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Light-emitting diode (LED) packaged on basis of AlSiC composite substrate

A composite substrate and LED chip technology, applied in the direction of electrical components, electrical solid devices, circuits, etc., can solve the problems of poor wettability of metal and ceramics, low reaction ability of metal and ceramics, and high requirements for molding dimensional accuracy, and achieve good Application prospects, greater specific stiffness, and the effect of solving thermal expansion mismatch

Inactive Publication Date: 2013-11-06
SOUTH CHINA UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Among them, the thermal conductivity of the metal core printed circuit board is limited by the insulating layer, the thermal conductivity is low, and on-board packaging cannot be realized; the copper-clad ceramic board adopts a direct bonding method to bond ceramics and metals together, which improves the thermal conductivity. At the same time, the thermal expansion coefficient is controlled in an appropriate range, but the reaction ability of metal and ceramics is low, and the wettability is not good, which makes the bonding difficult, the interface bonding strength is low, and it is easy to fall off; High dimensional accuracy is required, the process is complex, and there are also problems of poor wettability and easy fall off of metal and ceramics

Method used

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  • Light-emitting diode (LED) packaged on basis of AlSiC composite substrate
  • Light-emitting diode (LED) packaged on basis of AlSiC composite substrate

Examples

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Effect test

Embodiment 1

[0019] Such as figure 1 As described, the LED packaged based on the AlSiC composite substrate of this embodiment includes an AlSiC composite heat dissipation substrate 1 plated with an AlN insulating layer 2, two copper film electrodes 3, an LED chip 41, and a gold wire 5.

[0020] The LED chip package is packaged on the AlSiC composite heat dissipation substrate coated with an AlN insulating layer by using a COB (chip on board, COB) packaging process; two copper film electrodes are plated on the AlN insulating layer, and they are connected to each other through gold wires. The positive and negative poles of the LED chip are connected. The thickness of the AlN insulating layer in this embodiment is 2.5 μm, and the LED chip is a single-particle packaged LED chip.

[0021] The manufacturing method of the LED based on the AlSiC composite substrate package of this embodiment is as follows:

[0022] (1) Polish the unpolished AlSiC composite substrate to a mirror surface. After polishing,...

Embodiment 2

[0028] The LED based on the AlSiC composite substrate package of this embodiment is as figure 2 Shown.

[0029] Except for the following features of this embodiment, the remaining features are the same as in Embodiment 1: The thickness of the AlN insulating layer 2 is 3 μm, and the LED chip is a light source module 42 integrated with a multi-particle chip.

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Abstract

The invention discloses a light-emitting diode (LED) packaged on basis of an AlSiC composite substrate. The LED comprises an AlSiC composite radiating substrate coated with an AlN insulating layer, two copper membrane electrodes, an LED chip and golden wires. The LED chip is packaged on the AlSiC composite radiating substrate coated with the AlN insulating layer, the two copper membrane electrodes are plated on the AlN insulating layer and connected with the positive electrode and the negative electrode of the LED chip through the golden wires. The LED packaged on basis of the AlSiC composite substrate is simple in structure, good in radiating performance and long in service life.

Description

Technical field [0001] The invention relates to an LED packaged on a board, in particular to an LED packaged based on an AlSiC composite substrate. Background technique [0002] With the rapid development of LEDs, the power of LEDs is increasing, and unnecessary heat is generated during operation, which directly affects the normal operation of LEDs. If the heat cannot be exported through an effective way, the working efficiency of the LED will be affected, and the LED will eventually fail. Therefore, people put forward more and more stringent requirements for packaging materials. [0003] Traditional packaging materials include silicon substrates, metal substrates and ceramic substrates. Silicon and ceramic substrates are difficult to process, high cost, and low thermal conductivity; the thermal expansion coefficient of metal materials does not match the LED chip substrate material. After the LED has been cycled for many times, thermal stress is likely to occur, causing micro cra...

Claims

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Application Information

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IPC IPC(8): H01L33/48H01L33/64
CPCH01L2224/48091
Inventor 李国强凌嘉辉刘玫潭刘家成
Owner SOUTH CHINA UNIV OF TECH
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