interface compatibility, material properties can not be lasting and stable, SiC contact point area is small, etc., to improve the interface Compatibility, reduce thermal conductivity anisotropy, improve roughness effect

Inactive Publication Date: 2017-04-19
HEFEI LONG DUO ELECTRONICS SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The obtained AlSiC composite material has good thermal conductivity and small thermal expansion coefficient, but the interface compatibility between SiC and aluminum is not good, and it is easy to separate, which causes the performance of the material to be unstable for a long time. Moreover, the contact point area of ​​pure granular SiC is small, and the thermal conductivity is not good. Reached the best, need to improve, also need to improve the corrosion resistance of the material

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0012] A graphite fiber AlSiC composite material for corrosion-resistant electronic packaging, made of the following raw materials in parts by weight (kg): graphite fiber 11, SiC75, 6061 aluminum alloy 95, alumina 0.4, phosphoric acid 4, pore-forming agent 13, PVP2, Appropriate amount of dichloromethane, appropriate amount of DMF, nanometer lanthanum borate 1.3, scale carbon powder 1.5, nanometer aluminum hydroxide 1.1, germanium diboride 1.6, ethanol 43.

[0013] The preparation method of the graphite fiber AlSiC composite material for the corrosion-resistant electronic packaging comprises the following steps:

[0014] (1) According to the volume ratio of dichloromethane:DMF=2:8, it is prepared as a solvent, and PVP is added to prepare a 12wt% solution, and then nano-lanthanum borate is added, and it is magnetically stirred at room temperature for 12 hours, and then sent to the electrospinning device. The flow rate of the solution is set to Set at 0.2ml / h, driving voltage is ...

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PUM

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Abstract

The invention discloses an anti-corrosion graphite fiber AlSiC composite for electronic packaging. The composite is prepared from raw materials in parts by weight as follows: 11-13 parts of graphite fibers, 75-78 parts of SiC, 95-100 parts of a 6061 aluminium alloy, 0.4-0.6 parts of aluminum oxide, 4-4.3 parts of phosphoric acid, 13-14 parts of a pore-forming agent, 2-2.5 parts of PVP, a proper amount of dichloromethane, a proper amount of DMF, 1.3-1.5 parts of nano lanthanum borate, 1.5-1.8 parts of flaky carbon powder, 1.1-1.4 parts of nano aluminum hydroxide, 1.6-1.8 parts of germanium diboride and 43-45 parts of ethyl alcohol. The graphite fibers are added, a linear heat dissipation path is formed, and the heat dissipation performance is better than that of separate point contact of SiC; the germanium diboride is used, and the molten metal etching resistance, the active gas corrosion resistance, abrasion resistance and the oxidation resistance of the composite are improved; and the flaky carbon powder and the nano aluminum hydroxide are used cooperatively, and the heat dissipation performance and the strength of the composite are improved.

Description

technical field [0001] The invention relates to the technical field of heat dissipation materials for electronic packaging, in particular to a graphite fiber AlSiC composite material for corrosion-resistant electronic packaging and a preparation method thereof. Background technique [0002] With the development of microelectronic devices in the direction of high performance, light weight and miniaturization, microelectronics puts forward more and more stringent requirements for packaging materials. AlSiC composite materials have outstanding advantages such as cheap raw materials, high thermal conductivity, and adjustable thermal expansion coefficient, and have been more and more widely used in the field of electronic packaging. In the experiment, ɑ-SiC particles were used as reinforcement, aluminum alloy as matrix, pore forming agent and binder to prepare AlSiC composite materials. The preparation process adopts the process of combining the molding method and the vacuum pre...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C49/06C22C49/14C22C47/08C22C47/06H01L23/29C22C101/10
CPCC22C47/06C22C47/08C22C49/06C22C49/14H01L23/29
Inventor 汪祥王乐平夏运明
Owner HEFEI LONG DUO ELECTRONICS SCI & TECH
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